A superconducting flexible interconnecting cable connector for supercomputing systems is provided. The cable connector includes a base with a recessed area defined therein to receive superconducting flexible interconnecting cables and superconducting connecting chips to electrically connect the superconducting flexible interconnecting cables to each other. A cover is provided to cover the superconducting flexible interconnecting cables and the superconducting connecting chips when the cover is in a closed position. A compression device compresses the superconducting connecting chips together to secure the superconducting flexible interconnecting cables and the superconducting connecting chips inside the recessed area of the base when the cover is in the closed position.

A superconducting flexible interconnecting cable connector for supercomputing systems is provided. The cable connector includes a base with a recessed area defined therein to receive superconducting flexible interconnecting cables and superconducting connecting chips to electrically connect the superconducting flexible interconnecting cables to each other. A cover is provided to cover the superconducting flexible interconnecting cables and the superconducting connecting chips when the cover is in a closed position. A compression device compresses the superconducting connecting chips together to secure the superconducting flexible interconnecting cables and the superconducting connecting chips inside the recessed area of the base when the cover is in the closed position.

This disclosure describes systems, methods, and apparatus for multilayer superconducting structures comprising electroplated Rhenium, where the Rhenium operates in a superconducting regime at or above 4.2 K, or above 1.8 K where specific temperatures and times of annealing have occurred. The structure can include at least a first conductive layer applied to a substrate, where the Rhenium layer is electroplated to the first layer. A third layer formed from the same or a different conductor as the first layer can be formed atop the Rhenium layer.

This disclosure describes systems, methods, and apparatus for multilayer superconducting structures comprising electroplated Rhenium, where the Rhenium operates in a superconducting regime at or above 4.2 K, or above 1.8 K where specific temperatures and times of annealing have occurred. The structure can include at least a first conductive layer applied to a substrate, where the Rhenium layer is electroplated to the first layer. A third layer formed from the same or a different conductor as the first layer can be formed atop the Rhenium layer.

The present invention relates to an inductive dipole element for a superconducting microwave quantum circuit. The dipole element comprises a DC-SQUID formed by a pair of Josephson junctions shunted by an inductance, wherein the Josephson junctions have equal energy, and the Josephson junctions and the inductance are arranged such that each of the junctions forms a loop with the inductance. The two loops are asymmetrically threaded with external magnetic DC fluxes φ.sub.ext1 and φ.sub.ext2, respectively, such that φ.sub.ext1=π and φ.sub.ext2=0, wherein parametric pumping is enabled by modulating the total flux φ.sub.Σ=φ.sub.ext,1+φ.sub.ext,2 threading the dipole element, thereby allowing even-wave mixing between modes that participate in the dipole element with no Kerr-like interactions.

The present invention relates to an inductive dipole element for a superconducting microwave quantum circuit. The dipole element comprises a DC-SQUID formed by a pair of Josephson junctions shunted by an inductance, wherein the Josephson junctions have equal energy, and the Josephson junctions and the inductance are arranged such that each of the junctions forms a loop with the inductance. The two loops are asymmetrically threaded with external magnetic DC fluxes φ.sub.ext1 and φ.sub.ext2, respectively, such that φ.sub.ext1=π and φ.sub.ext2=0, wherein parametric pumping is enabled by modulating the total flux φ.sub.Σ=φ.sub.ext,1+φ.sub.ext,2 threading the dipole element, thereby allowing even-wave mixing between modes that participate in the dipole element with no Kerr-like interactions.

A skin layer of a superconducting tape has a woven mesh structure and is disposed on a surface of a superconducting tape. The skin layer of a superconducting tape solves the problem where a vapor layer generated when a superconductor is in a normal resistive state greatly reduces the efficiency of a heat exchange between the superconductor and liquid nitrogen. Further provided are the superconducting tape and a superconducting coil.

A skin layer of a superconducting tape has a woven mesh structure and is disposed on a surface of a superconducting tape. The skin layer of a superconducting tape solves the problem where a vapor layer generated when a superconductor is in a normal resistive state greatly reduces the efficiency of a heat exchange between the superconductor and liquid nitrogen. Further provided are the superconducting tape and a superconducting coil.

A superconducting integrated circuit, comprising a plurality of superconducting circuit elements, each having a variation in operating voltage over time; a common power line; and a plurality of bias circuits, each connected to the common power line, and to a respective superconducting circuit element, wherein each respective bias circuit is superconducting during at least one time portion of the operation of a respective superconducting circuit element, and is configured to supply the variation in operating voltage over time to the respective superconducting circuit element.

The present invention is a superconducting wire including: a wire formed of a superconducting material; and a superconducting stabilization material disposed in contact with the wire, in which the superconducting stabilization material is formed of a copper material which contains: one or more types of additive elements selected from Ca, Sr, Ba, and rare earth elements in a total of 3 ppm by mass to 400 ppm by mass; a balance being Cu and inevitable impurities, and in which a total concentration of the inevitable impurities excluding O, H, C, N, and S which are gas components is 5 ppm by mass to 100 ppm by mass.