A system, comprising a bus bar having a first through-hole formed therein and a first current sensor that is disposed adjacent to the first branch. The first through-hole is arranged to define, at least in part, a first branch of the bus bar and a second branch of the bus bar. The first branch has different length and/or thickness than the second branch. The first current sensor is arranged to measure an electrical current through the bus bar.

A system, comprising a bus bar having a first through-hole formed therein and a first current sensor that is disposed adjacent to the first branch. The first through-hole is arranged to define, at least in part, a first branch of the bus bar and a second branch of the bus bar. The first branch has different length and/or thickness than the second branch. The first current sensor is arranged to measure an electrical current through the bus bar.

An insulated wire having at least one layer of coating of the wire, comprising a thermosetting resin layer, at the outer periphery of a conductor, wherein the thermosetting resin layer is comprised of thermosetting resin layers having a laminated structure formed by coating and baking a thermosetting resin varnish; and wherein, in said laminated structure, an innermost layer having contact with the conductor comprises a thermosetting resin having an imide bond and is a layer having an average thickness of more than 5 μm and 10 μm or less; a method of producing the insulated wire; a coil; a rotating electrical machine; and an electrical or electronic equipment.

This copper alloy for electronic or electric devices includes: Mg: 0.15 mass % or greater and less than 0.35 mass %; and P: 0.0005 mass % or greater and less than 0.01 mass %, with a remainder being Cu and unavoidable impurities, wherein an amount of Mg [Mg] and an amount of P [P] in terms of mass ratio satisfy [Mg]+20×[P]<0.5, and 0.20<(NF.sub.J2/(1−NF.sub.J3)).sup.0.5≤0.45 is satisfied in a case where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to total grain boundary triple junctions is represented by NF.sub.J3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is represented by NF.sub.J2.

This copper alloy for electronic or electric devices includes: Mg: 0.15 mass % or greater and less than 0.35 mass %; and P: 0.0005 mass % or greater and less than 0.01 mass %, with a remainder being Cu and unavoidable impurities, wherein an amount of Mg [Mg] and an amount of P [P] in terms of mass ratio satisfy [Mg]+20×[P]<0.5, and 0.20<(NF.sub.J2/(1−NF.sub.J3)).sup.0.5≤0.45 is satisfied in a case where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to total grain boundary triple junctions is represented by NF.sub.J3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is represented by NF.sub.J2.

A coreless motor includes a rotating shaft, a rotor plate attached to the rotating shaft, and a coil supported by the rotor plate. The coil includes a carbon nanotube electric wire, the carbon nanotube electric wire including a carbon nanotube wire and a coating layer, the carbon nanotube wire including a plurality of carbon nanotubes, the coating layer including an insulating layer that covers the carbon nanotube wire so as to insulate the carbon nanotube wire.

A flexible conductive film is comprised of a flexible base and a conductive layer coated on it. The flexible base uses Surlyn resin as the matrix. It uses silver nanowire as the conductive layer.

A flexible conductive film is comprised of a flexible base and a conductive layer coated on it. The flexible base uses Surlyn resin as the matrix. It uses silver nanowire as the conductive layer.

A system and method for preparing and installing a graphite ground system is able to establish a durable conductive ground suitable for use in dissipating electrical current in conjunction with larger sensitive electronic installations. The method is provided with an excavation tool, an installation site, a volume of substrate, a volume of catalyst, a volume of conductive additive, a ground lead, and at least one regulated current source. The excavation tool is used to prepare the installation site for an in-situ preparation of the volume of substrate, the volume of catalyst, and the volume of conductive additive. The resultant conductive slurry is further modified with the integration of the ground lead, whereby the regulated current source may be electrically connected to earth (electrical ground). The conductive slurry is subsequently compacted and solidified into a conductive ground element, capturing the ground lead and ensuring a consistent electrical connection to ground.

A copper alloy plastically-worked material comprises Mg in the amount of 10-100 mass ppm and a balance of Cu and inevitable impurities, which comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less. The electrical conductivity is 97% IACS or greater. The tensile strength is 275 MPa or less. The heat-resistant temperature after draw working is 150° C. or higher.