The present invention provides covered particles wherein insulating layers cover the surfaces of electroconductive particles, and the covered particles are excellent in the adhesion between the surfaces of the electroconductive particles and the insulating layers. The covered particles includes: electroconductive particles in which metal films are formed on the surfaces of core materials, and a triazole-based compound is disposed on the outer surfaces on the sides opposite to the core materials in the metal films; and insulating layers covering the electroconductive particles, and the insulating layers comprise a compound having phosphonium groups.

The present invention provides covered particles wherein insulating layers cover the surfaces of electroconductive particles, and the covered particles are excellent in the adhesion between the surfaces of the electroconductive particles and the insulating layers. The covered particles includes: electroconductive particles in which metal films are formed on the surfaces of core materials, and a triazole-based compound is disposed on the outer surfaces on the sides opposite to the core materials in the metal films; and insulating layers covering the electroconductive particles, and the insulating layers comprise a compound having phosphonium groups.

Provided is a conductive film that can be formed without using a vacuum deposition method and includes a material that is neither a noble metal nor a special carbon material as a conductive element for exhibiting conductivity. The conductive film provided includes an arrangement portion of semiconductor nanoparticles. When a cross section including the arrangement portion is observed, the semiconductor nanoparticles are arranged in line apart from each other in the arrangement portion. A conductivity C1 measured along at least one direction is 7 S/cm or more.

Provided is a conductive film that can be formed without using a vacuum deposition method and includes a material that is neither a noble metal nor a special carbon material as a conductive element for exhibiting conductivity. The conductive film provided includes an arrangement portion of semiconductor nanoparticles. When a cross section including the arrangement portion is observed, the semiconductor nanoparticles are arranged in line apart from each other in the arrangement portion. A conductivity C1 measured along at least one direction is 7 S/cm or more.

A member includes a base material and a conductive layer. The conductive layer conducts heat or electricity. The conductive layer includes a conductive portion and a non-conductive portion. The conductive portion conducts heat or electricity. The conductive portion is disposed on at least one of an upper surface or a lower surface of the non-conductive portion and on a side surface of the non-conductive portion.

A member includes a base material and a conductive layer. The conductive layer conducts heat or electricity. The conductive layer includes a conductive portion and a non-conductive portion. The conductive portion conducts heat or electricity. The conductive portion is disposed on at least one of an upper surface or a lower surface of the non-conductive portion and on a side surface of the non-conductive portion.

A conductive coated composite body is disclosed which has both good adhesion of a conductive coating film to a base and excellent electrical conductivity of the conductive coating film at the same time even in cases where a glass base or a base having low heat resistance is used; and a method for producing this conductive coated composite body. A conductive coated composite body includes: a base; a resin layer that is formed on at least a part of the base; and a conductive coating film that is formed on at least a part of the resin layer. The conductive coating film is a sintered body of silver fine particles; the main component of the resin layer is a polyurethane resin having an elongation at break of 600% or more; and the polyurethane resin has one of the functional groups represented by —COO—H, —COOR, —COO.sup.−NH.sup.+R.sub.2 and —COO.sup.−NH.sub.4.sup.+.

A conductive coated composite body is disclosed which has both good adhesion of a conductive coating film to a base and excellent electrical conductivity of the conductive coating film at the same time even in cases where a glass base or a base having low heat resistance is used; and a method for producing this conductive coated composite body. A conductive coated composite body includes: a base; a resin layer that is formed on at least a part of the base; and a conductive coating film that is formed on at least a part of the resin layer. The conductive coating film is a sintered body of silver fine particles; the main component of the resin layer is a polyurethane resin having an elongation at break of 600% or more; and the polyurethane resin has one of the functional groups represented by —COO—H, —COOR, —COO.sup.−NH.sup.+R.sub.2 and —COO.sup.−NH.sub.4.sup.+.

A resin composition, a formed article, and, an electromagnetic wave absorber, may each have large electromagnetic wave absorbance. The resin composition may contain: a thermoplastic resin; and an electro-conductive substance, the resin composition, when formed to a 2 mm thick test specimen and a cross section thereof is observed under a digital microscope, giving an aggregate attributable to the electro-conductive substance, with an area percentage of the aggregate, having an equivalent circle diameter of 30 .Math.m or larger, of 0.80% or smaller.

This anisotropic conductive sheet has an insulation layer, a plurality of conduction paths, and a plurality of adhesion layers disposed therebetween. The adhesion layers each contain a silane coupling agent composition containing a silane coupling agent having a vinyl group and a hydrolyzable group, or a polycondensate of said composition. In the anisotropic conductive sheet: a) the insulation layer contains an addition crosslinked product of a silicone rubber composition containing an organopolysiloxane having a SiH group, and the vinyl groups of the adhesion layers is bound to the SiH group of the insulation layer through an addition reaction; or b) the insulation layer contains an organic peroxide crosslinked product of a silicone rubber composition containing an organopolysiloxane having a SiCH.sub.3 group, the vinyl groups of the adhesion layers is bound to the SiCH.sub.3 group of the insulation layer through a radical addition reaction.