Methods, systems, and devices for thin film transistor deck selection in a memory device are described. A memory device may include memory arrays arranged in a stack of decks formed over a substrate, and deck selection components distributed among the layers to leverage common substrate-based circuitry. For example, each memory array of the stack may include a set of digit lines of a corresponding deck, and deck selection circuitry operable to couple the set of digit lines with a column decoder that is shared among multiple decks. To access memory cells of a selected memory array on one deck, the deck selection circuitry corresponding to the memory array may each be activated, while the deck selection circuitry corresponding to a non-selected memory array on another deck may be deactivated. The deck selection circuitry, such as transistors, may leverage thin-film manufacturing techniques, such as various techniques for forming vertical transistors.

Methods, systems, and devices for thin film transistor deck selection in a memory device are described. A memory device may include memory arrays arranged in a stack of decks formed over a substrate, and deck selection components distributed among the layers to leverage common substrate-based circuitry. For example, each memory array of the stack may include a set of digit lines of a corresponding deck, and deck selection circuitry operable to couple the set of digit lines with a column decoder that is shared among multiple decks. To access memory cells of a selected memory array on one deck, the deck selection circuitry corresponding to the memory array may each be activated, while the deck selection circuitry corresponding to a non-selected memory array on another deck may be deactivated. The deck selection circuitry, such as transistors, may leverage thin-film manufacturing techniques, such as various techniques for forming vertical transistors.

A semiconductor memory device includes a memory cell array, a bit-line switch, a block switch, and a column decoder. The memory cell array includes memory blocks coupled to at least one word-line and each of the memory blocks includes memory cells. The bit-line switch is connected between a first half local input/output (I/O) line of a first memory block and a second half local I/O line of the first memory block. The block switch is connected between the second half local I/O line of the first memory block and a first half local I/O line of a second memory block adjacent to the first memory block. The column decoder includes a repair circuit that controls connections by applying a first switching control signal to the bit-line switch and a second switching control signal to the block switch.

A storage device includes a NAND flash memory device, an auxiliary memory device and a storage controller to control the NAND flash memory device and the auxiliary memory device. The storage controller includes a processor, an error correction code (ECC) engine and a memory interface. The processor executes a flash translation layer (FTL) loaded onto an on-chip memory. The ECC engine generates first parity bits for user data to be stored in a target page of the NAND flash memory device based on error attribute of a target memory region associated with the target page, and selectively generates additional parity bits for the user data under control of the processor. The memory interface transmits the user data and the first parity bits to the NAND flash memory device, and selectively transmits the additional parity bits to the auxiliary memory device.

Described herein are stacked memory devices that include some peripheral devices for controlling the memory in a separate layer from one or more memory arrays. The layers of the memory device are connected together using vias, which transfer power and data between the layers. In some examples, a portion of the peripheral devices are included in a memory layer, and another portion are included in a peripheral device layer. Multiple layers of memory arrays and/or peripheral devices may be included, e.g., one peripheral device layer may control multiple layers of memory arrays, or different layers of memory arrays may have dedicated peripheral device layers. Different types of memory arrays, such as DRAM or SRAM, may be included.

An integrated circuit includes a physical layer interface having a control timing domain and a data timing domain, and circuits that enable the control timing domain during a change in power conservation mode in response to a first event, and that enable the data timing domain in response to a second event. The control timing domain can include interface circuits coupled to a command and address path, and the data timing domain can include interface circuits coupled to a data path.

A hardware/software co-compressed computing method for a static random access memory (SRAM) computing-in-memory-based (CIM-based) processing unit includes performing a data dividing step, a sparsity step, an address assigning step and a hardware decoding and calculating step. The data dividing step is performed to divide a plurality of kernels into a plurality of weight groups. The sparsity step includes performing a weight setting step. The weight setting step is performed to set each of the weight groups to one of a zero weight group and a non-zero weight group. The address assigning step is performed to assign a plurality of index codes to a plurality of the non-zero weight groups, respectively. The hardware decoding and calculating step is performed to execute an inner product to the non-zero weight groups and the input feature data group corresponding to the non-zero weight groups to generate the output feature data group.

In a memory device, pages are arrayed in a column direction, each page constituted by memory cells arrayed in row direction on an insulating substrate. Each memory cell includes a zonal P layer. N.sup.+ layers continuous with a source line and a bit line respectively are on both sides of the P layer. Gate insulating layers surround part of the P layer continuous with the N.sup.+ layer and part of the P layer continuous with the N.sup.+ layer 3b, respectively. One side surface and the other side surface of the gate insulating layer are covered with a gate conductor layer continuous with a first plate line and a gate conductor layer continuous with a second plate line, respectively. A gate conductor layer continuous with a word line surrounds the gate insulating layer.

Methods, systems, and devices for driving word lines using sub word line drivers are described. A memory array may include a plurality of sub-arrays arranged with gaps in between. Word lines may be arranged across multiple sub-arrays and drive access transistors that are used to selectively access rows (e.g., rows of memory cells) within the sub-arrays. In some examples, signals applied to selection devices driving the word lines may be over-driven for a duration at or near the desired transitions of the word line, and some signals may be driven to a relatively high level for a duration around the high and low transitions of a global row line. Whether a signal is over driven or driven to a relatively high level may depend on the type or types of transistors used in each word line driver.

There are provided a volatile memory device, and an operating method. The volatile memory device includes: a plurality of memory cells arranged in rows and columns and structured to store data; word lines; bit lines; a row decoder; a column decoder; and a control logic coupled to communicate with the row and column decoders and configured to, in an active period, provide the row decoder with a first command, and provide the column decoder with a second command, wherein the row decoder is further configured to: apply a first word line voltage higher than a ground voltage to a selected word line, from when the first command is provided; and for a duration over which the row decoder is activated, apply either a second word line voltage lower than the first word line voltage to the selected word line or no voltage to the selected word line.