Disclosed is a preparation method of an all-weather self-healing stretchable conductive material, which uses acrylic acid and modified polyglutamic acid as a substrate, adds Fe.sup.3+ to form coordination, adjusts the volume ratio of water and glycerin, and heats to generate radical polymerization, so as to obtain a uniform double-layer three-dimensional network structure. The obtained polyacrylic acid and polyglutamic acid composite hydrogel has good mechanical properties and characteristics of rapid self-healing. A composite carbon film is prepared by depositing a metal layer of 20 nm to 80 nm thick on a single-layer aligned carbon film by magnetron sputtering, and then the composite hydrogel is adhered to each of the upper and lower sides of the composite carbon film respectively to form an all-weather self-healing stretchable conductive material of a sandwich structure. The preparation method of the invention is simple, the source of raw materials is plenty, and the obtained materials have good electrical and mechanical properties and have broad application prospects in the fields of flexible stretchable devices, wearable devices, and soft-bodied robots and the like.

Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

A fluorinated polymer suitable for deposition and capable of favorable metal patterning, is provided. A resin film containing such a fluorinated polymer as a material is provided. Further, a photoelectronic element having such a resin film in its structure is provided.

A fluorinated polymer which satisfies the following requirements (1) to (3): (1) the melting point is less than 200° C., or no melting point is observed, (2) the thermogravimetric loss rate when the temperature is increased at a temperature-increasing rate of 2° C./min under a pressure of 1×10.sup.−3 Pa, substantially reaches 100% at 400° C. or lower, (3) when the temperature is increased at a temperature-increasing rate of 2° C./min under a pressure of 1×10.sup.−3 Pa, the temperature width from a temperature at which the thermogravimetric loss rate is 10% to a temperature at which it is 90%, is within 200° C.

The present application discloses a conductive laminated structure, a manufacturing method thereof, and a display panel. The conductive laminated structure provided by the present application comprises a substrate; an adhesion enhancement layer disposed on the substrate; a metal nanowire layer disposed on the adhesion enhancement layer and having a first opening to expose the adhesion enhancement layer; a wiring layer disposed on the metal nanowire layer and having a second opening at least partially overlapping the first opening to expose the adhesion enhancement layer; and an optical adhesive layer disposed on the wiring layer, filled in the second opening and the first opening and connected to the adhesion enhancement layer. Because the metal nanowire layer is in direct contact with the wiring layer, the conducting capability is enhanced, and a reduced contacting area is needed, so that the wiring layer can be relatively narrow.

The present application discloses a conductive laminated structure, a manufacturing method thereof, and a display panel. The conductive laminated structure provided by the present application comprises a substrate; an adhesion enhancement layer disposed on the substrate; a metal nanowire layer disposed on the adhesion enhancement layer and having a first opening to expose the adhesion enhancement layer; a wiring layer disposed on the metal nanowire layer and having a second opening at least partially overlapping the first opening to expose the adhesion enhancement layer; and an optical adhesive layer disposed on the wiring layer, filled in the second opening and the first opening and connected to the adhesion enhancement layer. Because the metal nanowire layer is in direct contact with the wiring layer, the conducting capability is enhanced, and a reduced contacting area is needed, so that the wiring layer can be relatively narrow.

A copper-based ink contains copper hydroxide and diethanolamine. The ink may be coated on a substrate and decomposed on the substrate to form a conductive copper coating on the substrate. The ink is low cost and micron-thick traces of the ink may be screen printed and thermally sintered in the presence of up to about 500 ppm of oxygen or photo-sintered in air to produce highly conductive copper features. Sintered copper traces produced from the ink have improved air stability compared to traces produced from other copper inks. Sintered copper traces having sheet resistivity of about 20 mΩ/□/mil or less may be obtained for 5-20 mil wide screen-printed lines with excellent resolution.

A transparent conductor includes a transparent substrate, a first metal oxide layer, a metal layer containing a silver alloy, a third metal oxide layer, and a second metal oxide layer in the order presented. The first metal oxide layer is composed of a metal oxide which is different from ITO, the second metal oxide layer contains ITO, and the work function of the surface of the second metal oxide layer opposite to the metal layer side is 4.5 eV or higher.

A transparent conductor includes a transparent substrate, a first metal oxide layer, a metal layer containing a silver alloy, a third metal oxide layer, and a second metal oxide layer in the order presented. The first metal oxide layer is composed of a metal oxide which is different from ITO, the second metal oxide layer contains ITO, and the work function of the surface of the second metal oxide layer opposite to the metal layer side is 4.5 eV or higher.

A polyaniline composition including a polyaniline complex composed of a polyaniline doped with a dopant, and a liquid polymer.