Patent classifications
G06K19/07781
Component Identification
An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.
RFIC MODULE AND RFID TAG
An RFIC module is provided that includes an RFIC and an impedance matching circuit connected to an RFIC side first terminal electrode, an RFIC side second terminal electrode, an antenna side first terminal electrode and an antenna side second terminal electrode. The impedance matching circuit includes a first inductor, a second inductor, a third inductor, and a fourth inductor, and a conductor pattern that configures the first inductor, the second inductor, the third inductor, and the fourth inductor as a single coil-shaped pattern.
RFID tag, article including RFID tag, and method of manufacturing article
An RFID tag 10 attachable to an article in use that includes an RFIC module including an RFIC chip and a helical coil connected to the RFIC chip, and an antenna member that is a threadlike conductor having a portion helically wound on the RFIC module around a winding axis extending parallel to an extending direction of a coil axis of the helical coil.
PROXIMITY AND DUAL INTERFACE METAL CARDS AND METHODS OF MAKING CARD BODIES WITH TWO METAL LAYERS
Proximity cards or contactless smartcards manufactured by folding a metal layer along one or two fold lines to form a metal card body (MCB) having the dimensions of a standard ID-1 smartcard. An antenna structure (AS) on a flexible or rigid circuit sandwiched powering an RFID chip may be disposed between the folded metal layer or metal layers. A smartcard (SC) characterized by a booster antenna (BA) arranged on a rear plastic layer laminated to a front metal layer (ML) having a slit (S). A sense coil (SeC) component may be arranged around the slit, and may overlap the slit in a zigzag fashion or the like. The sense coil may have a loop, spiral or helix shape. The booster antenna may form a closed loop circuit or an open loop circuit.
RFID caps and lids
The present invention relates to an RFID cap for a cryogenic vial, the RFID cap comprising a cap body; and an RFID tag attached to the cap body, the RFID tag comprising an RFID chip and an antenna connected to the chip. The present invention also relates to an RFID box lid for a cryogenic vial storage box having an array of storage slots capable of receiving cryogenic vials; the RFID box lid comprising: a box lid body; and an array of RFID tags positioned on the box lid such that when the box lid is located on the storage box, each RFID tag in the array is aligned with a storage slot in the box.
Apparatus, method and device for making products incorporating an RFid
An apparatus (1) for the creation of products incorporating devices for radio frequency identification (RFID), said apparatus (1) being configured to operate according to a continuous processing line which includes, in sequence: a supply unit (2) of a substrate material; an add-chip unit (4), having means for the application of chips on the substrate material (41); an aerial-making assembly comprising: an aerial posing unit (5), configured to deposit a metal wire at each chip; an electrical connection unit, configured for electrically connecting the metal wire and a respective chip therebetween; a coupling unit (7), adapted to place a coating material on the substrate material; and a plurality of reading means (42, 62, 9) of each chip, arranged along said processing line, wherein said unit of aerial posing (5) comprises a plurality of devices (100) for realizing an aerial, wherein each device (100) is provided with a putting wire head (150) arranged at one end of a main body (101) and having a translational degree of freedom in a longitudinal direction (L), said putting wire head (150) comprising a guide element (102) rotatable according said longitudinal direction (L) and adapted to engage and guide the wire to deposit it on a substrate and a beak-like element (103) adapted to selectively abut in abutment on said rotatable element.
Wireless IC device
A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.
NEAR FIELD COMMUNICATION RING
A near field communication ring that can be read by nearby NFC-enabled devices. The ring comprises an annular shell and a near field communication transponder mounted on the annular shell. The near field communication transponder has a coil antenna that has a plurality of turns that each extend around the entire circumference of the annular shell. The rings has various potential applications including, for example, contactless payment, ticketing on mass transit systems, operation of NFC door locks or other access systems, identity authentication, venue or event entry/ticketing and the sharing of information with NFC-enabled smartphones.
RFID transponder in a plastic package for contactless communication
A RFID transponder including a chip, having an antenna to which the chip is connected for contactless communication, and including a plastic package (1) which accommodates these transponder components as integrated components, wherein the plastic package (1) forms a coil core (2) on its outer surface, on which a booster antenna having at least one coil winding (4) is arranged, wherein the coil winding (4) completely surrounds the integrated antenna in order to form an inductive coupling, and the two ends (5, 6) of the coil winding (4) form antenna wires of a dipole antenna for the UHF range.
Component identification
An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.