An IC tag in which precision reduction is suppressed and which is compact and manufactured easily, and a manufacturing method of IC tag are provided. The IC tag has: antennas disposed on one surface of a substrate; a capacitor which includes a dielectric and first and second electrodes disposed on one surface of the substrate, and in which an electrostatic capacitance changes irreversibly corresponding to changes in ambient environment; and an IC chip which detects the electrostatic capacitance of the capacitor via a pair of external terminals to which the first and second electrodes are respectively connected, and wirelessly transmits information based on a detection result via the antennas.

An electric handheld power tool, including a data memory and a data interface signal-connected to the data memory, via which tool-related data may be read out from the data memory with the aid of a terminal, the data interface including a system antenna for wireless radio data transmission, and the electric handheld power tool including an amplifier antenna which is different from the system antenna, the amplifier antenna being magnetically coupled with the system antenna and preferably mounted on or in the direct vicinity of the system antenna.

A combined EAS and RFID circuit includes an HF coil antenna, a UHF tuning loop, and an RFID chip coupled to a strap that includes a first coupling area and a second coupling area. The coil ends of the HF coil antenna are configured to capacitively and/or conductively couple to one or both of the first coupling area or second coupling area of the strap. The HF coil antenna can include a gap between turns for non-interfering placement of the UHF tuning loop. The EAS circuit can be deactivating upon application of a field at the resonant frequency of sufficient intensity to cause the breakdown voltage to be exceeded between a coil end and coupling area. The threshold breakdown voltage between a coil end and a coupling area can be reduced by laser ablation treatment of a conductive surface of one or both of the coil end or coupling area.

A method for generating a time-dependent signal on a capacitive surface sensor is provided and a method for identifying a card-like object, as well as a card-like object and the use thereof are also provided.

An RFID system with an RFID chip and a transmitting and/or receiving antenna that are applied onto a substrate material for sending and/or receiving electromagnetic waves. The transmitting and/or receiving antenna is formed by only a single electrically conductive thread that forms a linear, non-intersecting structure. A segment of the electrically conductive thread loops around the RFID chip without touching it across an angle of at least 180, by which a capacitive coupling is effected between the RFID chip and the transmitting and/or receiving antenna. The invention further relates to a method for producing an RFID system.

An RF tag circuit connected to an antenna and a load is provided. The RF tag circuit includes: a rectification circuit rectifying a radio wave received by the antenna and supplying DC power; a matching circuit having a changeable impedance and disposed between the antenna and the rectification circuit; a control part repeatedly controlling activation and stopping of the load; and an adjustment part changing the impedance of the matching circuit in a predetermined direction, storing a first electric power generated by the rectification circuit when a predetermined time has elapsed after the load is activated, and changing the impedance of the matching circuit based on a magnitude relationship between a second electric power generated by the rectification circuit when the predetermined time has elapsed after the load is activated at a timing after the first electric power is generated and the stored first electric power.

Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).

Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

An RFID assembly (10) includes an RFID chip (14) having a coupling loop (15) formed as part of the RFID chip (14). In this manner, the RFID chip (14) can be inductively coupled to a far-field antenna (16) for RFID communications, without any physical connections between the RFID chip (14) and the coupling loop (15) and/or the far-field antenna (16). This results in a high temperature resistance of the RFID assembly (10), which can be advantageously used, in particular, during tracking of parts in assembly processes requiring higher temperatures.

Dual-mode RFID devices are provided with an integrated dual-mode RFID strap including either a UHF/HF dual-mode RFID chip or the combination of a UHF RFID chip and an HF RFID chip. An HF antenna and a UHF antenna are both coupled to the integrated dual-mode RFID strap, with the UHF antenna being formed by an approach other than etching, such as a cutting or printing operation, thereby reducing the cost to manufacture the device. If a pair of chips is employed, one of the chips may have a greater thickness than the other chip, which allows for the thicker chip to be incorporated into the device after the thinner chip without requiring a minimum separation between the two chips due to the size of a thermode used to secure the chips. Additionally, the first chip may be tested before securing the second chip, thereby limiting the cost of a rejected device.