This RFID tag comprises: a film wiring substrate including a flexible base material having a first surface and a second surface located opposite to the first surface, and conductors located on the first and second surfaces, respectively; and an RFIC IC connected to the conductors, wherein the film wiring substrate is bent, and at least a first conductor part included in the conductor on the first surface, a second conductor part included in the conductor on the first surface or the second surface, and a conductor on the second surface that does not include the second conductor part overlap each other.

An IC tag in which precision reduction is suppressed and which is compact and manufactured easily, and a manufacturing method of IC tag are provided. The IC tag has: antennas disposed on one surface of a substrate; a capacitor which includes a dielectric and first and second electrodes disposed on one surface of the substrate, and in which an electrostatic capacitance changes irreversibly corresponding to changes in ambient environment; and an IC chip which detects the electrostatic capacitance of the capacitor via a pair of external terminals to which the first and second electrodes are respectively connected, and wirelessly transmits information based on a detection result via the antennas.

Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).

A wireless communication device is provided that includes an RFIC module in which an RFIC chip and first and second terminal electrodes are incorporated, and an antenna member including an antenna base material and antenna patterns including first and second coupling portions. The RFIC module and the antenna member are bonded to each other via an insulating first adhesive layer. Between the first terminal electrode and the first coupling portion and between the second terminal electrode and the second coupling portion, a distance t1 from a surface of the RFIC module in contact with the first adhesive layer to the first and second terminal electrodes is larger than a thickness t2 of the first adhesive layer.

An RFID tag includes an RFID IC, flexible substrates including first wiring conductors and rigid substrates including second wiring conductors. Substrate surfaces of the flexible substrates include first regions connected to the rigid substrates and second regions that include opposite surfaces and are not connected to the rigid substrates. First conductor portions and second conductor portions included in the first wiring conductors are electrically connected to each other via the second wiring conductors. The RFID IC is connected to the first wiring conductors, the second wiring conductors, or both the first wiring conductors and the second wiring conductors.

A Radio Frequency Identification (RFID) tag is disclosed. The RFID tag includes an antenna to receive a high frequency signal, a capacitor bank coupled with the antenna, a charge pump coupled with the antenna configured to convert the high frequency signal to a direct current (DC) signal, an envelope detector to measure peak voltage of the high frequency signal and a detector to compare an output of the charge pump and an output of the envelope detector. The RFID tag also includes an impedance tuning circuit coupled with the charge pump and the envelope detector configured change a capacitance of the capacitor bank based on an output of the detector and the envelope detector.

A combined EAS and RFID circuit includes an HF coil antenna, a UHF tuning loop, and an RFID chip coupled to a strap that includes a first coupling area and a second coupling area. The coil ends of the HF coil antenna are configured to capacitively and/or conductively couple to one or both of the first coupling area or second coupling area of the strap. The HF coil antenna can include a gap between turns for non-interfering placement of the UHF tuning loop. The EAS circuit can be deactivating upon application of a field at the resonant frequency of sufficient intensity to cause the breakdown voltage to be exceeded between a coil end and coupling area. The threshold breakdown voltage between a coil end and a coupling area can be reduced by laser ablation treatment of a conductive surface of one or both of the coil end or coupling area.

An RFID tag is provided that includes a first planar conductor having a first opening, a second planar conductor partially or entirely facing the first planar conductor and having a second opening, an RFIC, a capacitor, and an inductor. The RFIC, the capacitor, and the inductor form a part of a current closed loop. Moreover, the first opening and the second opening have sizes that do not come into contact with a metal screw inserted into the first opening and the second opening. The first opening is located closer to a center than to an edge of the first planar conductor, and the second opening is located closer to a center than to an edge of the second planar conductor.

An RFID tag manufacturing system is provided that includes a conveyance device that conveys a base sheet provided with a plurality of antenna patterns to each of which an RFIC module is fixed. The system includes a laminating device that attaches a cover seal on the base sheet to cover the antenna patterns and a punching device that produces RFID tags by punching the cover seal and the base sheet with a punching blade that includes a frame-shaped cutting edge surrounding the antenna patterns to form a frame-shaped cut. The base sheet includes alignment mark in a non-attachment part of the cover seal. The punching device specifies the position of each of the antenna patterns covered with the cover seal based on the alignment mark, and punches the cover seal and the base sheet based on the specified position of the antenna pattern.

Disclosed herein is an antenna device that includes a substrate, a conductor pattern formed on the substrate, and a magnetic sheet formed on the substrate. The conductor pattern includes a spiral or loop-shaped antenna coil and a spiral or loop-shaped coupling coil connected to the antenna coil and having a diameter smaller than that of the antenna coil. The antenna coil overlaps the magnetic sheet. The magnetic sheet has a first opening at a position overlapping the coupling coil such that an inner diameter area of the coupling coil completely overlaps the first opening in a plan view.