A wireless (e.g., near field or RF) communication device, and methods of manufacturing the same are disclosed. The method of manufacturing the wireless communication device includes forming an integrated circuit on a first substrate, printing stud bumps on input and/or output terminals of the integrated circuit, forming an antenna on a second substrate, and electrically connecting ends of the antenna to the stud bumps. The antenna is configured to (i) receive and (ii) transmit or broadcast wireless signals.

Embodiments are directed to assembling an RED tag through wire bonding techniques. In some examples, the RFID tag may be assembled by wire bonding of an RFID integrated circuit (IC) to an antenna through a hole in a substrate. In other examples, methods for assembling RFID tags from a singulated IC or diced ICs still on a dicing frame may be disclosed. The disclosed methods may use a single metal layer for producing RFID tags with multi-turn loop antenna.

The disclosed transponder arrangement includes adhesive transfer tape and an RF transponder. The adhesive transfer tape includes an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. An antenna is adhered directly to the adhesive layer, and an RF transponder is disposed on the adhesive layer and coupled to the antenna.

An RFID device includes an antenna defining a gap, with an RFID chip electrically coupled to the antenna across the gap. The RFID chip may be incorporated into an RFID strap, in which a pair of connection pads is connected to the RFID chip, with the connection pads connected to the antenna on opposite sides of the gap. Alternatively, the antenna may be connected to bond pads of the RFID chip. At least a portion of the antenna has a cross section with an at least partially curved perimeter. The cross section of the antenna may be differently shaped at different locations, such as having a flattened oval shape at one location and a substantially circular shape at another location. A portion of the cross section of the antenna may have a non-curved, relatively sharp edge, which may break through an outer oxide layer of a connection pad.

The present invention is a method and apparatus for producing ready to use RFID devices in a convenient and economical manner. The apparatus of the present invention may be collocated with a manufacturer of consumer goods.

A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface.

An RFID tag board includes an insulating substrate with an upper surface and a lower surface with a recess, an upper surface conductor on the upper surface of the insulating substrate, a ground conductor on the lower surface of the insulating substrate, the ground conductor being electrically connected to the upper surface conductor by a short-circuit portion through conductor penetrating the insulating substrate in a thickness direction, a capacitance conductor in the insulating substrate, the capacitance conductor facing a portion of the upper surface conductor, a capacitance portion through conductor penetrating the insulating substrate in the thickness direction from the capacitance conductor to the ground conductor, and a first electrode and a second electrode in the recess, the first electrode electrically connected to the capacitance conductor or the ground conductor by a first connection conductor, the second electrode electrically connected to the upper surface conductor via a second connection conductor.

A wireless IC device includes a resin member including first and second surfaces, a substrate including first and second principal surfaces, a coil antenna provided in the resin member, and an RFIC element mounted on the substrate and connected to the coil antenna. The substrate is embedded in the resin member so that the second principal surface is at a second surface side. The coil antenna is defined by first linear conductor patterns on the second surface, first metal posts extending between the first and second surfaces, second metal posts extending between the first and second surfaces, and second linear conductor patterns on the first surface. The RFIC element is disposed in the coil antenna.

Various embodiments of RFID switch devices are disclosed herein. Such RFID switch devices advantageously enable manual activation/deactivation of the RF module. The RFID switch device may include a RF module with an integrated circuit adapted to ohmically connect to a substantially coplanar conductive trace pattern, as well as booster antenna for extending the operational range of the RFID device. The operational range of the RFID switch device may be extended when a region of the booster antenna overlaps a region of the conductive trace pattern on the RF module via inductive or capacitive coupling. The RFID switch device may further include a visual indicator displaying a first color if the RFID switch device is in an active state and/or a second color if the RFID switch device is in an inactive state.

A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas for connection to an antenna of the dual card and a chip, the chip including contact terminals connected by wires to the inner connection areas or electric connecting pads by holes passing through the supporting film while being coated, together with the wires, by coating resin. The electric connecting pads of the outer surface include only three pads. Each of the two inner connection areas forms a comb including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively. Blades extend separately from one another from the body until ends covered by the coating mass.