An ultrasonic processing device applying an ultrasonic wave to workpieces to perform ultrasonic processing, the ultrasonic processing device includes, a support portion configured to support the workpieces, a pressurizing portion capable of moving in a direction of relatively approaching and separating from the support portion and configured to damp the workpieces with the support portion, a vibrator provided on the support portion or the pressurizing portion and configured to apply ultrasonic vibration to the workpieces which are clamped between the support portion and the pressurizing portion, and a partition plate disposed between the support portion and the pressurizing portion and configured to divide a space between the support portion and the pressurizing portion into a plurality of processing spaces where the workpieces are capable of being disposed.

An apparatus configured to twist a first wire about a second wire is presented herein. The apparatus includes a securing mechanism configured to secure ends of the first wire and the second wire. The first wire is arranged parallel to the second wire along a longitudinal axis. The apparatus further includes a gripping mechanism configured to grip central portions of the first and second wires, a tensioning mechanism configured to apply a lateral offsetting force to the gripping mechanism, thereby deflecting the central portions of the first and second wires orthogonally from the longitudinal axis, and a rotating mechanism configured to rotate the gripping mechanism, thereby twisting the first and second wires about one another. A method of twisting a pair of wires is also presented.

A terminal insertion device is provided which enables inserting connector terminals into terminal accommodating chambers of a connector housing, each of the connector terminals being connected to an end of each of a plurality of electric wires in a multi-core cable by crimping, while reducing the separation length for the plurality of electric wires. The terminal insertion device comprises: a terminal separator configured to be interposed between two connector terminals; a terminal chuck configured to clamp and bundle the two connector terminals in two directions, i.e., in a first direction intersecting an insertion direction and in a second direction intersecting the insertion direction and the first direction; and a moving mechanism configured to move at least one of a connector housing and the two connector terminals held by the terminal separator and the terminal chuck to insert the two connector terminals into two terminal accommodating chambers.

A method for laying multiple conductors in a container may be provided. The method may comprise receiving the multiple conductors at a monitoring station; receiving the multiple conductors at a drive; and receiving the multiple conductors at the container.

Disclosed is a device for applying marking tubes onto cables including: a driving mechanism for a cable along a driving axis; at least one buffer pipe in a producing position aligned with the driving axis, the buffer pipe having dimensions adapted both for a cable to be marked to run through the buffer pipe and for a number of marking tubes to be threaded onto the buffer pipe; a pushing unit engaging and pushing along the driving axis at least one first out marking tube of the marking tubes threaded on the buffer pipe until this first out marking tube exits the buffer pipe and is released onto the cable. Also disclosed is a method for applying marking tubes onto cables using a buffer pipe. The cable is always driven in the same forward direction and there is no limitation of cable length or marking tube number or location.

An apparatus configured to twist a first wire about a second wire is presented herein. The apparatus includes a securing mechanism configured to secure ends of the first wire and the second wire. The first wire is arranged parallel to the second wire along a longitudinal axis. The apparatus further includes a gripping mechanism configured to grip central portions of the first and second wires, a tensioning mechanism configured to apply a lateral offsetting force to the gripping mechanism, thereby deflecting the central portions of the first and second wires orthogonally from the longitudinal axis, and a rotating mechanism configured to rotate the gripping mechanism, thereby twisting the first and second wires about one another. A method of twisting a pair of wires is also presented.

A module (2) for a system (1) for assembling electric cables (19) includes a machine base (5) on which at least one processing station (22) for processing electric cables is mountable, and an asynchronous and pitch-free transport device (7) configured to transport at least one of the electric cables to and/or away from the at least one processing station.

A computerized discrete wire inventory indexing system organizes and automates the intake of wiring used in a wire harness assembly work cell. Functions in a work cell may be duplicated into a second arrangement symmetrically opposite to a first arrangement so that an indexing system in accordance with the invention may operate between or alongside the adjacent work cells to execute its tasks in tandem and produce pairs of wires to be used within the two work cells. The wire indexing system operates with a tandem wire pulling machine on a movable shuttle that grabs pairs of wires from the indexing system and draws them to length. Both the shuttle and the wire indexing system may includes fixtures for stripping and terminating wires by crimping terminals onto prepared wire ends. Computer control enables rapid and correct wire production and efficient process change-overs.

A method for laying multiple conductors in a container may be provided. The method may comprise receiving the multiple conductors at a monitoring station; receiving the multiple conductors at a drive; and receiving the multiple conductors at the container.

A multilayer structure comprises a plurality of composite structures in a stacked configuration, each having a copper layer having a thickness of no larger than 25 m, and first and second graphene layers sandwiching the copper layer. The first graphene layer of a first composite structure among the plurality of composite structures directly contacts a second graphene layer of a second composite structure among the plurality of composite structures to form a graphene bi-layer structure. Either the first or second graphene layer of the graphene bi-layer structure comprises silver atoms, but not both. The silver atoms are ring-centered on graphene rings and delocalized inside the graphene rings.