H01B1/20

Conductive polymer emulsion

The present invention provides for an emulsion comprising solid particles of a single composition, or a mixture thereof, comprising a polymer comprising one monomer of an aryl methacrylate, or a mixture thereof, co-polymerized with a monomer of an alkyl methacrylate, or a mixture thereof; wherein Ar is an aryl group and R is an alkyl group, and n:m has a ratio of from about 0:100 to about 100:0.

FINE METAL PARTICLE DISPERSION PRODUCTION METHOD
20210379654 · 2021-12-09 · ·

The present invention relates to [1] a process for producing a metal fine particle dispersion containing metal fine particles (a) dispersed with a polymer B, including the step 1 of mixing a metal oxide A, the polymer B and a compound C with each other, in which the polymer B contains a hydrophilic group; the compound C is a dihydric alcohol represented by the general formula (1); and the metal fine particles (a) have a cumulant average particle size of not more than 50 nm, and [2] an ink containing the metal line particle dispersion obtained by the production process described in the above [1].

Conductive film manufacturing method

Provided is a method for manufacturing a conductive film, including forming a coating of a composition that contains conductivity-imparting particles and photo-sintering the coating, wherein, prior to the photo-sintering of the coating, the coating is compressed in the thickness direction thereof. It is preferable that the coating be compressed at a temperature at which a binding agent contained in the composition shows a storage modulus of 100 MPa or less. It is also preferable that the coating be compressed so that the compression rate in the thickness direction is from 25% to 80%. It is preferable that, in the photo-sintering step, the light irradiation be performed through irradiation with pulsed light.

Conductive Paste, Conductive Film, and Method for Producing Conductive Film

Provided is a technique for a conductive paste having high conductivity and low cost. The conductive paste includes a conductive filler, a polymer, and a solvent, wherein the conductive filler includes co-continuous fibrous carbon having a three-dimensional network structure in which carbon is branched.

Thermocurable electroconductive adhesive

Conventionally, there was a need to add a large amount of electroconductive particles for improving conductivity, but when the electroconductive particles were added too much, initial viscosity was increased, and at the same time, it was difficult to stabilize preservation stability. However, conductivity can be improved without adding a large amount of the electroconductive particles by selecting a monomer, and at the same time, preservation stability can be stabilized by using certain electroconductive particles. A thermocurable electroconductive adhesive including components (A) to (D): component (A): an oligomer having a (meth)acryl group; component (B): a monomer having one methacryl group in a molecule; component (C): an organic peroxide having a specific structure; and component (D): electroconductive particles which are surface-treated with a stearic acid.

Thermocurable electroconductive adhesive

Conventionally, there was a need to add a large amount of electroconductive particles for improving conductivity, but when the electroconductive particles were added too much, initial viscosity was increased, and at the same time, it was difficult to stabilize preservation stability. However, conductivity can be improved without adding a large amount of the electroconductive particles by selecting a monomer, and at the same time, preservation stability can be stabilized by using certain electroconductive particles. A thermocurable electroconductive adhesive including components (A) to (D): component (A): an oligomer having a (meth)acryl group; component (B): a monomer having one methacryl group in a molecule; component (C): an organic peroxide having a specific structure; and component (D): electroconductive particles which are surface-treated with a stearic acid.

INORGANIC SOLID ELECTROLYTE-CONTAINING COMPOSITION, SHEET FOR ALL-SOLID STATE SECONDARY BATTERY, AND ALL-SOLID STATE SECONDARY BATTERY, AND MANUFACTURING METHODS FOR SHEET FOR ALL-SOLID STATE SECONDARY BATTERY AND ALL-SOLID STATE SECONDARY BATTERY

There is provided an inorganic solid electrolyte-containing composition containing an inorganic solid electrolyte, a polymer binder, and a dispersion medium having an SP value of 15 to 21 MPa.sup.1/2, in which the binder includes a polymer binder consisting of a styrene-ethylene-butylene-styrene copolymer in which a content of a styrene constitutional component is more than 0% by mole and less than 50% by mole, the adsorption rate of the polymer binder with respect to the inorganic solid electrolyte is less than 60%. There are also provided a sheet for an all-solid state secondary battery and an all-solid state secondary battery, in which this inorganic solid electrolyte-containing composition is used, and manufacturing methods for a sheet for an all-solid state secondary battery, and an all-solid state secondary battery.

Curable semiconducting composition

A rubberless, strippable, semiconducting composition that includes an ethylene-(carboxylic ester) copolymer having a low comonomeric unit content, carbon black, and a strippability additive combination comprising an amide wax and a silicone oil. Also provided are a cured product made from the composition, methods of making and using same, and articles containing same.

Curable semiconducting composition

A rubberless, strippable, semiconducting composition that includes an ethylene-(carboxylic ester) copolymer having a low comonomeric unit content, carbon black, and a strippability additive combination comprising an amide wax and a silicone oil. Also provided are a cured product made from the composition, methods of making and using same, and articles containing same.