A resin molded body with an RFIC package incorporated therein is insert-molded incorporating therein a metal core material and an RFIC element connected to the metal core material. The RFIC element includes a ceramic multi-layer substrate that incorporates therein a coil conductor, and an RFIC chip mounted on a mounting surface of the multi-layer substrate. The RFIC chip is connected to the coil conductor by nano-particle bonding or ultrasonic bonding. The coil conductor is coupled with the core material in a magnetic field coupling scheme.

An RFID/NFC-system comprising a stationary RFID/NFC-interface (4) and a movable RFID/NFC-element (6, 6, 6), wherein the stationary RFID/NFC-interface (4) comprises a stationary carrier (16) with a first coil (17) arranged for example on its upper surface (15) or on its lower surface and connected to a first RFID/NFC-chip (18), wherein the stationary carrier (16) is fixed with one of its side faces (5) to a mounting device (2), wherein the movable RFID/NFC-element (6, 6, 6) comprises a movable carrier (7, 7, 7) with a second coil (8, 8, 8) arranged for 6, 9 example on its upper surface (14) or on its lower surface, wherein the second coil (8, 8, 8) is connected or connectable to a second RFID/NFC-chip and wherein the movable RFID/NFC-element (6, 6, 6) can be moved with respect to the stationary RFID/NFC-interface (4) such that the upper surface (14) or the lower surface of the movable carrier (7, 7, 7) and the upper surface (15) or the lower surface of the stationary carrier (16) at least partly face each other such that signals can be transferred between the first coil (17) and the second coil (8, 8, 8). Further an according RFID/NFC-element (6, 6, 6) is described.

A wireless communication module includes a multilayer structure including a magnetic block and at least one non-magnetic layer stacked on the magnetic block, the magnetic block including at least one magnetic layer, at least one inductor element disposed at the magnetic block, and an antenna coil disposed at the non-magnetic layer so as to overlap the inductor element in a planar view along a stacking direction of the non-magnetic layer with respect to the magnetic block, wherein the magnetic layer is present between the inductor element and the antenna coil.

A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.

A wireless IC device includes a resin member including first and second surfaces, a substrate including first and second principal surfaces, a coil antenna provided in the resin member, and an RFIC element mounted on the substrate and connected to the coil antenna. The substrate is embedded in the resin member so that the second principal surface is at a second surface side. The coil antenna is defined by first linear conductor patterns on the second surface, first metal posts extending between the first and second surfaces, second metal posts extending between the first and second surfaces, and second linear conductor patterns on the first surface. The RFIC element is disposed in the coil antenna.

A coil component includes coils in a multilayer body with a rectangular or substantially rectangular parallelepiped shape. The coil component includes outer electrodes, a first coil, and second coils. The first coil includes conductor patterns and via conductors. When the multilayer body is divided by a bisecting line into first and second regions in a longitudinal direction of the multilayer body when viewed in the stacking direction, the first coil is located in the first region. When viewed in the stacking direction, straight lines connecting the via conductors with a first outer electrode and a fourth outer electrode at a minimum distance cross an opening region of the first coil.

An antenna device includes a power feed coil to be connected to a RFIC and a coil antenna that couples with the power feed coil. The power feed coil includes a first power feed coil and a second power feed coil connected to the first power feed coil. The second power feed coil includes a coil opening with a planar or substantially planar shape. The coil antenna includes a coil opening with a planar or substantially planar shape along a plane identical, parallel, or substantially parallel to that of the coil opening of the second power feed coil. The center of gravity of the coil antenna is located within the coil opening of the second power feed coil when viewed in plan view. A winding axis direction of the first power feed coil crosses or intersects with a winding axis direction of the coil antenna. The first power feed coil and the second power feed coil magnetically couple with the coil antenna.

The present disclosure relates to communication tags and electronic devices. One example communication tag includes a circuit board and a chip disposed on the circuit board. Two coils are formed on the circuit board. The two coils are respectively disposed on two different conducting layers of the circuit board. Optionally, the two coils are disposed in an intersecting manner. In addition, lines for feeding the two coils are disposed close to each other.