A data processing system may include a plurality of memory modules, a controller, a power supply and a plurality of switches. Each of the memory modules may include a plurality of pages. The controller may control operations of the memory modules. The power supply may provide the memory modules with a power. The switches may be arranged corresponding to each of the memory modules. The switches may be selectively driven in response to a switch drive signal from the controller.

Methods, systems, and apparatuses related to configured dual register clock driver (RCD) devices on a single memory subsystem using different configuration information are described. In some examples, configuration of the two RCD devices with different configuration information may include use of a serial data bus to receive and store first RCD configuration data, which is provided to both of the RCD devices to configure one or more parameters of each respective RCD device. One of the RCD devices may receive second configuration data via a command and address bus to independently update the one or more configuration parameters of one of the two RCD devices.

An example apparatus for writing a bit to a memory cell includes wordline driver circuitry configured to generate a first voltage in response to a row access enable signal. The apparatus also includes boost driver circuitry coupled to the wordline driver circuitry. The boost driver circuitry is configured to charge a capacitor using the first voltage and to generate a second voltage using the first voltage and a voltage at the capacitor in response to a boost enable signal. The apparatus also includes a wordline coupled to the memory cell and the wordline driver circuitry. The wordline is configured to output the first voltage or the second voltage to the memory cell.

An arithmetic device includes an auto-command/address generation circuit, a first data storage circuit, and a second data storage circuit. The auto-command/address generation circuit generates an auto-load selection signal that activates an auto-load operation based on a level of a power source voltage. In addition, the auto-command/address generation circuit generates an auto-load command for the auto-load operation. The first data storage circuit outputs look-up table data, to which an activation function is applied, based on the auto-load command. The second data storage circuit stores the look-up table data, output from the first data storage circuit, based on the auto-load command.

Methods, systems, and devices for a data circuit for a low swing data bus are described. An apparatus may include a data bus that may transfer data at a first voltage different than a second voltage that is associated with one or more components of the memory array. A transistor, coupled with the data bus, may receive the second voltage and send a third voltage. A first in first out (FIFO), coupled with the transistor, may receive the third voltage from the transistor. The FIFO circuit may include one or more precharge components that drive an input voltage of the FIFO circuit to the second voltage associated with the one or more components of the memory array based on receiving the third voltage.

The embodiments described herein describe technologies for memory systems. One implementation of a memory system includes a motherboard substrate with multiple module sockets, at least one of which is populated with a memory module. A first set of data lines is disposed on the motherboard substrate and coupled to the module sockets. The first set of data lines includes a first subset of point-to-point data lines coupled between a memory controller and a first socket and a second subset of point-to-point data lines coupled between the memory controller and a second socket. A second set of data lines is disposed on the motherboard substrate and coupled between the first socket and the second socket. The first and second sets of data lines can make up a memory channel.

An embodiment of a semiconductor apparatus may include technology to convert an analog voltage level of a memory cell of a multi-level memory to a multi-bit digital value, and determine a single-bit value of the memory cell based on the multi-bit digital value. Some embodiments may also include technology to track a temporal history of accesses to the memory cell for a duration in excess of ten seconds, and determine the single-bit value of the memory cell based on the multi-bit digital value and the temporal history. Other embodiments are disclosed and claimed.

A reconfigurable device and an analog circuit are formed on a single chip so that the analog circuit can be controlled by the reconfigurable device. A reconfigurable semiconductor device (1) includes a plurality of logic sections (20) and an analog section (10). The plurality of logic sections (20) are connected to each other by an address line or a data line. The analog section (10) includes a plurality of input/output sections and an output amplifier. Each of the logic sections (20) includes a plurality of address lines, a plurality of data lines, a memory cell unit, and an address decoder that decodes an address signal and that outputs a decoded signal to the memory cell unit. The plurality of logic sections (20) and the analog section (10) are mounted in the same chip package.

A semiconductor memory device includes: a memory cell array including banks; a command/address buffer receiving a command/address based on a system dock; a data input/output circuit inputting/outputting data based on a data clock; a mode control circuit generating mode selection signals indicating different latencies according to a burst length signal and operation information on a first operation mode differentiated based on a ratio of the data dock to the system clock, and a second operation mode differentiated based on a bank mode; and a latency setting circuit setting a latency according to an activated one of the mode selection signals, generating an internal write command by delaying a write command at least by the set latency according to the system dock during a write operation, and generating an internal read command by delaying a read command by the set latency according to the system dock during a read operation.

An extended-height DIMM for use in a memory system having slots designed to receive DIMMs that comply with a JEDEC standard that specifies a maximum height for the DIMM and a maximum number of devices allowed to reside on the DIMM. The DIMM comprises a PCB having an edge connector designed to mate with a memory system slot and a height which is greater than the maximum height specified in the applicable standard, a plurality of memory devices which exceeds the maximum number of devices specified in the applicable standard, and a memory buffer, or a register control device and data buffers, which operates as an interface between a host controller's data and command/address busses and the memory devices. This arrangement enables the extended-height DIMM to provide greater memory capacity than would a DIMM which complies with the maximum height and maximum number of devices limits.