A wireless power receiver according to an embodiment wirelessly receives power from a wireless power transmitter. The wireless power receiver includes a printed circuit board having a reception space in a predetermined area, a receiving coil disposed in the reception space of the printed circuit board for receiving power from the wireless power transmitter, and a short-range communication antenna disposed on the printed circuit board while surrounding the receiving coil.

An antenna device includes a coil antenna including a coil conductor wound around a winding axis, and a planar conductor. The coil antenna includes a first region in which the coil conductor overlaps the planar conductor in a plan view of the planar conductor (when viewed from the Z-direction) and a second region in which the coil conductor does not overlap the planar conductor in the plan view of the planar conductor. The line width of the coil conductor in the first region is wider than the line width of a portion (portion extending in the X-direction) of the coil conductor in the second region. Accordingly, an inductance per unit length in the circumferential direction of the coil conductor in the first region is lower than the inductance per unit length in the circumferential direction of the coil conductor in the second region.

An antenna device, incorporated in an electronic apparatus, which communicates with an external device via an electromagnetic field signal, comprising: an antenna coil provided by winding a conducting wire in a two-dimensional shape and inductively coupled to the external device; and a thermal diffusion sheet provided so as to overlap the antenna coil at a surface of the antenna coil that faces the external device, wherein the thermal diffusion sheet is provided with a slit formed so as to extend from a region overlapping an opening of the antenna coil to an end of the thermal diffusion sheet and a thermal diffusion sheet side opening or slit connected to the slit and formed in the region overlapping the opening of the antenna coil.

Embodiments are directed to assembling an RFID tag through wire bonding techniques. In some examples, the RFID tag may be assembled by wire bonding of an RFID integrated circuit (IC) to an antenna through a hole in a substrate. In other examples, methods for assembling RFID tags from a singulated IC or diced ICs still on a dicing frame may be disclosed. The disclosed methods may use a single metal layer for producing RFID tags with multi-turn loop antenna.

A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF, 320A) may be in the form of a ring, having an inner edge (IE), an outer edge IE, 324) and a central opening (OP), disposed closely adjacent to and surrounding the module antenna (MA). A slit (S) may extend from the inner edge (IE) to the outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is open loop. An RFID device may comprise a transponder chip module (TCM) having a module antenna (MA), a device substrate (DS), and an antenna structure (AS) disposed on the device substrate (DS) and connected with the module antenna (MA). A portion of a conductive layer (CL, 904) remaining after etching a module antenna (MA) may be segmented to have several smaller isolated conductive structures.

Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

A non-contact communication medium according to an embodiment of the present technology is a non-contact communication medium for a recording medium cartridge, including: a circuit component; a support substrate; and an antenna coil. The circuit component has a memory unit capable of storing management information relating to the recording medium cartridge therein. The support substrate supports the circuit component. The antenna coil includes a coil unit that is electrically connected to the circuit component and formed on the support substrate, an inductance value of the coil unit being 0.3 H or more and 2.0 H or less.

A system for manufacturing an antenna includes a first stamping station, a pressure sensitive adhesive (PSA) alignment station, a bonding station, a second stamping station, and a ferrite shield station. The first stamping station receives a sheet of metallic material and stamps the sheet to form an antenna including traces, contacts, a carrier connected to the traces, and a tie-bar connected between the traces. The PSA alignment station receives the stamped antenna and aligns a PSA area of a pad with the traces, the PSA area being substantially the same shape as the traces. The bonding station bonds the PSA area to the traces after it has been aligned with the traces. The second stamping station performs a second stamping of the antenna and the PSA area to remove the carrier and the tie-bar. The ferrite shield station bonds a ferrite shield to the antenna stamped for a second time.

A radio frequency identification (RFID) tag. In one embodiment, an RFID tag includes an integrated circuit die. The integrated circuit die includes circuitry configured to store information and transmit the stored information responsive to reception of a radio frequency (RF) signal. The integrated circuit die also includes an antenna coupled to the circuitry. The antenna is configured to transmit and receive RFID signals. Further, the antenna and the interconnects of the circuitry are formed of a same metal, and fabricated using a same semiconductor process.

A micro radio frequency identification tag for use on an article, the micro radio frequency identification tag comprises a substrate having a first surface and a second surface, each surface including a width and a longitudinal length, the longitudinal length being greater than the width; a chip anchor having a first chip attachment pad and a second chip attachment pad; a radio frequency identification chip operatively retained on the first surface by the chip anchor; a component anchor having a first component attachment pad and a second component attachment pad; a passive component operatively retained on the first surface by the component anchor; a continuous planar antenna operatively retained on the second surface; a first conductive trace interconnect segment connected to the continuous planar antenna and the first chip attachment pad; a second conductive trace interconnect segment connected to the continuous planar antenna and the second chip attachment pad; a third conductive trace interconnect segment connected to the continuous planar antenna and the first component attachment pad; a fourth conductive trace interconnect segment connected to the continuous planar antenna and the second component attachment pad.