The operation speed of a semiconductor device is improved. The semiconductor device includes a first memory region and a second memory region; in the semiconductor device, a first memory cell in the first memory region is superior to a second memory cell in the second memory region in data retention characteristics such as a large storage capacitance or a large channel length—channel width ratio (L/W) of a transistor. When the semiconductor device is used as a cache memory or a main memory device of a processor, the first memory region mainly stores a start-up routine and is not used as a work region for arithmetic operation, and the second memory region is used as a work region for arithmetic operation. The first memory region becomes an accessible region when the processor is booted, and the first memory region becomes an inaccessible region when the processor is in normal operation.

A memory module including a row hammer counter chip, a memory system including the same, and a method of operating the memory system are provided. The memory module includes a plurality of data chips each of which is configured to store a data set corresponding to a plurality of burst lengths, and at least one row hammer counter chip including counter memory cells each of which is connected to a word line, among a plurality of word lines, for each of the plurality of data chips, wherein the at least one row hammer counter chip is configured to store in each of the counter memory cells connected to the word line, a number of times the word line is accessed for each of the plurality of data chips during a row hammer monitoring time frame.

Methods, apparatuses, and systems related to operations for memory process feedback. A controller can monitor memory activities, such as processes, identify row hammer aggressors, and perform mitigating steps to the row hammer aggressors. The controller may have a table of addresses of row hammer aggressors and perform operations of tracking row hammer aggressors. The controller can determine whether the number of aggressors reaches a threshold. When the number of aggressors reaches the threshold, the controller can send a message with the aggressor addresses to the operating system. The operating system can perform mitigating steps to the row hammer aggressors. In some embodiments, the controller may identify the row hammer aggressors and inject poisoned data into the process to mitigate the row hammer aggressors.

Methods, apparatuses, and systems related to operations for memory process feedback. A controller can monitor memory activities, such as processes, identify row hammer aggressors, and perform mitigating steps to the row hammer aggressors. The controller may have a table of addresses of row hammer aggressors and perform operations of tracking row hammer aggressors. The controller can determine whether the number of aggressors reaches a threshold. When the number of aggressors reaches the threshold, the controller can send a message with the aggressor addresses to the operating system. The operating system can perform mitigating steps to the row hammer aggressors. In some embodiments, the controller may identify the row hammer aggressors and inject poisoned data into the process to mitigate the row hammer aggressors.

The integrated circuit layout includes: a data pad; an electro-static discharge circuit, located at one side of the data pad and electrically connected to the data pad; a first transmission circuit, located at a side of the electro-static discharge circuit which faces towards the data pad, wherein the first transmission circuit is electrically connected to the electro-static discharge circuit through a first bus; a second transmission circuit, located at a side of the electro-static discharge circuit which is away from the first transmission circuit, wherein the second transmission circuit is electrically connected to the electro-static discharge circuit through a second bus. One of the first transmission circuit and the second transmission circuit is configured to transmit data from the data pad to a memory array, and the other is configured to receive data from the memory array and transmit the data to the data pad.

The integrated circuit layout includes: a data pad; an electro-static discharge circuit, located at one side of the data pad and electrically connected to the data pad; a first transmission circuit, located at a side of the electro-static discharge circuit which faces towards the data pad, wherein the first transmission circuit is electrically connected to the electro-static discharge circuit through a first bus; a second transmission circuit, located at a side of the electro-static discharge circuit which is away from the first transmission circuit, wherein the second transmission circuit is electrically connected to the electro-static discharge circuit through a second bus. One of the first transmission circuit and the second transmission circuit is configured to transmit data from the data pad to a memory array, and the other is configured to receive data from the memory array and transmit the data to the data pad.

Methods, systems, and apparatuses for memory devices (e.g., DRAM) including one or more reserved rows for row-copy operations are described. Such a memory device may include a memory array having a set of rows, where one or more rows of the set are reserved for row-copy operations and hidden (un-addressable) from access commands directed to the memory array. The reserved rows may include a dummy row configured to provide a uniform processing conditions to the memory array. Additionally, or alternatively, the reserved rows may include a buffer row configured to provide a buffer zone in the memory array. In some embodiments, the memory device may perform the row-copy operations in response to detecting row hammering activities. The row-copy operations may mitigate the risks associated with the row hammering activities by routing the row hammering activities to the reserved rows.

A dynamic random-access memory array includes a plurality of memory cells and sensor cells physical arranged in a row. The sensor cells include a transistor and a capacitor having an input terminal connected to a first non-gate terminal of the transistor. A wordline is connected to transistor gates of both the memory cells and sensor cells in the row. A sensor amplifier has inputs connected to the sensor cell, a high voltage reference line, and a low voltage reference line, and an output in communication with a row refresh circuit. If the sensor amplifier detects that the sensor cell voltage falls outside of the range of the high and low voltage reference lines, then a trigger signal is output to request that the row refresh circuit perform a priority row refresh of the memory cells and the sensor cell in the row.

An electronic device includes a flag generation circuit and a delay circuit. The flag generation circuit is configured to generate a flag signal, wherein a level of the flag signal changes based on a first internal command. The delay circuit is configured to generate a delay signal by delaying one of an operation signal and the flag signal by a predetermined period according to whether a predetermined operation is performed.

An electronic device includes a flag generation circuit and a delay circuit. The flag generation circuit is configured to generate a flag signal, wherein a level of the flag signal changes based on a first internal command. The delay circuit is configured to generate a delay signal by delaying one of an operation signal and the flag signal by a predetermined period according to whether a predetermined operation is performed.