An apparatus and method for providing efficient floor planning, power, and performance tradeoffs of memory accesses. Adjacent bit cells in a column of an array use a split read port such that the bit cells do not share a read bit line while sharing a write bit line. The adjacent bit cells include asymmetrical read access circuits that convey data stored by latch circuitry of a corresponding bit cell to a corresponding read bit line. The layout of adjacent bit cells provides a number of contacted gate pitches per bit cell that is less than a sum of the maximum number of metal gates in layout of each of the adjacent bit cells divided by the number of adjacent bit cells.

A method for accessing a memory cell includes enabling precharging of a bit line of the memory cell before a next access of the memory cell. The method includes disabling the precharging after a first interval if the next access is a write. The method includes disabling the precharging after a second interval if the next access is a read. The first interval is shorter than the second interval.

A method for accessing a memory cell includes enabling precharging of a bit line of the memory cell before a next access of the memory cell. The method includes disabling the precharging after a first interval if the next access is a write. The method includes disabling the precharging after a second interval if the next access is a read. The first interval is shorter than the second interval.

A memory includes S storage blocks, N global bitlines, and a signal amplification circuit. Each of the S storage blocks is connected to the N global bitlines, the N global bitlines are connected to the signal amplification circuit, the signal amplification circuit is configured to amplify electrical signals on the N global bitlines, and each storage block includes N columns of storage units, N local bitlines, and N bitline switches. In each storage block, storage units in an i.sup.th column are connected to an i.sup.th local bitline, the i.sup.th local bitline is connected to an i.sup.th global bitline by using an i.sup.th bitline switch in the N bitline switches. A memory array is fine-grained, so that i.sup.th local bitlines in the S storage blocks can share one global bitline.

A machine memory includes multiple memory cells. Word lines, each with at least one word line driver, are coupled to the memory cells along rows. The word line drivers of at least some adjacent pairs of the word lines are coupled together by a pull-down transistor, in a manner that reduces read disturb of the memory cells.

A machine memory includes multiple memory cells. Word lines, each with at least one word line driver, are coupled to the memory cells along rows. The word line drivers of at least some adjacent pairs of the word lines are coupled together by a pull-down transistor, in a manner that reduces read disturb of the memory cells.

A photoelectric conversion device including a plurality of substrates in a stacked state, the plurality of substrates including a first substrate and a second substrate electrically connected to each other, the photoelectric conversion device comprising: a memory cell unit including row-selection lines that are to be driven upon selection of a row of a memory cell array and column-selection lines that are to be driven upon selection of a column of the memory cell array; and a memory peripheral circuit unit that includes row-selection line connection portions and column-selection line connection portions so as to drive the row-selection lines and to drive the column-selection lines, wherein a first portion that is at least a part of the memory peripheral circuit unit is formed on the first substrate and the memory cell unit is formed on the second substrate.

A photoelectric conversion device including a plurality of substrates in a stacked state, the plurality of substrates including a first substrate and a second substrate electrically connected to each other, the photoelectric conversion device comprising: a memory cell unit including row-selection lines that are to be driven upon selection of a row of a memory cell array and column-selection lines that are to be driven upon selection of a column of the memory cell array; and a memory peripheral circuit unit that includes row-selection line connection portions and column-selection line connection portions so as to drive the row-selection lines and to drive the column-selection lines, wherein a first portion that is at least a part of the memory peripheral circuit unit is formed on the first substrate and the memory cell unit is formed on the second substrate.

In some embodiments of the method, patterning the opening includes: projecting a radiation beam toward the second dielectric layer, the radiation beam having a pattern of the opening. In some embodiments of the method, the single-patterning photolithography process is an extreme ultraviolet (EUV) lithography process. In some embodiments of the method, filling the opening with the conductive material includes: plating the conductive material in the opening; and planarizing the conductive material and the second dielectric layer to form the first metal line from remaining portions of the conductive material, top surfaces of the first metal line and the second dielectric layer being planar after the planarizing.

In some embodiments of the method, patterning the opening includes: projecting a radiation beam toward the second dielectric layer, the radiation beam having a pattern of the opening. In some embodiments of the method, the single-patterning photolithography process is an extreme ultraviolet (EUV) lithography process. In some embodiments of the method, filling the opening with the conductive material includes: plating the conductive material in the opening; and planarizing the conductive material and the second dielectric layer to form the first metal line from remaining portions of the conductive material, top surfaces of the first metal line and the second dielectric layer being planar after the planarizing.