The invention relates to a chip card with a dual, contactless and contact-based communication interface, comprising a card body made up of two metal sheets and an electronic module provided with a terminal block and an antenna designed for radio-frequency communication with the antenna of a remote reader. The electronic module includes an active communication circuit powered by a battery in the chip card, and configured to generate a carrier signal capable of interacting with the carrier signal emitted by a remote contactless reader in order to establish active radio-frequency communication between the chip card and the remote reader.

A secure RFID device is provided. The RFID device includes a switch module mounted in a recess of a device body. The switch module includes a switching portion configured to electrically connect terminal ends of an RFID antenna embedded in the switch body. In particular, forming the recess and mounting the switch module including the switching portion to the RFID device after final lamination of the same allows for the use of manufacturing techniques that result in RFID cards having high durability and required ISO qualities.

A method for manufacturing a metal card includes: a step for forming a metal card by laminating a stack of sheets in which are stacked a plurality of sheets, centered on a metal sheet, including adhesive sheets having the same size as the metal sheet, an upper inlay sheet having a first antenna, and a lower inlay sheet having a second antenna; a step for forming a COB accommodation space, which can accommodate a COB, by milling a certain area of the metal card using computerized numerical control (CNC) machining; a step for forming a through-hole, which exposes the first antenna and the second antenna, by milling a COB contact point region of the COB accommodation space down to the lower inlay sheet; a step for electrically connecting the first antenna and the second antenna by dispensing a conductive elastic liquid into the through-hole; and a step for bidirectionally connecting the first antenna and the second antenna to the COB by attaching the COB within the COB accommodation space so that the COB contact point is connected by the conductive elastic liquid.

A chip card body including a metal plate having at least one slot which defines a current flow path on the metal plate, and having a coupling region to accommodate a chip with an antenna, wherein the coupling region is configured to inductively couple the metal plate to the antenna of the chip, a dielectric layer applied to the metal plate, an electrically conductive layer applied to a side of the dielectric layer opposite the metal plate, and at least one electrically conductive coupling between the metal plate and the electrically conductive layer, wherein the metal plate, the dielectric layer and the electrically conductive layer form a capacitor.

Manufacturing antennas for a dual tag by: providing a web structure having a dielectric layer between a first metal layer and a second metal layer; depositing a first resist on the first metal layer to define a radio frequency (RF) coil and a first electrode of an RF capacitor; depositing the first resist on the second metal layer to define a second electrode of the RF capacitor; depositing a second resist on the second metal layer to define connection pads for a near field antenna, wherein one of the first resist and the second resist on the second metal layer defines a far field antenna and the near field antenna; and etching the first and second metal layers to form the RF coil, the electrodes of the RF capacitor, the far field antenna, the near field antenna, and the connection pads.

A method for inserting a wire into a longitudinal groove of a semiconductor chip for the assembly thereof, the groove containing a pad made of a bonding material having a set melting point, comprises: in a positioning step, placing a longitudinal section of the wire along the groove, in forced abutment against the pad; and, in an insertion step, exposing a zone containing at least one portion of the pad to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad at least partially melt, and causing the wire to be inserted into the groove. The present disclosure also relates to a piece of equipment allowing the insertion method to be implemented.

A smart IC substrate according to an embodiment includes: a substrate including one surface and the other surface; a circuit pattern and a connection circuit pattern disposed on the one surface; and a coil pattern disposed on the other surface, wherein a chip mounting region is formed on the other surface, the coil pattern is electrically connected to a first terminal and a second terminal, the substrate includes a first region disposed inside the coil pattern and a second region disposed outside the coil pattern, the first terminal is disposed in the first region, the second terminal is disposed in the second region, a first via is formed in the first region corresponding to the circuit pattern of the substrate, a second via is formed in the second region of the substrate, a third via is formed in the first region corresponding to the connection circuit pattern of the substrate, and a connection member is disposed inside the second via.

A system and a method for inspecting components of a turbojet engine using RFID tags and an associated interrogator device. The inspection system includes at least one RFID tag associated with a component of the turbojet engine and an interrogator device arranged so as to be able to communicate with the RFID tag, the interrogator device being equipped with an RFID antenna arranged so as to be able to be inserted into a nacelle compartment of the turbojet engine through an inspection opening intended for the passage of an endoscope probe.

A cable-tie carrier is disclosed herein that includes a chip holder with a recess cavity for holding an electronic chip and a cable that is removably attached to the chip holder. The electronic chip stores identification information or testing data that may be used to identify and track the part. External computing devices (e.g., smart phone, tablet, scanner) may access the stored identification information or testing data for a user. The electronic chip is fastened, magnetically attached, or stuck with adhesive to the chip holder to position a transmitter (or antenna) to face out of the recess cavity.

Provided is an NFC antenna module which connects a side cover (i.e. metal frame), which is formed at one side of a portable terminal, to the antenna pattern so that the side cover is operated as an auxiliary radiator of an antenna pattern. The presented NFC antenna module comprises: a side cover made of a metal material and coupled to one side of the portable terminal; an antenna pattern having one end connected to a short-range communication chipset embedded in the portable terminal; a first terminal portion of the antenna pattern, the first terminal portion having one end connected to the short-range communication chipset and the other end connected to the side cover; and a second terminal portion having one end connected to the other end of the antenna pattern and the other end connected to the side cover.