An RFID device includes an antenna defining a gap, with an RFID chip electrically coupled to the antenna across the gap. The RFID chip may be incorporated into an RFID strap, in which a pair of connection pads is connected to the RFID chip, with the connection pads connected to the antenna on opposite sides of the gap. Alternatively, the antenna may be connected to bond pads of the RFID chip. At least a portion of the antenna has a cross section with an at least partially curved perimeter. The cross section of the antenna may be differently shaped at different locations, such as having a flattened oval shape at one location and a substantially circular shape at another location. A portion of the cross section of the antenna may have a non-curved, relatively sharp edge, which may break through an outer oxide layer of a connection pad.

In some embodiments, a method of manufacturing a radio frequency identification (RFID) tag on a target surface of a non-planar object may be provided. The method may include positioning an antenna on the target surface of the non-planar object, positioning a reactive RFID strap on the target surface, and coupling the reactive RFID strap to the antenna to induce an antenna response.

In aspects, the present invention relates to a wire pad design of a connection pad in a prelam body of a smart card, to a prelam body with at least one such connection pad embedded into a substrate, to a smart card comprising such a prelam body, to a method of forming a wire pad design of a connection pad of a prelam body of a smart card, and to a method of forming a smart card. In some illustrative embodiments, a wire pad design of a connection pad in a prelam body of a smart card is provided, the wire pad design comprising a connection pad wiring pattern formed by plural wire portions extending in a contacting pad plane, and a bridging wire portion which at least partially extends outside the contacting pad plane. The bridging wire portion electrically and mechanically connects at least some of the plural wire portions with each other.

An RFID tag board includes an insulating substrate with an upper surface and a lower surface with a recess, an upper surface conductor on the upper surface of the insulating substrate, a ground conductor on the lower surface of the insulating substrate, the ground conductor being electrically connected to the upper surface conductor by a short-circuit portion through conductor penetrating the insulating substrate in a thickness direction, a capacitance conductor in the insulating substrate, the capacitance conductor facing a portion of the upper surface conductor, a capacitance portion through conductor penetrating the insulating substrate in the thickness direction from the capacitance conductor to the ground conductor, and a first electrode and a second electrode in the recess, the first electrode electrically connected to the capacitance conductor or the ground conductor by a first connection conductor, the second electrode electrically connected to the upper surface conductor via a second connection conductor.

The invention relates to an external connector for the production of an electronic card comprising an insulating support that defines an outside face and an inside face opposite one another and a plurality of external metal contact pads. This external connector additionally comprises a plurality of metal projections located on the side of the inside face of the insulating support and respectively connected electrically to at least one subassembly of the plurality of external metal contact pads and/or to contact pads linked to an electronic unit, which is arranged on the inside face of the insulating support, wherein these metal projections are intended to be inserted into individual cavities of the body of the electronic card, and metal contact pads linked to an electronic unit inside the card body and/or an antenna incorporated in this card body are located at the base of these cavities. The invention also relates to a process for the production of an electronic card using the aforementioned external connector.

[Object] To provide an electric circuit, a communication device, and a method for manufacturing the electric circuit to maintain or improve connection reliability while suppressing increase in manufacturing costs. [Solution] The electric circuit includes a connecting unit that electrically connects an antenna coil and an integrated circuit (IC) chip. The connecting unit includes a first partial connecting unit that is electrically connected to the antenna coil, and a second partial connecting unit that is electrically connected to the first partial connecting unit and the IC chip to be arranged and that is made of a material different from a material of the first partial connecting unit.

A method of forming a contactless transaction card. The method may include providing a card body, defining a window, and attaching an antenna assembly layer to the card body, where the antenna assembly layer includes an antenna, a set of curable connectors, disposed on a set of end regions of the antenna within the window, and a UV-transparent layer, supporting the antenna. The method may include providing a contactless chip module within the window on a first side of the antenna assembly layer, and directing radiation through the UV-transparent layer, wherein the contactless chip module is electrically connected to the antenna via the curable connectors.

The fabrication of an electronic document includes the following steps: obtaining of a flat body in which is made a cavity of globally rectangular shape including a deep portion surrounded by a countersink and which contains an electronic component having connection terminals situated on this countersink while having the shape of meanders 5A, 5B, obtaining of a module including a support furnished on a so-called external face with a plurality of external contact zones and on a so-called internal face with a printed circuit including connection pads 4A, 4B of hefty form while being connected to certain at least of the external contact zones, the support being furthermore furnished, on this internal face, with a microcircuit connected to this printed circuit, this module being encased in the cavity by an anisotropic conducting adhesive whose overlap coefficient lies between 5 and 8%.

The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.

A multilayer wiring coupling dual interface card carrier tape module is provided, including: a carrier tape base layer, an electrode diaphragm layer, a tuning capacitance layer, a radio-frequency identification coil layer, a bonding pad and a via hole. One surface of the carrier-band base layer is the front surface of the carrier-band module, and the other surface of the carrier-band base layer is the back surface of the carrier-band module. The electrode diaphragm layer and the tuning capacitance layer are located on the front surface of the carrier-band base layer, and the radio-frequency identification coil layer and the bonding pad are located on the back surface of the carrier-band base layer. The bonding pad is arranged according to a pin position of a chip. Hole metallization processing is conducted on the via hole for realizing an electrical connection between the electrode diaphragm layer and the bonding pad.