A color filter (CF) substrate, a manufacturing method thereof, a display panel, a display device and an operation method thereof are provided. The CF substrate includes: a base substrate, a CF pixel array and image sensors. The CF pixel array is provided on the base substrate and includes CF pixel units in an array. The image sensors are provided on the CF pixel array, correspond to the CF pixel units, and are configured to receive light travelling through the CF pixel units for imaging.

A curved full-array LED light panel, a curved backlight module including the curved full-array LED light panel, and a curved LCD including the backlight module are disclosed. The curved full-array LED light panel includes a flexible reflective sheet and a plurality of LED light bars wherein a plurality of LEDs are disposed. The plurality of LED light bars are attached to a sheet-rear side of the flexible reflective sheet alone a direction parallel to the height direction of the full-array LED light panel, and the plurality of LEDs disposed on the LED light bars are exposed from a plurality of openings of the flexible reflective sheet toward an LCD panel. Along a direction parallel to the width direction of the full-array LED light panel, the flexible reflective sheet is deformed to form a curved reflective surface. Each of the LED light bars further comprises a bar-shaped PCB, and a plurality of LED dimming-zone circuits are disposed on the bar-shaped PCB. Full-array local dimming of the curved full-array LED light panel can be achieved by controlling the electric current of the LED dimming-zone circuits.

The present application provides a backlight module, a display panel and an electronic device, including a substrate; a plurality of driving units, formed on the glass substrate; and a plurality of mini-LEDs, each of which includes a first electrode and a second electrode, wherein the driving unit includes a switching module, a driving module and a storing module, one end of the switching module is connected to the driving module and the storing module, the driving module is connected to the mini-LED.

A drive backboard includes: a first conductive layer including bonding pins and first connecting lines, an insulating layer including first via holes and second via holes, a second conductive layer including connecting electrodes and second connecting lines and a conductive protective layer including first protective structures and second protective structures. The first via hole exposes the bonding pin, one end of a first connecting line electrically connects a bonding pin, and the other end reaches the second via hole. One end of a second connecting line electrically connects a connecting electrode, and the other end electrically connects the first connecting line through the second via hole. The first protective structure covers the bonding pin, and the second protective structure covers the second connecting line formed at the position of the second via hole. The pattern of the conductive protective layer is complementary to the pattern of the insulating layer.

A display device including a lower cover; a circuit substrate on the lower cover; a plurality of light sources disposed on a first portion of the circuit substrate; a reflection layer disposed on a second portion of the circuit substrate; a first adhesive disposed between the second portion of the circuit substrate and the reflection layer; a light regulator including light regulating patterns disposed in the reflection layer; and an optical sheet disposed on the light sources.

The present disclosure discloses a display device. The display device includes a first display structure, a second display structure and a backlight device. The first display structure includes first pixels arranged in an array, the first pixels are divided into multiple dimming areas, and each dimming area includes at least one first pixel. The first display structure is for adjusting the transmittance of each dimming area for lights emitted by the backlight device according to an image to be displayed in the next frame of the second display structure.

A method of manufacturing a planar light source includes: providing a wiring substrate including: an insulating layer defining a first through-hole and a second through-hole that are separated from each other, and a first wiring layer and a second wiring layer that are disposed below the insulating layer, wherein the first wiring layer is separated from the first through-hole and the second wiring layer is separated from the second through-hole, and wherein, in a top plan view, the first wiring layer and the second wiring layer are arranged at two opposite sides with respect to the first through-hole and the second through-hole; disposing a light guide member and a light source above the wiring substrate; and forming (i) a first wiring member that fills the first through-hole, and (ii) a second wiring member that is separated from the first wiring member and fills the second through-hole.

An edge conductor includes a first portion electrically connected to a first conductor on a first surface of a substrate, a second portion electrically connected to a second conductor on a second surface of the substrate, a third portion extending between the first portion and the second portion along an edge of the substrate, and a coating covering at least a portion of the third portion of the edge conductor, where the second surface of the substrate is opposite the first surface of the substrate, and the edge of the substrate extends between the first surface of the substrate and the second surface of the substrate.

A backlight module includes: a plurality of lamp groups arranged in an array on a base substrate, each lamp group comprises a plurality of mini light emitting diodes, a plurality of lead wires in the lamp group, an external anode and an external cathode; a plurality of anode wires and cathode wires electrically connected to external anodes and external cathodes of a plurality of rows of lamp groups, respectively, wherein in at least some of the plurality of cathode wires, one same cathode wire is electrically connected to the external cathodes of the lamp groups located in different rows. Same-type anode wires comprise a plurality of anode wires to which same-wire lamp groups are connected, and orthographic projections of the same-type anode wires on the base substrate do not overlap with an orthographic projection of one same lead wire in the lamp group on the base substrate.

A method for transferring a plurality of die operatively associated with a transfer apparatus to a glass substrate to form a circuit component. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.