Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.

Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.

A nickel-coated copper foil suitable for mass production, to which YAG laser welding can be applied while reducing the electrical resistivity by forming a nickel plating layer with a thickness of 0.5 μm or less on a surface of a copper foil by Ni plating, is provided. The nickel-coated copper foil has an overall thickness of 200 μm or less, and includes a copper layer made of Cu or a Cu alloy, and a nickel plating layer made of Ni or a Ni alloy, covering a surface of the copper foil, having a thickness of 0.01 μm or more and 0.5 μm or less, and including a surface having an a* value of 0 or more and 10 or less and a b* value of 0 or more and 14 or less in an L*a*b* color system obtained by an SCI measurement method in accordance with JIS Z 8722.

A busbar for use in mechanically and electrically connecting components in a device or system. The busbar includes a plurality of conductors arranged to provide two opposed end portions and an intermediate portion, wherein each of the conductors has a plurality of intermediate extents that traverse the intermediate portion. The intermediate portion including: (A) an unfused segment where no intermediate extents of the conductors are fused together to form a single consolidated conductor, and (B) a fused segment that includes (i) a partial solidification zone where a majority of the intermediate extents of the conductors are fused together to form a partially solidified region that provides a single consolidated conductor, (ii) a full solidification zone where all of intermediate extents of the conductors are fused together to form a fully solidified region that provides a single consolidated conductor, and (iii) an unsolidified region where all of the intermediate extents of the conductors are not fused together.

A busbar for use in mechanically and electrically connecting components in a device or system. The busbar includes a plurality of conductors arranged to provide two opposed end portions and an intermediate portion, wherein each of the conductors has a plurality of intermediate extents that traverse the intermediate portion. The intermediate portion including: (A) an unfused segment where no intermediate extents of the conductors are fused together to form a single consolidated conductor, and (B) a fused segment that includes (i) a partial solidification zone where a majority of the intermediate extents of the conductors are fused together to form a partially solidified region that provides a single consolidated conductor, (ii) a full solidification zone where all of intermediate extents of the conductors are fused together to form a fully solidified region that provides a single consolidated conductor, and (iii) an unsolidified region where all of the intermediate extents of the conductors are not fused together.

This copper alloy for electronic or electric devices includes: Mg: 0.15 mass % or greater and less than 0.35 mass %; and P: 0.0005 mass % or greater and less than 0.01 mass %, with a remainder being Cu and unavoidable impurities, wherein an amount of Mg [Mg] and an amount of P [P] in terms of mass ratio satisfy [Mg]+20×[P]<0.5, and 0.20<(NF.sub.J2/(1−NF.sub.J3)).sup.0.5≤0.45 is satisfied in a case where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to total grain boundary triple junctions is represented by NF.sub.J3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is represented by NF.sub.J2.

This copper alloy for electronic or electric devices includes: Mg: 0.15 mass % or greater and less than 0.35 mass %; and P: 0.0005 mass % or greater and less than 0.01 mass %, with a remainder being Cu and unavoidable impurities, wherein an amount of Mg [Mg] and an amount of P [P] in terms of mass ratio satisfy [Mg]+20×[P]<0.5, and 0.20<(NF.sub.J2/(1−NF.sub.J3)).sup.0.5≤0.45 is satisfied in a case where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to total grain boundary triple junctions is represented by NF.sub.J3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is represented by NF.sub.J2.

An aluminum alloy conductive wire that includes 0.15 mass % or more and 0.25 mass % or less of Si; 0.6 mass % or more and 0.9 mass % or less of Fe; 0.05 mass % or more and 0.15 mass % or less of Cu; 0.2 mass % or more and 2.7 mass % or less of Mg, and 0.03 mass % or less in total of Ti, V, and B. The aluminum alloy conductive wire has tensile strength of equal to or less than T.sub.1 MPa represented by T.sub.1=59.5 ln(x)+231 and conductivity of equal to or more than C % IACS represented by C=1.26x.sup.2−11.6x+63.4 in a case where a content rate of Mg in the aluminum alloy conductive wire is x mass %.

An aluminum alloy conductive wire that includes 0.15 mass % or more and 0.25 mass % or less of Si; 0.6 mass % or more and 0.9 mass % or less of Fe; 0.05 mass % or more and 0.15 mass % or less of Cu; 0.2 mass % or more and 2.7 mass % or less of Mg, and 0.03 mass % or less in total of Ti, V, and B. The aluminum alloy conductive wire has tensile strength of equal to or less than T.sub.1 MPa represented by T.sub.1=59.5 ln(x)+231 and conductivity of equal to or more than C % IACS represented by C=1.26x.sup.2−11.6x+63.4 in a case where a content rate of Mg in the aluminum alloy conductive wire is x mass %.

An aluminum alloy wire composed of an aluminum alloy, wherein the aluminum alloy contains more than or equal to 0.03 mass % and less than or equal to 1.5 mass % of Mg, more than or equal to 0.02 mass % and less than or equal to 2.0 mass % of Si, and a remainder of Al and an inevitable impurity, Mg/Si being more than or equal to 0.5 and less than or equal to 3.5 in mass ratio, and the aluminum alloy wire has a dynamic friction coefficient of less than or equal to 0.8.