An RFID device includes a substrate and a lead frame secured to the substrate. The lead frame includes a pair of connection pads formed of a conductive material. An RFID chip and an antenna are electrically coupled to the lead frame. The width of the lead frame is substantially equal to the height of the lead frame. The connection pads of the lead frame may be oriented, among other options, along a direction parallel to a height of the substrate or along a direction parallel to a width of the substrate.

Radio frequency identification (RFID) systems for use with tires include a stud comprising reactive strap technology including an RFID chip and conductor. The stud is configured so as to be connected to a tire and to provide near field communication. The stud also may be coupled to an antenna structure to provide a far field RFID tag. The stud may unintentionally move with respect to the antenna structure during use, so the antenna structure may be configured to accommodate such movement without a change in the tuning of the RFID tag. A multi-antenna label may be provided to allow for selective coupling of the stud to a particular antenna, with differently configured tires being coupled to different antennas of the same type of multi-antenna label, which allows for the same label configuration to be used with a wider variety of tires.

A combined EAS and RFID circuit includes an HF coil antenna, a UHF tuning loop, and an RFID chip coupled to a strap that includes a first coupling area and a second coupling area. The coil ends of the HF coil antenna are configured to capacitively and/or conductively couple to one or both of the first coupling area or second coupling area of the strap. The HF coil antenna can include a gap between turns for non-interfering placement of the UHF tuning loop. The EAS circuit can be deactivating upon application of a field at the resonant frequency of sufficient intensity to cause the breakdown voltage to be exceeded between a coil end and coupling area. The threshold breakdown voltage between a coil end and a coupling area can be reduced by laser ablation treatment of a conductive surface of one or both of the coil end or coupling area.

A chip packaging structure includes a chip module and a main body, wherein the main body has a first portion, a second portion, and a holding portion. The second portion protrudes from the first portion, and a size of the second portion is less than a size of the first portion. The holding portion is located at the second portion, and the chip module is placed at the holding portion to be engaged with the main body.

Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).

A sensor device is provided that includes a fingerprint sensor and an antenna coupled with the fingerprint sensor for inductive coupling of the fingerprint sensor with a booster antenna.

A method of incorporating a second conductor into a RFID strap device and the resulting device in multiple embodiments is disclosed. The second conductor adds functionality via coupling between the strap conductor and the second conductor. The functionality added can be a secondary antenna operating at a different frequency than the first antenna that is driven by the strap pads, a sensing capability, a drive for an emissive device such as an LED, or an interface to one or more semiconductor devices mounted onto the second conductor.

A method for operating a microradio is provided. The method includes storing first parasitic energy received during a first charging cycle, powering a receiver with the stored first parasitic energy during a listening period, receiving a wireless control signal during the listening period, storing second parasitic energy received during a second charging cycle, selectively powering a transmitter with the stored second parasitic energy, and transmitting a signal responsive to the received wireless control signal.

Systems and methods for integrating tags with items. The methods comprise: dynamically determining a length of each metal thread to be incorporated into or trace to be disposed on a item to optimize tag performance in view of dielectric and tuning properties of the item. In the metal thread scenarios, the methods also involve: creating a metal thread having the length that was dynamically determined; and sewing the metal thread into the item being produced to form an antenna for a first tag. In the trace scenarios, the methods also involve forming the trace on the item being produced to form an antenna for a first tag. Next, at least a communications enabled device is attached to the item so as to form an electrical coupling or connection between the communications enabled device and the at least one antenna.

A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.