An RFID tag is provided that includes a substrate, an RFIC element and a dipole antenna. The dipole antenna includes a first dipole element and a second dipole element. The first dipole element includes a first fold-back portion, and forms a capacitance between the first fold-back portion and a first facing portion. Furthermore, the first dipole element includes a first interposed portion that is interposed between a first open end and the second dipole element. Similarly, the second dipole element includes a second fold-back portion, and forms a capacitance between the second fold-back portion and a second facing portion. Furthermore, the second dipole element includes a second interposed portion that is interposed between a second open end and the first dipole element.

A blending system is provided for identifying a blending container. The blending system may include an attachment member that attaches to a blending container. The attachment member may include an identification tag. A receiving system may communicate with the identification tag to identify the container. The receiving system may measure characteristics of the blending container. The characteristics can be compared to stored characteristics.

There is provided an RF tag that can be mounted in a cavity of a member formed of a conductor having the cavity therein, and has high communication performance. An RF tag 1 of the present invention is an RF tag that is mounted in a cavity 101 of a conductor-made member 100 having the cavity 101 therein, and includes at least a free space antenna 10, a resonance circuit 20, an IC chip 30, a closed space antenna 40, and a substrate 50 for supporting the closed space antenna, a portion of the free space antenna is exposed from the cavity to the outside, and the substrate supports the closed space antenna so that the closed space antenna is not in contact with the inner surface of the conductor-made member. The closed space antenna, the substrate and the conductor-made member forms a capacitor portion C2.

A planar antenna (PA) of a transponder chip module (TCM) may have a planar antenna (PA) etched from a foil to have a track width of approximately 100 m or less; and a spacing between adjacent turns of the track of approximately 25 m or less. The track may subsequently be plated to reduce the spacing. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA).

Systems and methods for integrating tags with items. The methods comprise: turning a reel by an amount that allows a portion of an elongate narrow substrate that includes a first tag of a plurality of tags to be paid out (where each of the plurality of tags comprises at least one antenna formed of a trace or wire disposed on the elongate narrow substrate and a communication enabled device coupled to the elongate narrow substrate so as to have an electrical coupling or connection with the at least one antenna); dynamically tuning the first tag to optimize tag performance in view of dielectric and tuning properties of a first item being fabricated; cutting the elongate narrow substrate so as to cause the first tag to be placed on the first item being fabricated; and coupling the first tag to the item being fabricated.

There is provided an RF tag that can be mounted in a cavity of a member formed of a conductor having the cavity therein, and has high communication performance. An RF tag 1 of the present invention is an RF tag that is mounted in a cavity 101 of a conductor-made member 100 having the cavity 101 therein, and includes at least a free space antenna 10, a resonance circuit 20, an IC chip 30, a closed space antenna 40, and a substrate 50 for supporting the closed space antenna, a portion of the free space antenna is exposed from the cavity to the outside, and the substrate supports the closed space antenna so that the closed space antenna is not in contact with the inner surface of the conductor-made member. The closed space antenna, the substrate and the conductor-made member forms a capacitor portion C2.

A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard. Various slit designs (configurations, geometries) are described and illustrated. The slit may be filled. The slit may be reinforced.

An IC tag in which precision reduction is suppressed and which is compact and manufactured easily, and a manufacturing method of IC tag are provided. The IC tag has: antennas disposed on one surface of a substrate; a capacitor which includes a dielectric and first and second electrodes disposed on one surface of the substrate, and in which an electrostatic capacitance changes irreversibly corresponding to changes in ambient environment; and an IC chip which detects the electrostatic capacitance of the capacitor via a pair of external terminals to which the first and second electrodes are respectively connected, and wirelessly transmits information based on a detection result via the antennas.

Among other things, the invention concerns an apparatus for securing a product against forgery, the apparatus including a microchip with an integrated circuit that may be read out in a contactless manner, a first metallization layer arranged on a first chip side of the microchip, and a second metallization layer arranged on a second chip side opposite to the first chip side. The first and second metallization layers are each electrically coupled to the integrated circuit and function as electrodes for a capacitive readout of the integrated circuit. The microchip is fixable to the product or integrable into the product. The invention further concerns the use of a microchip as a security feature in a product as well as a method for securing a product against forgery.

An RFID system with an RFID chip and a transmitting and/or receiving antenna that are applied onto a substrate material for sending and/or receiving electromagnetic waves. The transmitting and/or receiving antenna is formed by only a single electrically conductive thread that forms a linear, non-intersecting structure. A segment of the electrically conductive thread loops around the RFID chip without touching it across an angle of at least 180, by which a capacitive coupling is effected between the RFID chip and the transmitting and/or receiving antenna. The invention further relates to a method for producing an RFID system.