Patent classifications
H01B1/20
Electrically conductive composition and biosensor
The electrically conductive composition includes an electrical conductive polymer, a binder resin, and at least one of a cross-linking agent and a plasticizer.
Electrically conductive composition and biosensor
The electrically conductive composition includes an electrical conductive polymer, a binder resin, and at least one of a cross-linking agent and a plasticizer.
CONDUCTIVE RESIN, MAUFACTURING METHOD FOR THE SAME, AND SENSOR
Porous conductive resin is produced by: mixing a hydrogen bond donor compound and a hydrogen bond acceptor compound to produce deep eutectic liquid (DEL); adding conductive materials to the DEL to produce gel; adding resin that is insoluble in the DEL to the gel to produce ink made of the gel dispersed in the resin; forming the produced ink into a formed object having a desired shape; curing the resin in the formed object; and evaporating the DEL in the formed object including the cured resin.
Electrically conductive urethane foam
A high durability electrically conductive urethane foam acts as a variable resistor such that as the foam deflects, conductive particles get closer together, causing electrical resistance to decrease. The electrically conductive foam is further integrated into an automotive seat sensor system.
Electrically conductive urethane foam
A high durability electrically conductive urethane foam acts as a variable resistor such that as the foam deflects, conductive particles get closer together, causing electrical resistance to decrease. The electrically conductive foam is further integrated into an automotive seat sensor system.
Anisotropic conductive adhesive bond in a piezoelectric micro-electro-mechanical system scanning mirror system
A piezoelectric MEMS scanning mirror system is provided. In particular, the efficiency and life of the system are improved by use of new bonding methods. Mechanical and electrical connections between the actuator frame of a piezoelectric MEMS scanning mirror system and the piezoelectric actuators in the system may be created using an anisotropic conductive adhesive. An anisotropic conductive adhesive only conducts electricity across the bond line between a lower portion of the piezoelectric actuator and a top of the metal frame. One way this is done is to provide a sparse loading of conductive particles. When the piezoelectric element is compressed against the frame, the conductive particles only form a conductive path across the bond line. Grit blasting, sanding, or chemical etching may be used to roughen the metal surface prior to bonding. A surface roughness between 2 RMS and 6 RMS may be created on the metal frame.
MICROLAYER COEXTRUSION OF ELECTRICAL END PRODUCTS
A method and system for extruding multiple laminated flow streams using microlayer extrusion, and in particular to creating and forming products with electrical properties that are formed from layers and particles with dimensions in the micro to nanometer range.
MICROLAYER COEXTRUSION OF ELECTRICAL END PRODUCTS
A method and system for extruding multiple laminated flow streams using microlayer extrusion, and in particular to creating and forming products with electrical properties that are formed from layers and particles with dimensions in the micro to nanometer range.
Electrically conductive paste
An electrically conductive paste includes: an elastic binder; and a conductive filler. The conductive filler includes: at least one spherical conductive filler, at least one plate-like conductive filler, and at least one rod-like conductive filler. In an embodiment, the spherical filler has a mean particle diameter, measured in accordance with ISO 21501-2:2019-11 of at most 200 μm.
Electrically conductive paste
An electrically conductive paste includes: an elastic binder; and a conductive filler. The conductive filler includes: at least one spherical conductive filler, at least one plate-like conductive filler, and at least one rod-like conductive filler. In an embodiment, the spherical filler has a mean particle diameter, measured in accordance with ISO 21501-2:2019-11 of at most 200 μm.