Patent classifications
H01B1/20
COMPOSITION FOR FORMING SOLAR CELL ELECTRODE AND ELECTRODE PREPARED USING THE SAME
A composition for solar cell electrodes including a conductive powder, a glass frit, and an organic vehicle. The glass frit contains tellurium (Te), sodium (Na), zinc (Zn), and at least one of lead (Pb) and bismuth (Bi). A molar ratio of the sum of lead and bismuth to zinc ranges from about 1 to about 20. A molar ratio of tellurium to sodium ranges from about 1 to about 15.
Method of manufacturing transparent conductor, transparent conductor and device for manufacturing the same, and device for manufacturing transparent conductor precursor
According to one embodiment, a method of manufacturing a transparent conductor is provided. In the method, a silver nanowire layer including a plurality of silver nanowires and having openings is formed on a graphene film supported by a copper support. Then, a transparent resin layer insoluble in a copper-etching solution is formed on the silver nanowire layer such that the transparent resin layer contacts the graphene film through the openings. The copper support is then brought into contact with the non-acidic copper-etching solution to remove the copper support, thereby exposing the graphene film.
Method of manufacturing transparent conductor, transparent conductor and device for manufacturing the same, and device for manufacturing transparent conductor precursor
According to one embodiment, a method of manufacturing a transparent conductor is provided. In the method, a silver nanowire layer including a plurality of silver nanowires and having openings is formed on a graphene film supported by a copper support. Then, a transparent resin layer insoluble in a copper-etching solution is formed on the silver nanowire layer such that the transparent resin layer contacts the graphene film through the openings. The copper support is then brought into contact with the non-acidic copper-etching solution to remove the copper support, thereby exposing the graphene film.
Method for producing binder resin, method for producing resin composition, binder resin, and resin composition
A method for producing a binder resin by a reaction of a cellulose derivative, a polyvinyl acetal, and a bonding agent that has in the molecule at least two functional groups that can react to hydroxyl groups in the polyvinyl acetal and the cellulose derivative. In the production method, the content of the bonding agent is at least double the molar quantity of whichever has the greater number of moles between the polyvinyl acetal and the cellulose derivative. The produced binder resin is favorable in a coating paste such as a conductive paste, and causes an improvement in film quality such as the smoothness and denseness of a coating film formed by the paste.
Conductive paste and multilayer ceramic electronic component
A conductive paste for forming external electrodes for a multilayer ceramic electronic component. The paste contains a glass composition containing (a) BaO, (b) at least one of SrO and CaO, (c) ZnO, (d) B.sub.2O.sub.3, and (e) at least one selected from the group consisting of SiO.sub.2, Al.sub.2O.sub.3, and TiO.sub.2, in which the total content percentage of BaO, SrO, and CaO is 30 mol % or more, the molar ratio represented by B.sub.2O.sub.3/(SiO.sub.2+Al.sub.2O.sub.3+TiO.sub.2) is 0.7 to 1.5, and the content percentage of ZnO is 0 to 5 mol %.
Conductive paste and multilayer ceramic electronic component
A conductive paste for forming external electrodes for a multilayer ceramic electronic component. The paste contains a glass composition containing (a) BaO, (b) at least one of SrO and CaO, (c) ZnO, (d) B.sub.2O.sub.3, and (e) at least one selected from the group consisting of SiO.sub.2, Al.sub.2O.sub.3, and TiO.sub.2, in which the total content percentage of BaO, SrO, and CaO is 30 mol % or more, the molar ratio represented by B.sub.2O.sub.3/(SiO.sub.2+Al.sub.2O.sub.3+TiO.sub.2) is 0.7 to 1.5, and the content percentage of ZnO is 0 to 5 mol %.
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
An anisotropic electrically conductive film that is suitable for use in fine-pitch FOG connections and COG connections and that also can reduce increases in production costs associated with increasing the electrically conductive particle density. The anisotropic electrically conductive film includes an electrically insulating adhesive layer and electrically conductive particles disposed within the electrically insulating adhesive layer. The anisotropic electrically conductive film has electrically conductive particle disposition regions that are disposed in a manner corresponding to the arrangement of terminals of electronic components to be connected. The electrically conductive particle disposition regions are formed periodically in the longitudinal direction of the anisotropic electrically conductive film. The anisotropic electrically conductive film also has buffer regions in which no electrically conductive particles are disposed that are formed between adjacent electrically conductive particle disposition regions for connection.
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
An anisotropic electrically conductive film that is suitable for use in fine-pitch FOG connections and COG connections and that also can reduce increases in production costs associated with increasing the electrically conductive particle density. The anisotropic electrically conductive film includes an electrically insulating adhesive layer and electrically conductive particles disposed within the electrically insulating adhesive layer. The anisotropic electrically conductive film has electrically conductive particle disposition regions that are disposed in a manner corresponding to the arrangement of terminals of electronic components to be connected. The electrically conductive particle disposition regions are formed periodically in the longitudinal direction of the anisotropic electrically conductive film. The anisotropic electrically conductive film also has buffer regions in which no electrically conductive particles are disposed that are formed between adjacent electrically conductive particle disposition regions for connection.
SOLID ELECTROLYTE COMPOSITION, ELECTRODE SHEET FOR BATTERY AND METHOD FOR MANUFACTURING THE SAME, AND ALL SOLID STATE SECONDARY BATTERY AND METHOD FOR MANUFACTURING THE SAME
A solid electrolyte composition includes an inorganic solid electrolyte having a conductivity of ions of metals belonging to Group I or II and a compound represented by General Formula (1). In General Formula (1), R.sup.1 represents an m+n-valent linking group, R.sup.2 and R.sup.3 represent single bonds or divalent linking groups, A.sup.1 represents a monovalent group including one or more groups selected from an acidic group, a group having a basic nitrogen atom, a (meth)acryloyl group, a (meth)acrylamide group, an alkoxysilyl group, an epoxy group, an oxetanyl group, a NCO group, a SN group, a SH group, and a OH group, P.sup.1 represents a group having a hydrocarbon group having 8 or more carbon atoms, m represents 1 to 8, n represents 1 to 9, and m+n satisfies 3 to 10.
(A.sup.1-R.sup.2R.sup.1R.sup.3-P.sup.1).sub.m (1)
Processes for nanoparticle dispersions with ionic liquid-based stabilizers
The disclosure generally relates to a dispersion of nanoparticles in a liquid medium. The liquid medium is suitably water-based and further includes an ionic liquid-based stabilizer in the liquid medium to stabilize the dispersion of nanoparticles therein. The stabilizer can be polymeric or monomeric and generally includes a moiety with at least one quaternary ammonium cation from a corresponding ionic liquid. The dispersion suitably can be formed by shearing or otherwise mixing a mixture/combination of its components. The dispersions can be used to form nanoparticle composite films upon drying or otherwise removing the liquid medium carrier, with the stabilizer providing a nanoparticle binder in the composite film. The films can be formed on essentially any desired substrate and can impart improved electrical conductivity and/or thermal conductivity properties to the substrate.