H01B3/18

Efficient and manufacturable mechanical computing

Logic mechanisms operate to define the position of at least one mechanical output based on the position of at least one mechanical input. Some mechanisms are configured to determine, based on the input position(s), whether a path to transmit motion to an output exists or does not exist. Some mechanisms are configured to determine, based on the input position(s), whether or not motion of a driven element can be accommodated without moving an output. Some mechanisms are configured to determine, based on the input position(s), whether or not one or more elements are constrained to transmit motion to an output.

Managing non-contact forces in mechanisms

Mechanisms can be designed to manage non-contact forces to reduce energy consumption and/or to control interactions between the parts. Management of non-contact forces is especially useful in micro-scale and nano-scale mechanisms, where van der Waals attraction between parts of the mechanism may be significant to the operation of the mechanism.

Managing non-contact forces in mechanisms

Mechanisms can be designed to manage non-contact forces to reduce energy consumption and/or to control interactions between the parts. Management of non-contact forces is especially useful in micro-scale and nano-scale mechanisms, where van der Waals attraction between parts of the mechanism may be significant to the operation of the mechanism.

Efficient and manufacturable mechanical computing

Logic mechanisms operate to define the position of at least one mechanical output based on the position of two or more mechanical inputs, and employ at least one control element that functions to determine (at least in part) whether an output is moved, and which provides the same function in more than one position. Some mechanisms are configured to determine, based on the input positions, whether a path to transmit motion to an output exists or does not exist. Some mechanisms are configured to determine, based on the input positions, whether or not motion of a driven element can be accommodated without moving an output.

Efficient and manufacturable mechanical computing

Logic mechanisms operate to define the position of at least one mechanical output based on the position of two or more mechanical inputs, and employ at least one control element that functions to determine (at least in part) whether an output is moved, and which provides the same function in more than one position. Some mechanisms are configured to determine, based on the input positions, whether a path to transmit motion to an output exists or does not exist. Some mechanisms are configured to determine, based on the input positions, whether or not motion of a driven element can be accommodated without moving an output.

Power Cable With Mechanical Support Layer

A power cable including: a conductor, an insulation system including an inner semiconducting layer arranged around the conductor, an insulation layer arranged around the inner semiconducting layer, and an outer semiconducting layer arranged around the insulation layer, an elastic mechanical support layer arranged around the outer semiconducting layer, a metallic water blocking layer having a longitudinal weld seam, the metallic water blocking layer being arranged around the mechanical support layer, wherein the mechanical support layer is permanently thermally expanded radially as a result of a heat treatment process, thereby mechanically supporting the metallic water blocking layer.

Power Cable With Mechanical Support Layer

A power cable including: a conductor, an insulation system including an inner semiconducting layer arranged around the conductor, an insulation layer arranged around the inner semiconducting layer, and an outer semiconducting layer arranged around the insulation layer, an elastic mechanical support layer arranged around the outer semiconducting layer, a metallic water blocking layer having a longitudinal weld seam, the metallic water blocking layer being arranged around the mechanical support layer, wherein the mechanical support layer is permanently thermally expanded radially as a result of a heat treatment process, thereby mechanically supporting the metallic water blocking layer.

POLYMERIC RESIN FOR DIELECTRIC APPLICATIONS
20230348635 · 2023-11-02 ·

There is provided a resin composition from a mixture including: (a) 60-90 weight % of at least one thermosetting resin; and (b) 10-40 weight % of at least one aryl ether resin. The resin composition can be used in electronics applications.

ELECTRICAL GROUNDING ASSEMBLY

An electrical grounding assembly includes an electrically conductive metal grounding substrate that is electrically connectable to a structure to be electrically grounded. A corrosion-protective jacket is on the grounding substrate. The jacket is electrically conductive and water impermeable, and includes a polymeric matrix and a particulate carbonaceous material dispersed in the polymeric matrix.

ELECTRICAL GROUNDING ASSEMBLY

An electrical grounding assembly includes an electrically conductive metal grounding substrate that is electrically connectable to a structure to be electrically grounded. A corrosion-protective jacket is on the grounding substrate. The jacket is electrically conductive and water impermeable, and includes a polymeric matrix and a particulate carbonaceous material dispersed in the polymeric matrix.