Monodispersed metal nanoparticles are prepared by preparing a homogeneous metal complex solution by mixing metal salt with a complexing agent in solvent. A precipitating agent is added into the homogeneous metal complex solution to form a slurry. A homogeneous mixture of reducing agent and solvent is added to perform reducing reaction on the slurry to form metal nanoparticles in a controlled environment under gas purge. A capping agent is added to modify surface properties of metal nanoparticles. The metal nanoparticles are washed and the metal nanoparticles are recovered by phase extraction or centrifugation. The technique can be used to prepare conductive pastes with bimodal particle size distribution.

Monodispersed metal nanoparticles are prepared by preparing a homogeneous metal complex solution by mixing metal salt with a complexing agent in solvent. A precipitating agent is added into the homogeneous metal complex solution to form a slurry. A homogeneous mixture of reducing agent and solvent is added to perform reducing reaction on the slurry to form metal nanoparticles in a controlled environment under gas purge. A capping agent is added to modify surface properties of metal nanoparticles. The metal nanoparticles are washed and the metal nanoparticles are recovered by phase extraction or centrifugation. The technique can be used to prepare conductive pastes with bimodal particle size distribution.

An conductive paste comprises inorganic particles having alkylamine with 6 or less of carbon number on at least a portion of a surface, a polymer dispersant having a pigment affinity group in a main chain and/or a plurality of side chains, and, that comprising a polymer with a comb structure having a plurality of side chains constituting a solvation portion, a polymer having a plurality of pigment affinity portions made from a pigment affinity group in the main chain or a straight-chain polymer having a pigment affinity portion made from a pigment affinity group in one terminal of the main chain, a dispersion medium, wherein a weight reduction percentage at the time of heating solid content of the conductive paste from room temperature to 500° C. by thermal analysis is 15% by weight or less.

An conductive paste comprises inorganic particles having alkylamine with 6 or less of carbon number on at least a portion of a surface, a polymer dispersant having a pigment affinity group in a main chain and/or a plurality of side chains, and, that comprising a polymer with a comb structure having a plurality of side chains constituting a solvation portion, a polymer having a plurality of pigment affinity portions made from a pigment affinity group in the main chain or a straight-chain polymer having a pigment affinity portion made from a pigment affinity group in one terminal of the main chain, a dispersion medium, wherein a weight reduction percentage at the time of heating solid content of the conductive paste from room temperature to 500° C. by thermal analysis is 15% by weight or less.

The present disclosure relates to electrical machines. The teachings thereof may be embodied in a corona shielding system, especially an outer corona shielding system, for an electrical machine. For example, a corona shielding system may include: a polymeric matrix; particles disposed in the matrix, including a mica-coated core and a layer of metal oxide disposed on the core; and a surface functionalization material disposed on a surface of the particles for binding to the matrix.

The present disclosure relates to electrical machines. The teachings thereof may be embodied in a corona shielding system, especially an outer corona shielding system, for an electrical machine. For example, a corona shielding system may include: a polymeric matrix; particles disposed in the matrix, including a mica-coated core and a layer of metal oxide disposed on the core; and a surface functionalization material disposed on a surface of the particles for binding to the matrix.

An electroconductive resin composite having excellent impact strength, in which an impact modifier and an electroconductive filler are dispersed in a matrix resin, is provided. The impact modifier has an average particle size of 5 μm or less and is dispersed in a domain form in a polyamide matrix resin, and the number of agglomerates of the filler in which a longest diameter of an agglomerate particle is 10 μm or more is 50 or less, in 50 scanning electron microscope (SEM) images of an area of 0.5 mm×0.35 mm, captured at 250× magnification.

An electroconductive resin composite having excellent impact strength, in which an impact modifier and an electroconductive filler are dispersed in a matrix resin, is provided. The impact modifier has an average particle size of 5 μm or less and is dispersed in a domain form in a polyamide matrix resin, and the number of agglomerates of the filler in which a longest diameter of an agglomerate particle is 10 μm or more is 50 or less, in 50 scanning electron microscope (SEM) images of an area of 0.5 mm×0.35 mm, captured at 250× magnification.

This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.

This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.