A conductive composite material that includes: particles of a layered material including one or plural layers, wherein the one or plural layers include a layer body represented by: M.sub.mX.sub.n, where M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is not less than 1 and not more than 4, m is more than n but not more than 5, and a modifier or terminal T exists on a surface of the layer body, where T is at least one of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom; and a polymer material that includes a hydrogen acceptor and a hydrogen donor, a ratio of the particles of the layered material is more than 19% by volume but not more than 95% by volume.

The invention relates to a connector assembly, a seam tape, a garment and a method to produce a connector assembly.

The invention relates to a connector assembly, a seam tape, a garment and a method to produce a connector assembly.

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

An anisotropic conductive film includes, as conductive particles for anisotropic conductive connection, metal particles such as solder particles having on the surface an oxide film. In this anisotropic conductive film, the metal particles are contained in an insulating film and regularly arranged as viewed in a plan view. A flux is disposed to be in contact with, or in proximity to, at least one of ends of the metal particles on a front surface side of the anisotropic conductive film and a rear surface side of the anisotropic conductive film. Preferable metal particles are solder particles. Preferably, the insulating film has a structure of two layers, and the metal particles are disposed between the two layers.

An anisotropic conductive film includes, as conductive particles for anisotropic conductive connection, metal particles such as solder particles having on the surface an oxide film. In this anisotropic conductive film, the metal particles are contained in an insulating film and regularly arranged as viewed in a plan view. A flux is disposed to be in contact with, or in proximity to, at least one of ends of the metal particles on a front surface side of the anisotropic conductive film and a rear surface side of the anisotropic conductive film. Preferable metal particles are solder particles. Preferably, the insulating film has a structure of two layers, and the metal particles are disposed between the two layers.

A problem is to provide a silver paste which can produce, without variation in resistivity value, a conductive silver coating film exhibiting resistivity substantially equivalent to the resistance value of bulk silver in low-temperature sintering. The problem is solved by providing a silver paste including a silver nanoparticle aqueous dispersion prepared by using a compound having a polyethyleneimine skeleton as a protective agent, a compound having a functional group reactable with nitrogen atoms in the polyethyleneimine, and at least one compound selected from the group consisting of a compound having an amine functional group and a compound having an amide functional group.

A conductive particle including a conductive powder, a conductive polymer composition, and an anisotropic conductive sheet, each of which has a particularly smaller volume resistivity and better conductivity than those of the related art, and is desirably inexpensive. A conductive particle includes a first plating layer (pure Ni plating layer or Ni plating layer containing 4.0 mass % or less of P) covering the surface of a spherical Ni core containing 5 mass % to 15 mass % or less of P. The conductive particle may further include a Au plating layer having a thickness of from 5 nm to 200 nm and covering the surface of the first plating layer.

A conductive particle including a conductive powder, a conductive polymer composition, and an anisotropic conductive sheet, each of which has a particularly smaller volume resistivity and better conductivity than those of the related art, and is desirably inexpensive. A conductive particle includes a first plating layer (pure Ni plating layer or Ni plating layer containing 4.0 mass % or less of P) covering the surface of a spherical Ni core containing 5 mass % to 15 mass % or less of P. The conductive particle may further include a Au plating layer having a thickness of from 5 nm to 200 nm and covering the surface of the first plating layer.