Patent classifications
H01B7/0054
METHOD FOR MANUFACTURING HEATING ELEMENT, HEATING ELEMENT MANUFACTURED THEREBY, AND USE METHOD THEREOF
The present invention relates to a method for manufacturing a heating element, a heating element manufactured thereby, and a use method thereof and, more particularly, to a method of manufacturing a heating element by combining a plurality of ultrafine wires having a high resistance value in a parallel structure in which the entire areas of the plurality of ultrafine wires contact each other, so that a combined resistance value is reduced while each of the ultrafine wires has a high resistance value to improve heat generating efficiency; the heating element; a use method thereof. The method for manufacturing a heating element forms an ultrafine wire having a high resistance value from a single metal or an alloy metal and then joins a plurality of ultrafine wires so as to be in contact with each other to form a single bundle resulting in a single-strand heating wire.
Knuckle structure
A knuckle structure is provided with: a knuckle for rotatably supporting a drive shaft connected to the output shaft of a motor; and a grounding member having a grounding harness, the grounding member electrically connecting the knuckle and a vehicle body. The grounding member is connected to a grounding connection section provided on the protrusion of the knuckle and facing rearward of the vehicle. The grounding connection section is provided between a brake caliper extending in the front-rear direction of the vehicle and the knuckle.
Data transmission cable and related device
A data transmission cable (100) includes: a signal bundle (110), where the signal bundle (110) includes at least three signal cables, the at least three signal cables are disposed at intervals, pairwise signal cables form a differential pair signal cable, and the differential pair signal cable is used to transmit a differential data signal; a ground cable (120), where the ground cable (120) encircles and covers the signal bundle (110), and the ground cable (120) is used to transmit a ground signal and isolate the signal bundle (110) from a signal bundle (110) of another data transmission cable (100); and a filling medium (130), where the filling medium (130) is disposed in space on an inner side of the ground cable (120) except the signal cable, so that a problem that a MIPI bus has poor transmission quality and a short transmission distance can be resolved.
Safety cable for downhole communications
An example system for transmitting signals may include a signal source, a signal target, and a transmission cable coupled to the signal source and the signal target. The transmission cable may include a first conductor and a second conductor surrounding the first conductor. A resistive layer may be between the first conductor and the second conductor and allow current flow between the first conductor and the second conductor.
High density thermistor cable
A thermistor cable is formed from a tubing and a plurality of thermistor conductors bundled within the tubing, wherein each thermistor conductor forms a junction with a shared thermistor conductor to form a thermistor junction, and each thermistor junction is attached to a support cable in a thermistor bundle. The cable is formed by pulling the thermistor bundle into the tubing.
HIGH-VOLTAGE CABLE
A high-voltage cable for electrostatically charging a coating agent in an electrostatic coating plant is provided. The cable includes a centrally arranged cable core and an electrically insulating jacket which sheaths the cable core. The cable core has a moderate electrical resistance according to the principles of the present disclosure. The cable core includes fibers that form a non-woven fabric, and at least one strip of the non-woven fabric of the cable core is twisted.
CONNECTION CONDUCTOR, ARRANGEMENT HAVING A CONNECTION CONDUCTOR AND USE OF A CONNECTION CONDUCTOR
A connection conductor electrically connects a sensor, the output side of which provides measurement signals, to an intelligent electronic device which is set up to process the measurement signals. The connection conductor has conductor phases arranged insulated from one another, a sensor end on which is formed a conductor input for electrically connecting to an output of the sensor, and an evaluation-unit end which has a conductor output for electrically connecting to an input of the evaluation unit. The two conductor phases extend from the conductor input to the conductor output and are set up to transmit the measurement signals between the output of the sensor and the input of the evaluation unit. In the connection conductor measurement errors due to high-frequency interference are avoided, and the connection conductor is adapted to a frequency range in which the interference occurs.