A method for ZQ calibration for a data transmission driving circuit of each memory die in a memory chip package in which memory dies are stacked, includes generating a reference current through a reference resistor connected between a power terminal supplying a power voltage of the data transmission driving circuit and a ground terminal and a first transistor that is diode-connected; supplying first currents corresponding to the reference currents to a pull-up driver of each memory die; performing ZQ calibration of a pull-up driver of a corresponding memory die by comparing a first voltage formed by each first current with a reference voltage formed by the reference current in each of the plurality of memory dies; and performing ZQ calibration of a pull-down driver of the corresponding memory die based on an output impedance of the ZQ calibrated pull-up driver in each of the memory dies.

A method for ZQ calibration for a data transmission driving circuit of each memory die in a memory chip package in which memory dies are stacked, includes generating a reference current through a reference resistor connected between a power terminal supplying a power voltage of the data transmission driving circuit and a ground terminal and a first transistor that is diode-connected; supplying first currents corresponding to the reference currents to a pull-up driver of each memory die; performing ZQ calibration of a pull-up driver of a corresponding memory die by comparing a first voltage formed by each first current with a reference voltage formed by the reference current in each of the plurality of memory dies; and performing ZQ calibration of a pull-down driver of the corresponding memory die based on an output impedance of the ZQ calibrated pull-up driver in each of the memory dies.

Some embodiments include an integrated assembly having a deck over a base, and having memory cells supported by the deck. Each of the memory cells includes a capacitive unit and a transistor. The individual capacitive units of the memory cells each have a storage node electrode, a plate electrode, and a capacitor dielectric material between the storage node electrode and the plate electrode. A reference-voltage-generator includes resistive units supported by the deck. The resistive units are similar to the memory cells but include interconnecting units in place of the capacitive units. The interconnecting units of some adjacent resistive units are shorted to one another.

Some embodiments include an integrated assembly having a deck over a base, and having memory cells supported by the deck. Each of the memory cells includes a capacitive unit and a transistor. The individual capacitive units of the memory cells each have a storage node electrode, a plate electrode, and a capacitor dielectric material between the storage node electrode and the plate electrode. A reference-voltage-generator includes resistive units supported by the deck. The resistive units are similar to the memory cells but include interconnecting units in place of the capacitive units. The interconnecting units of some adjacent resistive units are shorted to one another.

A system and method for efficiently resetting data stored in a memory array are described. In various implementations, an integrated circuit includes a memory for storing data, and a processing unit that generates access requests for the data stored in the memory. When access circuitry of the memory array begins a reset operation, it reduces a power supply voltage level used by memory bit cells in a column of the array to a value less than a threshold voltage of transistors. Therefore, the p-type transistors of the bit cells do not contend with the write driver during a write operation. The access circuitry provides the reset data on the write bit lines, and asserts each of the write word lines of the memory array. To complete the write operation, the access circuitry returns the power supply voltage level from below the threshold voltage level to an operating voltage level.

A system and method for efficiently resetting data stored in a memory array are described. In various implementations, an integrated circuit includes a memory for storing data, and a processing unit that generates access requests for the data stored in the memory. When access circuitry of the memory array begins a reset operation, it reduces a power supply voltage level used by memory bit cells in a column of the array to a value less than a threshold voltage of transistors. Therefore, the p-type transistors of the bit cells do not contend with the write driver during a write operation. The access circuitry provides the reset data on the write bit lines, and asserts each of the write word lines of the memory array. To complete the write operation, the access circuitry returns the power supply voltage level from below the threshold voltage level to an operating voltage level.

Apparatuses and methods for row hammer counter mat. A memory array may have a number of memory mats and a counter memory mat. The counter mat stores count values, each of which is associated with a row in one of the other memory mats. When a row is accessed, the count value is read out, changed, and written back to the counter mat. In some embodiments, the count value may be processed within access logic of the counter mat, and a row hammer flag may be provided to the bank logic. In some embodiments, the counter mat may have a folded architecture where each sense amplifier is coupled to multiple bit lines in the counter mat. The count value may be used to determine if the accessed row is an aggressor so that its victims can be refreshed as part of a targeted refresh.

Control logic in a memory device selects two or more blocks of a plurality of blocks to concurrently scan during a scan operation. The control logic can further cause a first voltage to be applied to a dummy word line of each block of the two or more blocks to selectively couple a string of memory cells in each block of the two or more blocks to a different sense amplifier of a set of sense amplifiers coupled with the plurality of blocks. The control logic can cause a second voltage to be applied to a selected word line of each block of the two or more blocks to read a bit stored at a respective memory cell of the string of memory cells in each block out to the set of sense amplifier.

Control logic in a memory device selects two or more blocks of a plurality of blocks to concurrently scan during a scan operation. The control logic can further cause a first voltage to be applied to a dummy word line of each block of the two or more blocks to selectively couple a string of memory cells in each block of the two or more blocks to a different sense amplifier of a set of sense amplifiers coupled with the plurality of blocks. The control logic can cause a second voltage to be applied to a selected word line of each block of the two or more blocks to read a bit stored at a respective memory cell of the string of memory cells in each block out to the set of sense amplifier.

A memory device includes a first memory cell, a second memory cell, a third memory cell, a bitline sense amplifier, and a switch circuit. The first memory cell is connected to a first wordline and a first bitline. The second memory cell is connected to the first wordline and a second bitline. The third memory cell is connected to the first wordline and a third bitline. The bitline sense amplifier is connected to the third bitline. The switch circuit is connected to the first bitline, the second bitline, and the bitline sense amplifier. The switch circuit performs charge sharing between the first memory cell and the first bitline to generate a first reference voltage, and charge sharing between the second memory cell and the second bitline to generate a second reference voltage.