A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.

A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.

A superconducting wire includes a main body portion, a substrate, and a cover portion. The main body portion includes a first main surface and a second main surface located opposite to the first main surface, and includes a superconducting material portion. The substrate supports the second main surface of the main body portion. The cover portion is formed at least on the first main surface of the main body portion. In the cover portion, surface roughness in a central portion in a width direction of the superconducting wire is smaller than surface roughness at an end portion in the width direction.

A superconducting wire includes a main body portion, a substrate, and a cover portion. The main body portion includes a first main surface and a second main surface located opposite to the first main surface, and includes a superconducting material portion. The substrate supports the second main surface of the main body portion. The cover portion is formed at least on the first main surface of the main body portion. In the cover portion, surface roughness in a central portion in a width direction of the superconducting wire is smaller than surface roughness at an end portion in the width direction.

This invention concerns a cryo-cooled electrical conduction network. The conduction network has an electrical network divided into two or more conductive sections, each section comprising electrical equipment (24, 28). The conductive network also has a coolant network for maintaining the temperature of a coolant in each section. The electrical equipment (24, 28) and a corresponding portion of the coolant network of each section is housed in a section enclosure (10, 12, 14). The coolant network includes a coolant interface (40) located between each section, wherein the coolant interface (40) is housed in an intermediate enclosure (16, 18, 20, 22) that is isolatable from the section enclosures (10, 12, 14) in the electrical conduction network.

This invention concerns a cryo-cooled electrical conduction network. The conduction network has an electrical network divided into two or more conductive sections, each section comprising electrical equipment (24, 28). The conductive network also has a coolant network for maintaining the temperature of a coolant in each section. The electrical equipment (24, 28) and a corresponding portion of the coolant network of each section is housed in a section enclosure (10, 12, 14). The coolant network includes a coolant interface (40) located between each section, wherein the coolant interface (40) is housed in an intermediate enclosure (16, 18, 20, 22) that is isolatable from the section enclosures (10, 12, 14) in the electrical conduction network.

Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.

Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.

Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.

Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.