A high-temperature heterostructure conductor includes an electrically conductive heterostructure core, a second electrically conductive material, a ceramic layer and a dielectric layer. The electrically conductive heterostructure core includes a first electrically conductive material and an intermetallic layer that is formed on and surrounds the first electrically conductive material. The second electrically conductive material surrounds the intermetallic layer. The ceramic layer is formed or disposed on and surrounds the second electrically conductive material. The dielectric layer is disposed on and surrounding the ceramic layer.

A structure for creating a sealed wire bundle includes a first adhesive material in the form of a circular or semi-circular shape. The first adhesive material has a first outer wall with first spoke arms extending inward from the first outer wall. The first adhesive material has a first viscosity. First wire receiving spaces are provided between the first spoke arms. Wires are positioned in the first wire receiving spaces. As heat is applied to the adhesive structure, the adhesive structure flows to fill voids between the plurality of wires to thereby seal the wires.

According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

An insulated conductor including: at least one electrical conductor; and, an insulating coating covering said electrical conductor, having n layer(s), “n” being an integer greater than or equal to 1, the n.sup.th layer being the outermost layer having a pseudo-amorphous composition C.sub.n including at least 50% by weight of a polyaryletherketone. A process for manufacturing the insulated conductor, a heat-welding process using two sections of insulated conductor, and a coil capable of being obtained by heat-welding a winding of the insulated conductor.

A method for manufacturing an electrical harness comprising a reference member and a secondary member and at least one electric wire, a protective sheath and at least two shrink sleeves comprising a reference shrink sleeve and a secondary shrink sleeve. According to the disclosure, the method comprises at least the following steps: assembling of the electric wire, the protective sheath, the two shrink sleeves, the reference member and the secondary member, the two shrink sleeves being arranged in a non-contracted state; in a reference portion of the electrical harness, reference contraction of the reference shrink sleeve; in a secondary portion of the electrical harness, angular positioning of the secondary member according to a relative angular orientation; holding of the secondary member in position; and secondary contraction of the secondary shrink sleeve.

A composition comprises one or more continuous fibers embedded in a high temperature superconducting material.

A power cable has a cable core with at least one conductor with an insulating system and a water barrier surrounding the cable core. The water barrier has a helically wound strength bearing layer interconnected by a low melting point material.

A conductive composition has excellent adhesiveness to a substrate and conductivity. For example, a conductive composition contains copper powder, cuprous oxide, a lead-free glass frit, and a carboxylic acid-based additive. The cuprous oxide is contained in an amount of at least 5.5 parts by mass and up to 25 parts by mass relative to 100 parts by mass of the copper powder. The lead-free glass frit contains a borosilicate zinc-based glass frit and a vanadium zinc-based glass frit. The borosilicate zinc-based glass frit contains boron oxide, silicon oxide, zinc oxide, and optional other components, among which boron oxide, silicon oxide, and zinc oxide serve as top-three oxide components in terms of content. The vanadium zinc-based glass frit contains vanadium oxide, zinc oxide, and optional other components, among which vanadium oxide and zinc oxide serve as top-two oxide components in terms of content.

The present invention is a phenol compound represented by the following general formula (1A). This phenol compound makes it possible to provide a phenol compound as an additive for a conductive paste composition having a small decrease in electric conductivity in repetitive elongations and shrinkages and excellent printing processability, a conductive paste composition containing the additive, and a conductive wire made by using the conductive paste composition.

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A system for removing a foil shield from a cable comprises an induction coil for inductively heating the foil shield of the cable, a cable feeding device for selectively passing the cable through the induction coil, a cutting blade for selectively removing at least a portion of the cable, and a sensor for detecting at least one characteristic of the cable.