Patent classifications
H01B13/0026
Composite, carbon composite including the composite, electrode, lithium battery, electroluminescent device, biosensor, semiconductor device, and thermoelectric device including the composite and/or the carbon composite
A composite including: silicon (Si); a silicon oxide of the formula SiOx, wherein 0<x<2; and a graphene disposed on the silicon oxide.
Ultra-conductive wires and methods of forming thereof
Ultra-conductive wires having enhanced electrical conductivity are disclosed. The conductivity of an ultra-conductive wire is enhanced using cold wire drawing and annealing. Methods of making the ultra-conductive wires are further disclosed.
Methods and Systems for Fabricating High Quality Superconducting Tapes
An MOCVD system fabricates high quality superconductor tapes with variable thicknesses. The MOCVD system can include a gas flow chamber between two parallel channels in a housing. A substrate tape is heated and then passed through the MOCVD housing such that the gas flow is perpendicular to the tape's surface. Precursors are injected into the gas flow for deposition on the substrate tape. In this way, superconductor tapes can be fabricated with variable thicknesses, uniform precursor deposition, and high critical current densities.
INKS CONTAINING METAL PRECURSORS NANOPARTICLES
Provided herein are novel ink formulations based on metal salts and metal complexes.
Conductive transparent film
The present application relates to a conductive transparent film. The conductive transparent film comprises an undercoating layer, an anti-crack buffer layer, and a conductive layer. The conductive transparent film may have not only excellent mechanical strength, but also have a fast response speed when applied to a touch panel.
ELECTRICALLY CONDUCTIVE COMPOSITION, METHOD FOR PRODUCING CONDUCTOR, AND METHOD FOR FORMING WIRING OF ELECTRONIC COMPONENT
A conductive composition has excellent adhesiveness to a substrate and conductivity. For example, a conductive composition contains copper powder, cuprous oxide, a lead-free glass frit, and a carboxylic acid-based additive. The cuprous oxide is contained in an amount of at least 5.5 parts by mass and up to 25 parts by mass relative to 100 parts by mass of the copper powder. The lead-free glass frit contains a borosilicate zinc-based glass frit and a vanadium zinc-based glass frit. The borosilicate zinc-based glass frit contains boron oxide, silicon oxide, zinc oxide, and optional other components, among which boron oxide, silicon oxide, and zinc oxide serve as top-three oxide components in terms of content. The vanadium zinc-based glass frit contains vanadium oxide, zinc oxide, and optional other components, among which vanadium oxide and zinc oxide serve as top-two oxide components in terms of content.
Method for producing a coated substrate
The subject of the invention is a process for obtaining a substrate provided on at least one portion of at least one of its sides with a coating, comprising a step of depositing said coating on said substrate, then a step of heat treatment of said coating using a pulsed or continuous laser radiation focused on said coating in the form of at least one laser line, the wavelength of which is within a range extending from 400 to 1500 nm, said heat treatment being such that a relative displacement movement is created between the substrate and the or each laser line, the speed of which is at least 3 meters per minute, the or each laser line having a beam quality factor (BPP) of at most 3 mm.Math.mrad and, measured at the place where the or each laser line is focused on said coating, a linear power density divided by the square root of the duty cycle of at least 200 W/cm, a length of at least 20 mm and a width distribution along the or each line such that the mean width is at least 30 micrometers and the difference between the largest width and the smallest width is at most 15% of the value of the mean width.
MULTILAYER FILM FOR PACKAGING AND METHOD OF MANUFACTURE THEREOF
Disclosed is a multilayer film for packaging. The multilayer film comprises a layer of ink and an adjacent layer of substrate. The layer of ink includes functionalised graphene and a material selected from cellulose, polylactic acid and a polyhydroxyalkanoate.
MGB2 SUPERCONDUCTIVE THIN FILM WIRE MATERIAL AND PRODUCTION METHOD THEREFOR
Provided is an MgB.sub.2 superconductive thin film wire material allowing for lower costs while maintaining superconductive properties that are equal to or greater than those of the MgB.sub.2 superconductive thin film wire material of prior art, and to provide a production method for the superconductive thin film wire material. The MgB.sub.2 superconductive thin film wire material according to the present invention is a superconductive wire material comprising an MgB.sub.2 thin film formed over an elongated metal base material, characterized in that the MgB.sub.2 thin film exhibits a critical temperature of 30 K or higher, and has a microscopic organization wherein MgB.sub.2 columnar crystal grains stand densely packed on the surface of the elongated metal base material, and a layer of Mg oxide is formed in such a manner as to surround the MgB.sub.2 columnar crystal grains in the grain boundary regions of the MgB.sub.2 columnar crystal grains.
Inks containing metal precursors nanoparticles
Provided are novel ink formulations based on metal salts and metal complexes. The formulations include a sole metal precursor in the form of metal salt nanoparticles dispersed in a medium. In addition, the metal salt nanoparticles may include an anion. The novel ink formulations may be used for producing conducting patterns.