A method for forming an assembly is provided. The method includes depositing a colloidal template onto a substrate, wherein the colloidal template is porous, depositing a metal layer onto and within the colloidal template, depositing a cap structure onto the colloidal template opposite of the substrate, and removing the colloidal template from between the substrate and the cap structure to form a metal inverse opal structure disposed therebetween. The method continues by depositing an electrical isolation layer in contact with the cap structure opposite the metal inverse opal structure, and attaching the electrical isolation layer to a cooling device.

A method for forming an assembly is provided. The method includes depositing a colloidal template onto a substrate, wherein the colloidal template is porous, depositing a metal layer onto and within the colloidal template, depositing a cap structure onto the colloidal template opposite of the substrate, and removing the colloidal template from between the substrate and the cap structure to form a metal inverse opal structure disposed therebetween. The method continues by depositing an electrical isolation layer in contact with the cap structure opposite the metal inverse opal structure, and attaching the electrical isolation layer to a cooling device.

The transparent conductive layer (3) includes a first main surface (5), and a second main surface (6) opposed to the first main surface (5) in a thickness direction. The transparent conductive layer (3) has a first grain boundary (7) in which two end edges (23) in a cross-sectional view are both opened to the first main surface (5) and an intermediate region (25) between the end edges (23) is not in contact with the second main surface (6); and a first crystal grain (31) partitioned by the first grain boundary (7) and facing only the first main surface (5). The transparent conductive layer (3) contains rare gas atoms having a higher atomic number than argon atoms.

The transparent conductive layer (3) includes a first main surface (5), and a second main surface (6) opposed to the first main surface (5) in a thickness direction. The transparent conductive layer (3) has a first grain boundary (7) in which two end edges (23) in a cross-sectional view are both opened to the first main surface (5) and an intermediate region (25) between the end edges (23) is not in contact with the second main surface (6); and a first crystal grain (31) partitioned by the first grain boundary (7) and facing only the first main surface (5). The transparent conductive layer (3) contains rare gas atoms having a higher atomic number than argon atoms.

A transparent electroconductive film (X) includes a resin film (11) and a light-transmitting electroconductive layer (20) in this order in a thickness direction (D). The light-transmitting electroconductive layer (20) has a first compressive residual stress in a first in-plane direction orthogonal to the thickness direction (D), and has a second compressive residual stress less than the first compressive residual stress in a second in-plane direction orthogonal to each of the thickness direction (D) and the first in-plane direction. A ratio of the second compressive residual stress to the first compressive residual stress is 0.82 or less.

A transparent electroconductive film (X) includes a resin film (11) and a light-transmitting electroconductive layer (20) in this order in a thickness direction (D). The light-transmitting electroconductive layer (20) has a first compressive residual stress in a first in-plane direction orthogonal to the thickness direction (D), and has a second compressive residual stress less than the first compressive residual stress in a second in-plane direction orthogonal to each of the thickness direction (D) and the first in-plane direction. A ratio of the second compressive residual stress to the first compressive residual stress is 0.82 or less.

In view of the problem with the prior art, the present invention addresses the following problems: providing a method that can suppress the generation of fine silver particles in a silver nanowire dispersion better than prior methods; and inhibiting, by a convenient method, particulation of silver nanowires on the anode side. A solution is a silver nanowire dispersion that contains silver nanowires, a dispersion solvent, and a chelating agent with the average diameter of the silver nanowires being not more than 100 nm, the silver nanowire dispersion being characterized in that the chelating agent content is 0.1 to 1,000 μmol/g with reference to the silver nanowire content, and the chelating agent is a prescribed aromatic heterocyclic compound having at least one imine skeleton in the molecule.

In view of the problem with the prior art, the present invention addresses the following problems: providing a method that can suppress the generation of fine silver particles in a silver nanowire dispersion better than prior methods; and inhibiting, by a convenient method, particulation of silver nanowires on the anode side. A solution is a silver nanowire dispersion that contains silver nanowires, a dispersion solvent, and a chelating agent with the average diameter of the silver nanowires being not more than 100 nm, the silver nanowire dispersion being characterized in that the chelating agent content is 0.1 to 1,000 μmol/g with reference to the silver nanowire content, and the chelating agent is a prescribed aromatic heterocyclic compound having at least one imine skeleton in the molecule.

Devices, systems, and methods related to a transparent conductive film are disclosed. In one aspect, a method of forming a transparent conductive member (e.g., a transparent conductive film) includes extruding a metallic nanoparticle composition from a capillary tube onto a temporary substrate to form an extrudate. The extrudate can include metallic nanoparticle lines. The method further includes sintering the extrudate and the temporary substrate, dispensing a photocurable polymer onto the temporary substrate, and laminating a second substrate to the photocurable polymer. The photocurable polymer and the extrudate are interposed between the temporary substrate and the second substrate. The method further includes curing the photocurable polymer to form a transparent polymer layer and separating the temporary substrate from the transparent layer to form the transparent conductive member. The transparent conductive member includes the transparent polymer layer and the extrudate embedded in the transparent polymer layer.

Devices, systems, and methods related to a transparent conductive film are disclosed. In one aspect, a method of forming a transparent conductive member (e.g., a transparent conductive film) includes extruding a metallic nanoparticle composition from a capillary tube onto a temporary substrate to form an extrudate. The extrudate can include metallic nanoparticle lines. The method further includes sintering the extrudate and the temporary substrate, dispensing a photocurable polymer onto the temporary substrate, and laminating a second substrate to the photocurable polymer. The photocurable polymer and the extrudate are interposed between the temporary substrate and the second substrate. The method further includes curing the photocurable polymer to form a transparent polymer layer and separating the temporary substrate from the transparent layer to form the transparent conductive member. The transparent conductive member includes the transparent polymer layer and the extrudate embedded in the transparent polymer layer.