A dual interface transaction card for contact and contactless transactions including an anodized top metal layer. The arrangement of layers allowing for high conductivity metals such as aluminum to be used without compromising the contactless function of the card.

Metal containing transaction cards or smartcards (SC) having a slit (S) formed in a metal layer (ML) or metal card body (MCB) which extends from a perimeter edge of the card body to a transponder chip module (TCM), wherein the path of the slit (S) extends to an area underneath a module antenna (MA) of the TCM. The slit (S) does not reach a module opening (MO) for the transponder chip module (TCM). The slit enters the area of the module antenna (MA) overlapping its windings or tracks and follows the form and path of the module antenna (MA). In some embodiments, the module opening (MO) may be omitted. The shape of the module opening (MO) may be other than rectangular, and it may have at least two parallel sides.

A smartcard comprising: a plurality of smartcard substrate layers; an antenna layer comprising an antenna; a fingerprint sensor module embedded in the smartcard and connected to the antenna layer, the fingerprint sensor module being configured to receive energy and communicate with a reading device via the antenna, and wherein the fingerprint sensor module is galvanically isolated from an outside of the smartcard.

Radio frequency identification (RFID) tags are described that include a substrate, an antenna disposed on a major surface of the substrate, an integrated circuit (IC) disposed on a major surface of the substrate, and one or more stand-alone capacitors disposed on a major surface of the substrate. The antenna may have a length less than about 2 meters between first and second ends of the antenna. The integrated circuit may have an effective capacitance less than about 1000 pF and the one or more stand-alone capacitors may have an equivalent capacitance greater than 500 pF and may be connected in parallel with the antenna and the IC.

The invention relates to a process for manufacturing a roll of flexible carrier bearing electronic components. This process includes a step consisting in adding, to this flexible carrier, electronic components, themselves manufactured from a roll of flexible initial substrate. For example, the electronic components may be manufactured on an initial substrate having a width allowing advantage to be taken of densification of the manufacture of the components on this initial substrate. Subsequently, the singulated electronic components are added to the flexible carrier, allowing, for example, packaging that is more suitable, than possible with the initial substrate, to a use of the electronic components, notably when the latter must be integrated into a chip-card. Thus, for example, the flexible carrier may be, or include, an adhesive, which may or may not be conductive, and which is used to fasten, and optionally connect, each electronic component to a chip-card.

A radio frequency identification (RFID) switch tag is disclosed. This RFID switch tag includes a base component having an ultra-high frequency (UHF) booster, and a detachable component having at least one UHF RFID module and a high frequency (HF) RFID module. In some embodiments, the detachable component is positioned in close proximity to the base component in a first configuration of the RFID switch tag such that the at least one UHF RFID module is sufficiently coupled to the UHF booster in the base component to form an UHF RFID system having a desired performance. The detachable component can also be separated from the base component to obtain a second configuration of the RFID switch tag, and the HF RFID module remains functional within the detached detachable component so that the detachable component can be used as a standalone HF RFID tag.

A method of forming a contactless transaction card. The method may include providing a card body, defining a window, and attaching an antenna assembly layer to the card body, where the antenna assembly layer includes an antenna, a set of curable connectors, disposed on a set of end regions of the antenna within the window, and a UV-transparent layer, supporting the antenna. The method may include providing a contactless chip module within the window on a first side of the antenna assembly layer, and directing radiation through the UV-transparent layer, wherein the contactless chip module is electrically connected to the antenna via the curable connectors.

Apparatus and method for producing contact, contactless and dual-interface metal transaction cards that provides enhanced durability and aesthetics, with increased production efficiency. The cards may include (i) a metal core subassembly comprising a metal layer or layers (metal inlay) having a slit (S) allowing for contactless functionality, and (ii) a UV hard coat on a release-carrier layer disposed on one or both sides of the metal core subassembly, and (iii) everything may be laminated together in a single step, providing a metal face smartcard. The hard coat provides a durable, scratch-resistant surface, and protects underlying layers while allowing the passage of a laser beam to write on or within the underlying layer(s), such as a transparent laser-reactive layer. Techniques for hiding or camouflaging the slit provide a more aesthetically pleasing appearance to the metal transaction card.

A Radio Frequency Identification (RFID) integrated circuit (IC) is at least partially covered by a repassivation layer that is, in turn, at least partially covered by a large, electrically conductive contact pad. The repassivation layer is disposed so as to leave uncovered at least one IC contact. The large contact pad is disposed so as to cover the IC IC contact. The large contact pad forms a first galvanic coupling to the IC contact and a second galvanic coupling to a tag antenna. The surface area of the first galvanic coupling is substantially smaller than the surface area of the second galvanic coupling.

A modular RFID device includes a modular circuit pad, a modular transmission pad, and a device connection layer. The modular circuit pad includes a processing circuit to process data, the processing circuit having circuit electrical contacts. The modular transmission pad includes a transmission circuit to wirelessly transmit the data, the transmission circuit having transmission electrical contacts connected to the circuit electric contacts and over which the data is received from the modular circuit pad. The device connecting layer is between the modular circuit pad and the modular transmission pad and is separate from the transmission and circuit electrical contacts to attach the modular circuit pad with the modular transmission pad.