Described is an antenna comprising two oppositely wound antenna coils, each antenna coil formed by concentric conductor coils. An outermost conductor coil of one antenna coil is conductively connected to an outermost conductor coil of the other antenna coil via a shared conductive portion. An innermost conductor coil of each antenna coil terminates in a bridge connector, and a bridge conductively links the bridge connectors.

Smartcards (SC) having a metal layer (ML) or metal card body (MCB) and a module opening (MO) for a transponder chip module (TCM). A slit (S) or notch (N) in the metal card body may extend from a peripheral edge of a metal layer or card body, without extending to the module opening. A flexible circuit (FC) with one or two patch antennae (PA) or sense coils (SeC) connected to a coupling loop structure (CLS) with an antenna structure (AS) on the same substrate may be incorporated into the card body (CB). A fingerprint sensing module comprising an electrically-conductive metal bezel housed in the card may be electrically isolated from the metal layer or metal card body by the application of coatings (DLC) or anodizing (oxidizing) the respective metal surfaces. The cards may be contactless only, contact only, or dual-interface (contact and contactless).

A planar antenna (PA) of a transponder chip module (TCM) may have a planar antenna (PA) etched from a foil to have a track width of approximately 100 m or less; and a spacing between adjacent turns of the track of approximately 25 m or less. The track may subsequently be plated to reduce the spacing. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA).

A wireless IC device includes a resin member including first and second surfaces, a substrate including first and second principal surfaces, a coil antenna provided in the resin member, and an RFIC element mounted on the substrate and connected to the coil antenna. The substrate is embedded in the resin member so that the second principal surface is at a second surface side. The coil antenna is defined by first linear conductor patterns on the second surface, first metal posts extending between the first and second surfaces, second metal posts extending between the first and second surfaces, and second linear conductor patterns on the first surface. The RFIC element is disposed in the coil antenna.

A dual IC card of the present invention includes: an IC module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the IC module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.

A dual IC card of the present invention includes: an IC module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the IC module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.

A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.

An RFID tag including an RFIC element, a first inductor element that includes a first insulating substrate having a mounting surface on which the RFIC element is mounted, and first coil-shaped antenna internally embedded in first insulating substrate with a winding axis perpendicular to the mounting surface, and second inductor element that includes second insulating substrate mounted on the mounting surface, and second coil-shaped antenna internally embedded in second insulating substrate, electrically connected to first coil-shaped antenna, and with a winding axis parallel to the mounting surface. The first insulating substrate includes a laminate with dielectric layers or magnetic layers laminated, and the first coil-shaped antenna includes a laminate coil-shaped antenna in which conductor patterns are each formed on a corresponding one of the layers of the laminate, such that they are connected to each other through interlayer connection conductor.

A planar antenna (PA) of a transponder chip module (TCM) may have a planar antenna (PA) etched from a foil to have a track width of approximately 100 m or less; and a spacing between adjacent turns of the track of approximately 25 m or less. The track may subsequently be plated to reduce the spacing. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA).

A module substrate antenna (1) includes a first coil (7) and a second coil (8) that are connected in parallel. The first coil (7) is composed of a pattern in which a spiral first antenna coil pattern (3a) and a spiral second antenna coil pattern (5a) are interlayer-connected in series. The second coil (8) is composed of a pattern in which a spiral third antenna coil pattern (4a) and a spiral fourth antenna coil pattern (6a) are interlayer-connected in series. The coil patterns are arranged in order of the first antenna coil pattern (3a), the third antenna coil pattern (4a), the second antenna coil pattern (5a), and the fourth antenna coil pattern (6a).