Disclosed herein are wavelength-division multiplexing devices using different angles of incidence (AOIs) at the WDM filters to provide for variable placement and orientation of WDM filters and channel ports, thereby decreasing the device footprint and allowing for shorter overall optical signal paths to increase signal performance and reliability. Also disclosed are stacked WDM filters for increased signal isolation.

Near normal incidence MUX/DEMUX designs may include an optical demultiplexer coupled to a photonics die, where the optical demultiplexer comprises an input fiber, thin film filters at a first surface of a substrate, a first mirror at the first surface of the substrate, and a second mirror at a second surface of the substrate. The optical demultiplexer may receive an input optical signal comprising a plurality of wavelength optical signals, reflect the input optical signal from the first mirror to the second mirror, reflect the input optical signal from the second mirror to a first of the thin film filters, communicate an optical signal at a first wavelength to the photonics die while reflecting others to the second mirror, reflect the other signals to a second of the plurality of thin film filters, and communicate an optical signal at a second wavelength to the photonics die.

Methods and systems for CWDM MUX/DEMUX designs for silicon photonics interposers are disclosed and may include an optical transceiver including a silicon photonics interposer, a polarization splitter, a lens array, and a prism with a coarse wavelength division multiplexing (CWDM) coating and a high reflectivity (HR) coating. The polarization splitter, lens array, and prism are coupled to the silicon photonics interposer. An input optical signal of a plurality of different wavelengths and polarizations may be received. Signals of different polarization may be spatially separated using the polarization splitter and signals of a first wavelength range may be reflected into the lens array using the CWDM coating while signals in a second wavelength range may be passed through. Signals of the second wavelength range may be reflected to the lens array using the HR coating, and optical signals may be coupled into the silicon photonics interposer using the lens array.

An optical subassembly may include a plurality of optical semiconductor devices arrayed such that a plurality of light beams respectively traveling in parallel in a first direction are emitted therefrom or incident thereon. The optical subassembly may also include a carrier on which the plurality of optical semiconductor devices are mounted. Adjacent ones of the plurality of optical semiconductor devices may be located at positions shifted in a second direction orthogonal to the first direction and may be shifted in the first direction so as not to face each other in the second direction.

A multi-path multi-mode light signal aggregation, transmission, separation apparatus and method are provided. The apparatus includes a shell, an array lens module configured to turn multi-path multi-mode light signals having different frequencies and emitted by an emitting terminal and further totally reflect the light signals to a receiving terminal, an aggregation lens module configured to aggregate the turned light signals into a single-path multi-mode light signal and further disperse the single-path multi-mode light signal into the multi-path multi-mode light signals with different frequencies, and a collimation lens module configured to collimate the aggregated single-path multi-mode light signal to an optical fiber for transmission and to collimate the received single-path multi-mode light signal to the aggregation lens module. The lens modules are arranged on a substrate in the shell. The number of optical fibers and the upgrading cost can be reduced, and the communication rate is increased.

Methods and systems for a free space CWDM MUX/DEMUX for integration with a grating coupler based silicon platform may include an optical assembly coupled to a photonic chip. The optical assembly includes a lens array on the top surface of the chip, an angled mirror, a transparent spacer, and a plurality of thin film filters. The optical assembly may receive an input optical signal comprising a plurality of optical signals at different wavelengths via an optical fiber coupled to the optical assembly, communicate the plurality of optical signals through the transparent spacer, pass a first of the plurality of optical signals through a corresponding one of the plurality of thin film filters while reflecting others of the plurality of optical signals back into the transparent spacer, and reflect the others of the plurality of signals towards a second of the plurality of thin film filters.

The present invention relates to a manufacturing method for an optical multiplexer provided with: a substrate having a first main surface and a second main surface that are parallel to each other; a mirror disposed on the first main surface; and an optical filter disposed on the second main surface. This method includes: a step for placing the mirror on the first main surface of the substrate, performing angular adjustment between the substrate and the mirror using an autocollimator, and then fixing the mirror to the substrate; and a step for placing the optical filter on the second main surface of the substrate, performing angular adjustment between the substrate and the optical filter using the autocollimator, and then fixing the optical filter to the substrate.

An optical receiver includes: an optical stub which includes an optical fiber; an optical demultiplexer; a plurality of photo detectors; a TIA; an optical block including a first concavity, a second concavity, a first reflective plane, a second reflective plane, and a third reflective plane, the first concavity being configured to hold the optical stub, the second concavity being configured to accommodate the optical demultiplexer, the first reflective plane and the second reflective plane being configured to sequentially reflect a multiplex optical signal so that the multiplex optical signal emitted from an end surface of the optical stub is folded back toward the optical stub and is sequentially incident to the optical demultiplexer, and the third reflective plane being configured to reflect the plurality of single-wavelength optical signals emitted from the optical demultiplexer toward the plurality of photo detectors; and a circuit board.

A laser machining device includes a plurality of oscillators to emit laser beams having different wavelengths from each other; a machining head to emit laser beams emitted from the respective oscillators to a machining object; a plurality of transmission fibers to transmit the laser beams to the machining head; a wavelength dispersion element; and a focusing lens to superpose the laser beams emitted from the transmission fibers, wherein the wavelength dispersion element is arranged at a position at which the laser beams are superposed by the focusing lens.

The precision TFF POSA is formed by pressing a TFF glass rod array into a top surface of a master glass block to flatten the otherwise curved TFFs formed using conventional TFF deposition processes on glass. The TFF glass rod array is secured to the master glass block with a securing material to form a fabrication structure, which is singulated to form precision TFF POSAs having TFF members with flat TFFs and long TFF member long axes. A fiber interface device is arranged at a back surface of the TFF POSA. Other fiber interface devices having device axes are arranged proximate the TFF members. The device axes are parallel to the TFF member long axes to form a WDM system with a parallel configuration. In this configuration, there is one positionally adjustable fiber interface device for each wavelength channel, which allows for optimizing WDM optical communication in Mux and DeMux directions.