A memory circuit includes a plurality of word lines, a word line driver coupled to the plurality of word lines, and a booster circuit coupled to the plurality of word lines. The word line driver is configured to output a first word line signal on a first word line of the plurality of word lines, and the booster circuit includes a first node configured to carry a first power supply voltage and is configured to couple the first word line of the plurality of word lines to the first node responsive to a pulse signal and the first word line signal.

A memory circuit includes a plurality of word lines, a word line driver coupled to the plurality of word lines, and a booster circuit coupled to the plurality of word lines. The word line driver is configured to output a first word line signal on a first word line of the plurality of word lines, and the booster circuit includes a first node configured to carry a first power supply voltage and is configured to couple the first word line of the plurality of word lines to the first node responsive to a pulse signal and the first word line signal.

An enable control circuit and a semiconductor memory are provided. The enable control circuit includes: a counting circuit, configured to: count past clock cycles, and determine a clock cycle count value; a selection circuit, configured to determine a target clock cycle count value according to a first config signal; and a control circuit, connected to the counting circuit and the selection circuit, and configured to: control an On Die Termination (ODT) path to be in an enabled state responsive to a level state of an ODT pin signal being inverted, and start the counting circuit; and control the ODT path to switch from the enabled state to a disabled state when the clock cycle count value reaches the target clock cycle count value.

An enable control circuit and a semiconductor memory are provided. The enable control circuit includes: a counting circuit, configured to: count past clock cycles, and determine a clock cycle count value; a selection circuit, configured to determine a target clock cycle count value according to a first config signal; and a control circuit, connected to the counting circuit and the selection circuit, and configured to: control an On Die Termination (ODT) path to be in an enabled state responsive to a level state of an ODT pin signal being inverted, and start the counting circuit; and control the ODT path to switch from the enabled state to a disabled state when the clock cycle count value reaches the target clock cycle count value.

An enable control circuit, which includes a counter circuit configured to count a current clock cycle and determine a clock cycle count value; a selection circuit configured to determine a clock cycle count target value according to a first setting signal; and a control circuit configured to control an ODT path to be enabled and start the counter circuit when the voltage level of an ODT pin signal is flipped over, control the ODT path to be switched from being enabled to disabled when the clock cycle count value reaches the clock cycle count target value and the voltage level of the ODT pin signal is not changed, and control the ODT path continue to be enabled when the clock cycle count value reaches the clock cycle count target value and the voltage level of the ODT pin signal flips again.

A semiconductor storage device includes a memory cell array and a control circuit. The memory cell array includes a plurality of memory strings, a plurality of word lines, each of which is connected to the memory strings, and a plurality of bit lines connected to the memory strings, respectively. The plurality of bit lines are grouped into a plurality of bit line groups. The control circuit is configured to receive a read command and first address information specifying one or more of the bit line groups. The control circuit is configured to, in response to the read command, read data selectively from each memory string connected to each bit line in the one or more bit line groups specified by the first address information, and output the read data.

A semiconductor storage device includes a memory cell array and a control circuit. The memory cell array includes a plurality of memory strings, a plurality of word lines, each of which is connected to the memory strings, and a plurality of bit lines connected to the memory strings, respectively. The plurality of bit lines are grouped into a plurality of bit line groups. The control circuit is configured to receive a read command and first address information specifying one or more of the bit line groups. The control circuit is configured to, in response to the read command, read data selectively from each memory string connected to each bit line in the one or more bit line groups specified by the first address information, and output the read data.

A signal sampling circuit includes: a signal input circuit, configured to determine a to-be-processed command signal and a to-be-processed chip select signal; a clock receiving circuit, configured to receive an initial clock signal and perform frequency division processing on the initial clock signal to obtain a first clock signal; a sampling and logic circuit, configured to perform two-stage sampling processing and logic operation processing on the to-be-processed chip select signal according to the first clock signal to obtain a chip select clock signal, where the chip select clock signal includes two pulses, and the width of each pulse is a preset clock cycle; and a decoding circuit, configured to perform decoding processing and sampling processing on the to-be-processed command signal according to the to-be-processed chip select signal and the chip select clock signal to obtain a target command signal.

A signal sampling circuit and a semiconductor memory device are provided. The signal sampling circuit includes a signal input circuit, configured to determine a to-be-processed command signal and a to-be-processed chip select signal; a mode selection circuit, configured to determine a target mode clock signal and a target mode chip select signal according to the mode selection signal; a first clock processing circuit, configured to perform sampling and logic operation on the to-be-processed chip select signal and the target mode chip select signal according to the target mode clock signal, to obtain a first chip select clock signal; a second clock processing circuit, configured to perform sampling and logic operation on the to-be-processed chip select signal and the target mode chip select signal according to the target mode clock signal, to obtain a second chip select clock signal; and a command decoding circuit, configured to determine a target command signal.

A signal sampling circuit and a semiconductor memory device are provided. The signal sampling circuit includes a signal input circuit, configured to determine a to-be-processed command signal and a to-be-processed chip select signal; a mode selection circuit, configured to determine a target mode clock signal and a target mode chip select signal according to the mode selection signal; a first clock processing circuit, configured to perform sampling and logic operation on the to-be-processed chip select signal and the target mode chip select signal according to the target mode clock signal, to obtain a first chip select clock signal; a second clock processing circuit, configured to perform sampling and logic operation on the to-be-processed chip select signal and the target mode chip select signal according to the target mode clock signal, to obtain a second chip select clock signal; and a command decoding circuit, configured to determine a target command signal.