A wafer-level package sensor device including a capacitive sensor, a controller which is electrically conductively connected to the sensor, wherein the capacitive sensor is formed by partially overlapping redistribution layer tracks of the wafer-level package sensor device formed in different planes, and multiple contact surfaces connected to the controller, which are configured to electrically couple to a chip card module carrier using a flip-chip connection.

An RFID tag manufacturing system is provided that includes a conveyance device that conveys a base sheet provided with a plurality of antenna patterns to each of which an RFIC module is fixed. The system includes a laminating device that attaches a cover seal on the base sheet to cover the antenna patterns and a punching device that produces RFID tags by punching the cover seal and the base sheet with a punching blade that includes a frame-shaped cutting edge surrounding the antenna patterns to form a frame-shaped cut. The base sheet includes alignment mark in a non-attachment part of the cover seal. The punching device specifies the position of each of the antenna patterns covered with the cover seal based on the alignment mark, and punches the cover seal and the base sheet based on the specified position of the antenna pattern.

An IC tag is provided that reduces the size of a folded dipole antenna. The IC tag includes an IC chip and an antenna electrically connected with the IC chip. The antenna has a first linear portion, bent portions at both ends of the first linear portion, and second linear portions extending from the bent portions on both ends of the first linear portion, distal ends of the second-straight line portions face each other. Bent space portions are at both sides of space defined by the bent portions on both ends of the first linear portion, the first linear portion, and the second linear portions. A communication enhancer that tunes a resonant frequency to a desired frequency is provided near the distal ends of the second linear portions and provided at least inside or outside of space extending from one bent space portion to the other bent space portion.

An RFID device includes an antenna defining a gap, with an RFID chip electrically coupled to the antenna across the gap. The RFID chip may be incorporated into an RFID strap, in which a pair of connection pads is connected to the RFID chip, with the connection pads connected to the antenna on opposite sides of the gap. Alternatively, the antenna may be connected to bond pads of the RFID chip. At least a portion of the antenna has a cross section with an at least partially curved perimeter. The cross section of the antenna may be differently shaped at different locations, such as having a flattened oval shape at one location and a substantially circular shape at another location. A portion of the cross section of the antenna may have a non-curved, relatively sharp edge, which may break through an outer oxide layer of a connection pad.

A measuring device for measuring a physical quantity includes a sensor arrangement connected by a signal conductor to an amplifier arrangement. The sensor arrangement generates a measurement signal and includes an RFID transponder. The amplifier arrangement includes an RFID write and read device that is capacitively coupled to the RFID transponder. Data for transmission via the signal conductor are modulated onto high-frequency electrical signals.

In some embodiments, an RFID device includes a reactive strap having an RFID chip and a conductive ring connected to the RFID chip. The RFID device may further include an antenna configured to be coupled to the reactive strap, and a tuning block set positioned in the vicinity of the reactive strap, a resonant frequency of the RFID device being determined at least in part by at least one of the shape of the tuning block set and the position of the tuning block set relative to at least the reactive strap.

A chip packaging structure includes a chip module and a main body, wherein the main body has a first portion, a second portion, and a holding portion. The second portion protrudes from the first portion, and a size of the second portion is less than a size of the first portion. The holding portion is located at the second portion, and the chip module is placed at the holding portion to be engaged with the main body.

An insert for a chip card includes a body provided with a cavity in which is inserted an electronic module provided with a microelectronic chip connected to an inductive or capacitive coupling. The body has a stack of layers at least a first layer of which comprises a first booster antenna and a second layer of which comprises a second booster antenna, the various booster antennas being coupled together inductively and/or capacitively, and at least one of the booster antennas being coupled inductively and/or capacitively with the coupling of the module. The body furthermore comprises at least one metal plate disposed between two layers of ferrite, the first and second booster antennae and the metallic plate being arranged in such a way that at least one of the two booster antennas and the electronic module remain coupled together inductively and/or capacitively, despite the presence of the metal plate.

An electric handheld power tool, including a data memory and a data interface signal-connected to the data memory, via which tool-related data may be read out from the data memory with the aid of a terminal, the data interface including a system antenna for wireless radio data transmission, and the electric handheld power tool including an amplifier antenna which is different from the system antenna, the amplifier antenna being magnetically coupled with the system antenna and preferably mounted on or in the direct vicinity of the system antenna.

An RFID device includes an antenna defining a gap, with an RFID chip electrically coupled to the antenna across the gap. The RFID chip may be incorporated into an RFID strap, in which a pair of connection pads is connected to the RFID chip, with the connection pads connected to the antenna on opposite sides of the gap. Alternatively, the antenna may be connected to bond pads of the RFID chip. At least a portion of the antenna has a cross section with an at least partially curved perimeter. The cross section of the antenna may be differently shaped at different locations, such as having a flattened oval shape at one location and a substantially circular shape at another location. A portion of the cross section of the antenna may have a non-curved, relatively sharp edge, which may break through an outer oxide layer of a connection pad.