Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

Disclosed is a preparation method of an all-weather self-healing stretchable conductive material, which uses acrylic acid and modified polyglutamic acid as a substrate, adds Fe.sup.3+ to form coordination, adjusts the volume ratio of water and glycerin, and heats to generate radical polymerization, so as to obtain a uniform double-layer three-dimensional network structure. The obtained polyacrylic acid and polyglutamic acid composite hydrogel has good mechanical properties and characteristics of rapid self-healing. A composite carbon film is prepared by depositing a metal layer of 20 nm to 80 nm thick on a single-layer aligned carbon film by magnetron sputtering, and then the composite hydrogel is adhered to each of the upper and lower sides of the composite carbon film respectively to form an all-weather self-healing stretchable conductive material of a sandwich structure. The preparation method of the invention is simple, the source of raw materials is plenty, and the obtained materials have good electrical and mechanical properties and have broad application prospects in the fields of flexible stretchable devices, wearable devices, and soft-bodied robots and the like.

Disclosed is a preparation method of an all-weather self-healing stretchable conductive material, which uses acrylic acid and modified polyglutamic acid as a substrate, adds Fe.sup.3+ to form coordination, adjusts the volume ratio of water and glycerin, and heats to generate radical polymerization, so as to obtain a uniform double-layer three-dimensional network structure. The obtained polyacrylic acid and polyglutamic acid composite hydrogel has good mechanical properties and characteristics of rapid self-healing. A composite carbon film is prepared by depositing a metal layer of 20 nm to 80 nm thick on a single-layer aligned carbon film by magnetron sputtering, and then the composite hydrogel is adhered to each of the upper and lower sides of the composite carbon film respectively to form an all-weather self-healing stretchable conductive material of a sandwich structure. The preparation method of the invention is simple, the source of raw materials is plenty, and the obtained materials have good electrical and mechanical properties and have broad application prospects in the fields of flexible stretchable devices, wearable devices, and soft-bodied robots and the like.

Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

An aluminum alloy material comprising a composition containing no less than 1.2 at % and no more than 6.5 at % of Fe, no less than 0.15 at % and no more than 5 at % of at least one first element selected from the group consisting of Nd, W, and Sc, and no less than 0.005 at % and no more than 2 at % of at least one second element selected from the group consisting of C and B, the balance being Al and inevitable impurities.

The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.