A cable, in particular a data cable, extends in a longitudinal direction and has a number of lines and a structural element extending in the longitudinal direction for stiffening the cable. The lines are embedded in the structural element. Here, the lines and the structural element are surrounded by a common shield made of a conductive material. Due to the special arrangement of the shield, a particularly compact structure can be provided. A method for producing the cable is also provided.

The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and a plurality of conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly may further include an electrode assembly formed on the supporting structure at the distal end of the cable. The electrode assembly includes one or more electrodes in electrical connection with one or more conductive traces of the plurality of conductive traces.

An assembled wire, having: an assembled conductor composed of a plurality of conductor strands each having a rectangular cross-section, stacked and arranged each other across an interlayer insulating layer; an insulating outer layer that coats the assembled conductor including the interlayer insulating layer; and an adhesion layer composed of a thermoplastic resin having a thickness of 3 m or more and 10 m or less between the assembled conductor and the insulating outer layer.

Provided is a method of preparing a thin film structure having anisotropic, transparent, electroconductive, flexible properties. The method of preparing a thin film structure includes providing a growth substrate; growing silver nanolines on the growth substrate by using a lightning-rod effect; molding the silver nanolines by using a polymer; and separating the silver nanolines molded by the polymer from the growth substrate to form a freestanding anisotropic, transparent, electroconductive, and flexible thin film.

A cable including a conductor surrounded by a covering layer, the covering layer formed from a thermoplastic vulcanizate composition which includes a continuous phase and a dispersed phase. The continuous phase is formed of a thermoplastic polyolefin. The dispersed phase is formed of a cross-linked elastomeric polyolefin. The thermoplastic vulcanizate composition passes the Hot Creep Test at 150 C. in accordance with UL 2556 (2013) and has a dielectric loss of 3 or less. Methods of forming cables with coverings are also disclosed.

A flex flat cable (FFC) is proposed. The FFC comprises a plurality of first signal transmitting lines arranged in parallel with one another. Each of the plurality of first signal transmitting lines comprises a first transmitting conductor configured to transmit a signal, a first insulating layer enclosing the first transmitting conductor, and a second insulating layer, enclosing the first insulating layer. The FFC further includes a first insulating coat enclosing the plurality of first signal transmitting lines, a first ground conductor arranged at one side of the first insulating coat and configured to be grounded, a metallic shielding layer enclosing the first insulating coat and the first ground conductor and a second insulating coat enclosing the metallic shielding layer, and a second insulating coat enclosing the metallic shielding layer.

The first ground conductor contacts the metallic shielding layer.

The present invention relates to a polymer composition, to the use of the composition for producing an electrical device, as well as to a cable surrounded by at least one layer including the polymer composition.

Provided is a method of preparing a thin film structure having anisotropic, transparent, electroconductive, flexible properties. The method of preparing a thin film structure includes providing a growth substrate; growing silver nanolines on the growth substrate by using a lightning-rod effect; molding the silver nanolines by using a polymer; and separating the silver nanolines molded by the polymer from the growth substrate to form a freestanding anisotropic, transparent, electroconductive, and flexible thin film.

Provided is a method to form a thermoplastic composite with electrically and thermally conductive constituents. The method may include receiving a molten rod having a polymer composite core. The method may further include embedding the rod with at least one conductive wire. Embedding the rod with the at least one wire may include wrapping the at least one conductive wire around the rod and tensioning the wire thereby causing the wire to at least partially embed into the rod.

A method of fabricating a composite conductive film is provided. The method includes providing, as a matrix, a layer of cross-linkable polymer, where the cross-linkable polymer is in a non-cross-linked state. The method further includes introducing inorganic nanowires upon a surface of the layer of cross-linkable polymer. The inorganic nanowires are, in isolated form, characterized by a first conductivity stability temperature. The method further includes embedding at least some of the inorganic nanowires into the layer of cross-linkable polymer to form an inorganic mesh, thereby forming the composite conductive film. The method further includes cross-linking the polymer within a surface portion of the composite conductive film. Cross-linking the polymer within the surface portion of the composite conductive film results in the surface portion having a second conductivity stability temperature that is greater than the first conductivity stability temperature.