A flexible electronic pathway, such as a flat flexible cable or flexible circuit, includes a cut-out within the pathway to provide strain relief by balancing the stress over the termination area. The flexible electronic pathway allows relative movement between a first end and a second end in all three translation, all three rotation directions, and combinations thereof. The strain relief can provide for a controlled mechanical resistance to reduce the risk of damage and failure.

A flexible electronic pathway, such as a flat flexible cable or flexible circuit, includes a cut-out within the pathway to provide strain relief by balancing the stress over the termination area. The flexible electronic pathway allows relative movement between a first end and a second end in all three translation, all three rotation directions, and combinations thereof. The strain relief can provide for a controlled mechanical resistance to reduce the risk of damage and failure.

An adhesive composition, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in the B stage, and which is excellent in storage stability of the laminate, are provided. The adhesive composition includes a modified polyolefin-based resin and an epoxy resin, in which the modified polyolefin-based resin is a resin resulting from graft-modification of an unmodified olefin resin with a modifying agent containing an α,β-unsaturated carboxylic acid or derivative thereof, wherein the content of the modified polyolefin-based resin is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the modified polyolefin-based resin; and the dielectric constant of a cured body of the adhesive is less than 2.5 as measured at a frequency of 1 GHz.

An adhesive composition, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in the B stage, and which is excellent in storage stability of the laminate, are provided. The adhesive composition includes a modified polyolefin-based resin and an epoxy resin, in which the modified polyolefin-based resin is a resin resulting from graft-modification of an unmodified olefin resin with a modifying agent containing an α,β-unsaturated carboxylic acid or derivative thereof, wherein the content of the modified polyolefin-based resin is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the modified polyolefin-based resin; and the dielectric constant of a cured body of the adhesive is less than 2.5 as measured at a frequency of 1 GHz.

A wire harness includes an electrical wire, a sheet material welded to an insulating covering of the electrical wire disposed on a main surface, and a cover fixed to the sheet material. The cover covers at least part of the electrical wire disposed on the sheet material along a longitudinal direction of the electrical wire from an opposite side of the electrical wire from the sheet material.

Provided are an insulated wire material including: a conductor including a single core conductor or a plurality of divided conductors placed in parallel to each other or helically placed; a peripheral insulating layer with which a periphery of the conductor is coated; and a welding member provided at least one end portion of the conductor and joined, via a welded portion welded to the single core conductor or divided conductors, to at least a peripheral surface of the welded portion, a manufacturing method thereof, a coil including the insulated wire material, and electrical/electronic equipment including the coil.

Provided are an insulated wire material including: a conductor including a single core conductor or a plurality of divided conductors placed in parallel to each other or helically placed; a peripheral insulating layer with which a periphery of the conductor is coated; and a welding member provided at least one end portion of the conductor and joined, via a welded portion welded to the single core conductor or divided conductors, to at least a peripheral surface of the welded portion, a manufacturing method thereof, a coil including the insulated wire material, and electrical/electronic equipment including the coil.

A cable routing structure includes a plurality of cables that are superposed on one another and that are movable relatively to one another in length directions thereof, and a line length difference housing case that contains parts of the plurality of cables and is movable in a reciprocating direction. The line length difference housing case absorbs differences in line length among the plurality of cables generated in accordance with a moving position of the line length difference housing case.

A cable routing structure includes a plurality of cables that are superposed on one another and that are movable relatively to one another in length directions thereof, and a line length difference housing case that contains parts of the plurality of cables and is movable in a reciprocating direction. The line length difference housing case absorbs differences in line length among the plurality of cables generated in accordance with a moving position of the line length difference housing case.

A cable structure including at least one conductor, a cladding layer, a low dielectric constant (Dk) resin layer, and a shielding layer is provided. The cladding layer includes a low Dk adhesive layer and two insulation layers. The low Dk adhesive layer is coated around the at least one conductor. The two insulation layers respectively are adhered to two opposite surfaces of the low Dk adhesive layer. Each of the low Dk adhesive layers and the two insulation layers has a dielectric constant between 1.3 and 3. The low Dk resin layer is adhered to the cladding layer through a first adhesive layer. The shielding layer is adhered to the low Dk resin layer through a second adhesive layer. The at least one conductor is disposed in the low Dk adhesive layer and positioned between the two insulation layers.