A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt. % gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

Methods and devices are contemplated incorporating both high resistance conductive materials (HRCM) and conductors. A HRCM is deposited on a conductor, such that the surface between the HRCM and the conductor is relatively smooth. A dielectric material is then deposited onto an exposed surface of the HRCM. The surface of the HRCM meeting the dielectric material is roughed or otherwise impressed such that it has a Ra of at least 5 μm. The ratio of resistivity between the HRCM and the conductor is at least 50:1 or 100:1, and the ratio of conductivity between the conductive material and the resistive material is at least 9:1, 19:1, or 99:1.

A wearable, nanoconductor technology for smart electronic applications. A novel nano-scale geometry is achieved for nanoconductor circuits on the order of the size of a single thread or smaller, which are easily integrated with clothing and provide smart applications for wearable electronics. The nano-scale fibers provide improved material characteristics and the fixed geometry and orientation of the nanoconductor structures allow easier interface of nanoconductor electronics integrated with the clothing or with electronics external to the weave of the clothing. Novel electronic circuits based on the size and fixed geometries of the nanoconductor fibers which allow configurable functions that can be employed for different uses through logic circuit configuration or serial programming during wear are disclosed.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)
0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)
The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

A manufacturing method of an anisotropic conductive film and an apparatus thereof are provided. The manufacturing method of an anisotropic conductive film includes steps of: (a) providing a first substrate having metal contacts; (b) disposing a resin layer on the first substrate and covering the metal contacts; (c) providing a press head having a suction pattern arranged corresponding to the metal contacts; (d) sucking the conductive particles by the press head; and (e) pressing the conductive particles into the resin layer by the press head. The conductive particles are disposed corresponding to the metal contacts of the substrate, so that the problem about the short circuit between contacts can be improved, and the product yield and reliability can also be improved.

An electrical connection member (1, 301, 401, 501, 601) includes a clad material (10, 110, 610) including at least both a first Cu layer (12) made of a Cu material and a low thermal expansion layer (11) made of an Fe material or Ni material having an average thermal expansion coefficient from room temperature to 300° C. smaller than that of the first Cu layer, the first Cu layer and the low thermal expansion layer being bonded to each other.

A method for manufacturing a laminated bus bar includes a first base member forming process of forming a plurality of first through-holes in a conductive flat plate-shaped first base member, a second base member forming process of forming a conductive flat plate-shaped second base member, a laminating process of forming a laminated body configured by laminating and fixing flat surfaces of the first base member and the second base member on and to each other, and a punching process of forming, in the second base member of the laminated body, second through-holes forming pairs with the first through-holes, the second through-holes being smaller than the first through-holes in portions overlapping with the first through-holes in a lamination direction of the first base member and the second base member.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).

0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)

0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)

The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.

Disclosed is a method of manufacturing a transmission line using a nanostructured material and a method of manufacturing the transmission line. The transmission line using a nanostructured material includes a first nanoflon layer formed of nanoflon, a first insulating layer located above the first nanoflon layer, a first pattern formed by etching a first conductive layer formed on the first insulating layer, and a first ground layer located below the first nanoflon layer. Here, the nanoflon is a nanostructured material formed by electrospinning a liquid resin at a high voltage.