RFID inlays or straps may be assembled using impulse heating of metal precursors. Metal precursors are applied to and/or included in contacts on an RFID IC and/or terminals on a substrate. During assembly of the tag, the IC is disposed onto the substrate such that the IC contacts physically contact either the substrate terminals or metal precursors that in turn physically contact the substrate terminals. Impulse heating is then used to rapidly apply heat to the metal precursors, processing them into metallic structures that electrically couple the IC contacts to the substrate terminals.

A system for detecting the depth of an antenna embedded in the card body of a smart card includes a milling device for forming a cavity in the card body, a test device disposed in close proximity to the card body, a vector network analyzer (VNA) for measuring a linear characteristic of the test device, and a control device for regulating operation of the milling device in view of data collected by the VNA. In use, the VNA generates a test signal and measures the degree of signal reflection from the test device. Under normal conditions, the VNA observes a spike in forward return loss at the natural resonant frequency of the open antenna circuit. However, at the instant that the milling device contacts the antenna, a notable variance in the degree of signal reflection is observed which indicates that the proper antenna depth has been reached.

An RFIC device including a resin block having a first surface, a second surface that faces the first surface, and a through-hole that extends through the first surface and the second surface. Moreover, the RFIC device includes an RFIC element that is embedded in the resin block and a coil antenna disposed in the resin block that is connected with the RFIC element and that has a central axis that extends from the first surface to the second surface. In addition, the through-hole extends inside the coil antenna.

An ultrahigh frequency RFID tag antenna with multi-infeed includes an antenna assembly, a baseboard, and a ground plane. The baseboard is located above the ground plane. The antenna assembly is electrically connected to the ground plane. The antenna assembly includes a radiated element, a number of microstrip lines, and a number of tag chips. Each of the tag chips is connected between each two microstrip lines, thereby a microstrip feed loop is formed by each of the tag chips and the each two microstrip lines.

A multilayer wiring coupling dual interface card carrier tape module is provided, including: a carrier tape base layer, an electrode diaphragm layer, a tuning capacitance layer, a radio-frequency identification coil layer, a bonding pad and a via hole. One surface of the carrier-band base layer is the front surface of the carrier-band module, and the other surface of the carrier-band base layer is the back surface of the carrier-band module. The electrode diaphragm layer and the tuning capacitance layer are located on the front surface of the carrier-band base layer, and the radio-frequency identification coil layer and the bonding pad are located on the back surface of the carrier-band base layer. The bonding pad is arranged according to a pin position of a chip. Hole metallization processing is conducted on the via hole for realizing an electrical connection between the electrode diaphragm layer and the bonding pad.

The invention relates to a transponder layer (10), in particular for producing a chip card, having an antenna substrate (12), which, on an antenna side (11), is equipped with an antenna (14) formed from a wire conductor (13), and has a chip accommodation which is formed by a recess in the antenna substrate and in which a chip (21) is accommodated, wherein wire conductor ends, which serve to form terminal ends (15) of the antenna, are formed at a bottom (20) of the chip accommodation which is recessed with respect to the rear side (26) of the antenna substrate (12), and the chip is accommodated in the chip accommodation in such a manner that terminal contacts (22) arranged on a contact side (36) of the chip are contacted with flat contact portions (19) of the terminal ends (15), and the chip is arranged with the rear side (27) of its semiconductor body (28) facing the terminal contacts substantially flush with the rear side of the antenna substrate. Furthermore, the invention relates to a method for producing a transponder layer.

In a method of producing a transponder (T1, T2, T3), a substrate (1, 91) is provided. The substrate (9, 91) comprises a first area (2), a second area (3) adjacent to the first area (2), and a first electric contact (8, 98) adjacent to the second area (3). An electric device (50, 80) is placed in or on the first area (2), preferably without touching the first electric contact (8, 98). Subsequently, a conductive glue (12) is applied on the second area (3) and on the first electric contact (8, 98) so that the conductive glue (12) electrically couples the first electric contact (8, 98) with the electric device (50, 80).

A multilayer body with a carrier and a layer arranged thereon which comprises electrically conductive material in such an arrangement comprises an information area and a background area (18) which are galvanically separated from each other. In each information area a first zone (10) with electrically conductive material is provided, over the entirety of which electrically conductive material is conductively connected to it. In each background area a plurality of second zones with electrically conductive material is provided, which are galvanically separated from each other. Each first zone (10) preferably occupies a surface area that is at least five times larger than each of the second zones. The electrically conductive material is preferably provided with an average surface coverage which varies over all information areas and background areas (18) by less than 25%. A homogeneous appearance of the multilayer body is thereby ensured, and an item of information provided in the information area, provided by the shape, size and/or alignment of the first zone, is not visible without aids, and therefore cannot be copied.

A chip card manufacturing method. A module includes a substrate supporting contacts on one surface and conductive paths and a chip on another; and an antenna on a holder, the antenna including a contact pad for respectively connecting to each of the ends thereof. A solder drop is placed on each of the contact pads of the antenna. The holder of the antenna is inserted between plastic layers. A cavity is provided, in which the module can be accommodated and the solder drops remain accessible. The height of the solder drops before heating is suitable for projecting into the cavity. A module is placed in each cavity. The areas of the module that are located on the solder drops are heated to melt the solder and to solder the contact pads of the antenna to conductive paths of the module.

Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.