Patent classifications
G02F1/133612
Display system
A power reduced display includes a light source having an available space and configured to generate a backlight, a first display having multiple first pixels, wherein each first pixel is configured to selectively pass and block the backlight, a second display having multiple second pixels. The light source includes a first number of first packages each having a single light-emitting diode. The first number is a largest number of the first packages that fit in the available space of the light source. The first number of the first packages is configured to consume a first power to produce a particular luminance. A second number of second packages each having two light-emitting diodes alternatively fit in the available space and is configured to consume a second power to produce the particular luminance. The first number is greater than the second number. The first power is less than the second power.
BACKLIGHT MODULE AND DISPLAY DEVICE
A backlight module includes a substrate, light-emitting elements, circuit elements and a reflective sheet. The light-emitting elements are bonded onto the substrate. The circuit elements are bonded onto the substrate and electrically connected to the light-emitting elements. At least four of the light-emitting elements are disposed around one of the circuit elements. The reflective sheet is disposed on the substrate and has first openings exposing the light-emitting elements and protrusions. The protrusions corresponds to the circuit elements and cover the circuit elements. One of the protrusions has an opening formed of two crossing slits. Extending directions of the two crossing slits do not cross the at least four of the light-emitting elements. The one of the protrusions corresponds to the one of the circuit elements. The at least four of the light-emitting elements are closer to the one of the circuit elements than other of the light-emitting elements.
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF, AND MOBILE TERMINAL
The present application discloses a display module and a manufacturing method thereof, and a mobile terminal. The display module includes a printed circuit board connected to a backlight flexible circuit board. A side of the backlight flexible circuit board connected to the printed circuit board comprises at least two first bonding regions, wherein each of the first bonding regions includes at least two first bonding terminals distributed therein, and wherein a distance between any two adjacent first bonding regions is greater than a distance between any two adjacent first bonding terminals in each of the first bonding regions.
Back-Light Unit Having Light-Emitting Chips and Display Apparatus Having the Same
A back-light unit including light-emitting chips and a display apparatus are disclosed. The back-light unit includes a driving voltage line on a substrate, and a ground voltage line spaced apart from the driving voltage line. The light-emitting chips are on a lower insulating layer covering the driving voltage line and the ground voltage line. A driving chip electrically connected to the ground voltage line may be on the substrate. Each of the light-emitting chips may be electrically connected between the driving voltage line and the driving chip by emission connecting lines. A driving dummy pattern and/or a ground dummy pattern is between the light-emitting chips and the emission connecting lines. The driving dummy pattern is electrically connected to the driving voltage line, and the ground dummy pattern is electrically connected to the ground voltage line. Thus, a luminance difference of the light-emitting chips may be prevented or at least reduced.
Method and apparatus for embedding semiconductor devices
An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The transfer surface includes ripples in a profile thereof such that an apex on an individual ripple is a point on a first plane and a trough on the individual ripple is a point on a second plane. The semiconductor die is disposed on the transfer surface between the first plane and the second plane such that the second surface of the semiconductor die extends transverse to the first plane and the second plane.
Display panel and control method thereof, and display device
The present invention provides a display panel and a control method thereof, and a display device. The display panel includes a display unit and a backlight module. The display unit includes a main display region and a function additional region. The backlight module includes a first light source block providing a light source for the main display region and a second light source block providing a light source for the function additional region. The first light source block and the second light source block are independently driven and controlled.
Array substrate of easily-placed light-emitting elements, method of fabricating same, and display panel using same
A light-emitting array substrate allowing a higher efficiency in the seating of numerous very small light source elements includes a substrate, an insulating layer on the substrate including positioning holes, and light-emitting elements. Each positioning hole penetrates the insulating layer and forms a first opening and a second opening. For each positioning hole, a size of the bottommost first opening is less than a size of the topmost second opening, and, from topmost to bottommost of the substrate, a projection of the second opening on the substrate more than covers a projection of the first opening on the substrate. A method of fabricating the substrate and a display panel using the substrate are further disclosed.
BACKLIGHT SOURCE AND MANUFACTURING METHOD THEREOF
A backlight source and a manufacturing method thereof are provided. The backlight source includes a first substrate, a plurality of light sources, a driving circuit layer, and a conductive line. The light sources are distributed on an upper surface of the first substrate. The second substrate is disposed opposite to the first substrate. The driving circuit layer is disposed on a surface of a side of the second substrate away from the first substrate. An end of the conductive line is connected to one of the light sources, and another end of the conductive line is bonded to the driving circuit layer.
DISPLAY DEVICE, DISPLAY CONTROL METHOD AND DISPLAY CONTROL DEVICE
A display device includes: a plurality of backlight modules, where each backlight module includes a plurality of light sources capable of emitting light in at least three different colors; a color-filter-less liquid crystal display module including a plurality of pixel units arranged in an array form and a plurality of scanning lines coupled to the pixel units; where the plurality of backlight modules are arranged in parallel with the liquid crystal display module; where an orthogonal projection of each backlight module onto a plane where the liquid crystal display module is located corresponds to at least two rows of pixel units, where the pixel units in one row are along an length extension direction of each scanning line; and a driving circuit coupled to each backlight module and configured to apply a backlight driving signal to each backlight module.
DISPLAY APPARATUS
A display apparatus includes: a display panel; a light source module provided behind the display panel, the light source module including a board and a light source provided on a rear surface of the board; a rear chassis covering a rear surface of the light source module; and a supporter extending between the board and the rear chassis, the supporter being electrically conductive.