The present invention relates to a metal card and a card manufacturing method, and the metal card includes a metal sheet, a machined part made of a plastic material in such a manner as to be inserted into one side surface of the metal sheet, an insulating sheet with a ferromagnetic insulating material in such a manner as to be attached to the underside of the metal sheet, and an inlay sheet with antenna coils in such a manner as to be attached to the underside of the insulating sheet, wherein the metal sheet has a machined part insertion portion formed on one side surface thereof to insert the machined part, and the ferromagnetic insulating material has the shape of one or more pieces or powder.

A wireless power receiver according to an embodiment wirelessly receives power from a wireless power transmitter. The wireless power receiver includes a printed circuit board having a reception space in a predetermined area, a receiving coil disposed in the reception space of the printed circuit board for receiving power from the wireless power transmitter, and a short-range communication antenna disposed on the printed circuit board while surrounding the receiving coil.

A near field communication ring that can be read by nearby NFC-enabled devices. The ring comprises an annular shell and a near field communication transponder mounted on the annular shell. The near field communication transponder has a coil antenna that has a plurality of turns that each extend around the entire circumference of the annular shell. The rings has various potential applications including, for example, contactless payment, ticketing on mass transit systems, operation of NFC door locks or other access systems, identity authentication, venue or event entry/ticketing and the sharing of information with NFC-enabled smartphones.

A card-type wireless communication device is provided that suppresses a deterioration in communication performance of the dipole antenna while ensuring a larger coil antenna size in a limited card size. The card-type wireless communication device includes a coil antenna and a dipole antenna. The dipole antenna includes first dipole element including a first connection end connected to a second-frequency-band RFIC element, first linear part that extends from the first connection end along an outer edge of the coil antenna, and a first open end facing the outer edge of the coil antenna via the first linear part. Moreover, a second dipole element includes a second connection end connected to second-frequency-band RFIC element, and a second open end at a position farther from the outer edge of the coil antenna than a shortest distance between the first linear part and the outer edge of the coil antenna.

A Non-transferable Radio Frequency Identification (RFID) assembly for attachment to an article comprises a RFID module; and a antenna module coupled with the RFID module, the antenna module comprising a conductive layer, a substrate, and an adhesive modification layer between the conductive layer and the substrate, the adhesive modification layer configured such that when the assembly is attached to the article and attempt to remove the assembly will cause the substrate to release and leave the conductive layer intact.

Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset from or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like carbon coating filling the slit. Key fobs similarly fabricated. Smart cards with metal card bodies (MCB). Plastic-Metal-Plastic smartcards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.

An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.

An antenna device includes a substrate, a chip, and an antenna. The chip is disposed on the substrate, and the chip has at least two pads. The antenna is disposed on the substrate, and the chip is disposed between the substrate and the antenna. The antenna has a first bonding line segment and a second bonding line segment electrically connected to the at least two pads respectively. The first bonding line segment is located at an outermost coil of the antenna, and is disposed across a short side direction of the chip in a manner of completely covering one of the at least two pads. The second bonding line segment is located at an innermost coil of the antenna, and is disposed across the short side direction of the chip in a manner of completely covering another of the at least two pads.

An RFIC module is provided that includes an RFIC and an impedance matching circuit connected to an RFIC side first terminal electrode, an RFIC side second terminal electrode, an antenna side first terminal electrode and an antenna side second terminal electrode. The impedance matching circuit includes a first inductor, a second inductor, a third inductor, and a fourth inductor, and a conductor pattern that configures the first inductor, the second inductor, the third inductor, and the fourth inductor as a single coil-shaped pattern.

RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.