An RFID tag (1) comprises a substrate (2), an inlay (3), an antenna (4) and an integrated circuit on a chip (5) coupled to the antenna (4). The substrate (2) has a front surface (6), a back surface (7), a first side edge (8) and a second side edge (9). The inlay (3) comprises the antenna (4) and has a fold (10) that is configured to fold over one side edge (8, 9) of the substrate (2) from the front surface (6) to the back surface (7). At least the inlay (3) comprises at least one opening (12).

The disclosure provides RFID labels including a composite label affixed to a surface of a container holding an object, including a first configuration wherein the first label section is positioned in the composite label and wherein the first label section can be removed from the composite label and configured to be affixed to the object.

An IC tag label includes: an IC chip; a communication antenna element having a first end and a second end, the first end being electrically connected to the IC chip, the communication antenna element including a planar coil extending on a first surface and having a shape suitable for positioning on a bottle mouth; and a bridge wiring including a wiring element which is located in an opposed region on a second surface which is opposed to the first surface, the bridge wiring electrically connecting the second end to the IC chip. The communication antenna element has an air core section which includes a center of the planar coil, and the wiring element is a single wire including a plurality of bent sections and having a folded line shape which traverses the air core section a plurality of times in plan view perpendicular to the first surface.

An assembly and method of manufacture of a radio frequency identification (RFID) assembly having a passive RFID semiconductor chip and a two sided planar antenna and a spacer composed of an electrically non-conducting foam material that is configured for non-absorbing of a substantial amount of energy at the predetermined operating frequency, the spacer having a predetermined thickness and that is configured for non-absorbing of a substantial amount of radio frequency energy at the predetermined operating frequency wherein the RFID tag assembly is configured to receive at a first side of the two sided planar antenna a first portion of the radio frequency energy as direct energy and is configured to receive at a second side of the planar antenna a second portion of the radio frequency energy as indirect energy responsive to the absorbing by the absorbing material body.

An RFID unit includes an RFID unit A and an RFID unit B that are separable on a break line, where the RFID unit A includes an IC chip portion A that stores an UUID and an antenna portion A, and the RFID unit B includes an IC chip portion B that stores an UUID and an antenna portion B. Before the RFID unit is separated into the RFID unit A and RFID unit B, either the RFID unit A or RFID Unit B transmits a first signal including the UUID. After the separation, at least either the RFID unit A or RFID unit B transmits a second signal, different from the first signal, including the UUID.

A wireless communication device that includes a first electrode connected to a first terminal electrode of an RFIC element and a second electrode connected to a second terminal electrode of the RFIC element. Moreover, the first electrode has a longitudinal direction and a lateral direction and has a first portion connected to the first terminal electrode and a second portion that faces the first portion and the second electrode. The first portion has an extended portion that extends in the longitudinal direction beyond a connection point between the second electrode and the second terminal electrode.

A substantially cylindrical, metal container (1) which container comprising an envelope surface wall (2), a top end and a bottom end (3), wherein the bottom end having a cavity which is formed by a circular concave, parabolic bottom surface (4) and a circular surrounding edge (5). A UHF RFID tag (6), comprising an integrated circuit (7) and an antenna (8), is arranged at the bottom end, wherein the antenna is located at a predetermined distance above the center of the bottom surface (4), such that the bottom surface reflects the antenna radiation.

An assembly and method of manufacture of a radio frequency identification (RFID) assembly having a passive RFID semiconductor chip and a two sided planar antenna and a spacer composed of an electrically non-conducting foam material that is configured for non-absorbing of a substantial amount of energy at the predetermined operating frequency, the spacer having a predetermined thickness and that is configured for non-absorbing of a substantial amount of radio frequency energy at the predetermined operating frequency wherein the RFID tag assembly is configured to receive at a first side of the two sided planar antenna a first portion of the radio frequency energy as direct energy and is configured to receive at a second side of the planar antenna a second portion of the radio frequency energy as indirect energy responsive to the absorbing by the absorbing material body.

A radio frequency identification (RFID) tag includes an RFID chip, an antenna, and a substrate configured to fold into a U-shaped configuration. One end of the substrate is secured to an item of commerce after which the substrate can be folded until the opposing end of the substrate is also secured to the item. The RFID tag can include a dielectric layer adjoined to part or all of the substrate to provide additional structural support for the RFID tag. Aligned holes in the substrate allow a display rail to pass through the RFID tag. The RFID chip and antenna are configured to transmit in a direction substantially outwardly from one side of the RFID tag, allowing the RFID tag to operate even when stacked with other items. The RFID antenna and the item can operate as a loop antenna when the item is metallic.

An IC tag label includes: an IC chip; a communication antenna element having a first end and a second end, the first end being electrically connected to the IC chip, the communication antenna element including a planar coil extending on a first surface and having a shape suitable for positioning on a bottle mouth; and a bridge wiring including a wiring element which is located in an opposed region on a second surface which is opposed to the first surface, the bridge wiring electrically connecting the second end to the IC chip. The communication antenna element has an air core section which includes a center of the planar coil, and the wiring element is a single wire including a plurality of bent sections and having a folded line shape which traverses the air core section a plurality of times in plan view perpendicular to the first surface.