A structure for creating a sealed wire bundle includes a first adhesive material in the form of a circular or semi-circular shape. The first adhesive material has a first outer wall with first spoke arms extending inward from the first outer wall. The first adhesive material has a first viscosity. First wire receiving spaces are provided between the first spoke arms. Wires are positioned in the first wire receiving spaces. As heat is applied to the adhesive structure, the adhesive structure flows to fill voids between the plurality of wires to thereby seal the wires.

A method of manufacturing a wiring harness assembly includes the steps of forming a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, forming an opening in the substrate located and sized such that a section of the plurality of electrically conductive wires is exposed within the opening, disposing a support segment within the opening, securing a connector segment including a plurality of terminals to the support segment, and placing the plurality of terminals in mechanical and electrical contact with the plurality of electrically conductive wires.

A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa.Math.s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.

The present invention provides a connection structure and a manufacturing method therefor capable of increasing reliability of a connection part compared to the prior arts. A connection structure according to the present invention includes a plurality of conductive members, a connection part that electrically connects the conductive members, and an electrically insulating molded body in which the connection part is embedded. It is thereby possible to physically reinforce the connection part of the conductive members, keep the connection part in a hermetically sealed condition, thereby prevent corrosion and increase reliability compared to the prior arts.

A flat cable includes: a plurality of conductors arranged in parallel; an insulating layer formed, on first surfaces of the plurality of conductors and on second surfaces that are opposite surfaces of the first surfaces, along the plurality of conductors; an exposed portion where the first surfaces at end portions of the conductors are exposed to outside; and a reinforcement plate formed on the second surfaces opposite to the exposed portion. On the second surfaces opposite to the exposed portion, the reinforcement plate is directly formed on the conductors, and on the second surfaces opposite to the first surfaces that are in continuous with the exposed portion, the reinforcement plate is formed between the conductors and the insulating layer on the second surfaces.

The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and a plurality of conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly may further include an electrode assembly formed on the supporting structure at the distal end of the cable. The electrode assembly includes one or more electrodes in electrical connection with one or more conductive traces of the plurality of conductive traces.

A water-stop structure for electrical wire includes: a terminal including an electrical wire connection portion; and an electrical wire in which an outer circumference of a conductor including a plurality of single wires is coated with an insulation coating portion and which is swaged to be fixed to the electrical wire connection portion, a water-stop agent being filled into a gap in the insulation coating portion to thereby perform water stop in the electrical wire. The water-stop agent includes a fluorescent agent.

Continuously transposed conductor (“CTC”) cables are described. A CTC cable may include a plurality of electrically insulated strands connected in parallel at their ends. Additionally, each strand may include one or more conductors and an extruded insulation layer formed at least partially around the one or more conductors.

A wire harness assembly and a method of forming such a wire harness assembly is presented. The wire harness assembly includes a plurality of wire cables and a wire support defining elongate slots having open and closed ends. The cables are disposed within the slots. Retaining teeth are defined by side walls of the slots and are configured to separate one wire cable from another wire cable in the same slot. The wire harness assembly also includes a slug formed of a moldable material that encases the wire support. The slug also encases a portion of each of the wire cables. The wire harness assembly further includes a grommet encircling the slug. The slug may be formed by disposing the cables within the slots of the wire support, arranging the wire support and the cables in a mold, injecting a moldable material into the mold, and curing the moldable material.

A manufacturing method of an embedded metal mesh flexible transparent electrode and application thereof; the method includes: directly printing a metal mesh transparent electrode on a rigid substrate by using an electric-field-driven jet deposition micro-nano 3D printing technology; performing conductive treatment on a printed metal mesh structure through a sintering process to realize conductivity of the metal mesh; respectively heating a flexible transparent substrate and the rigid substrate to set temperatures; completely embedding the metal mesh structure on the rigid substrate into the flexible transparent substrate through a thermal imprinting process; and separating the metal mesh completely embedded into the flexible transparent substrate from the rigid substrate to obtain the embedded metal mesh flexible transparent electrode. The mass production of the large-size embedded metal mesh flexible transparent electrode with low cost and high throughput by combining the electric-field-driven jet deposition micro-nano 3D printing technology with the roll-to-plane thermal imprinting technology.