[Object] To provide a method for producing an electrical wiring member having a layered structure of copper wiring and a blackening layer and to provide the electrical wiring member through a search for a material for the blackening layer, the material being etched at a rate close to that for the copper wiring under conditions where etching controllability is ensured. [Solution] A method for producing an electrical wiring member according to the present invention includes a step of forming, on at least one main surface of a substrate, a layered film 6 of a Cu layer 3 and CuNO-based blackening layers (2a and 2b); a step of forming a resist layer 4a in a predetermined region on the layered film 6; and a step of removing a partial region of the layered film 6 by bringing the layered film 6 into contact with an etchant.

A machining system includes an application device that applies a photocurable resin to surfaces of a plurality of linear objects provided in a workpiece; a curing device that brings the linear objects, to which the photocurable resin has been applied by the application device, into close contact with each other in radial directions and that radiates light onto the photocurable resin, which has been applied to the linear objects brought into close contact, thus curing the photocurable resin; and a machining device that machines the workpiece, in which the plurality of linear objects have been bound together through the curing of the photocurable resin performed by the curing device.

A composite transparent conducting film (TCF) on a substrate that includes a first region extending to a first depth of the TCF and having a higher density (lower porosity) than a second region of the TCF located at a different depth of the TCF. A method of forming the composite TCF includes applying a transparent conducting layer onto a substrate or onto a second layer previously formed on the substrate, and rapidly heating the transparent conducting layer resulting in a first region extending to a first depth of the transparent conducting layer that is at least partially melted and of a higher density (lower porosity) than a second region located at a different depth of the transparent conducting layer that is not melted, thereby forming a composite TCF that has a change of porosity in a thickness direction of the composite TCF.

The invention relates to a method for manufacturing a cable bundle. At least one provided first cable is completely coated circumferentially on an outer side of the insulating sheath of the first cable with a hot-melt adhesive. In a further step, the first cable is positioned so that it touches a provided second cable over at least a partial length of the cables. In a further step, at least one local adhesive connection is produced between the first cable and the second cable along a partial length of the cables by locally melting the hot-melt adhesive on the first cable.

An electrical conductor comprising a first layer, wherein the first layer is electrically conducting, and comprises micro protrusions, macro protrusions, wherein the micro protrusions are arranged on the macro protrusions, a first set of depressions, wherein the first set of depressions comprises at least two longitudinal depressions; the macro protrusions and the at least two longitudinal depressions are arranged in an alternating pattern, at least one coating layer, wherein the at least one coating layer comprises an electrically conducting polymer, touches the first layer, at least partially covers the first layer; wherein at least 50% of the macro protrusions have a width, measured along a first direction in the range of 2.0 mm to 40.0 mm and at least 50% of the micro protrusions have a width, measured along the first direction, in the range of 0.001 mm to 1.000 mm.

A water-stop structure for electrical wire includes: a terminal including an electrical wire connection portion; and an electrical wire in which an outer circumference of a conductor including a plurality of single wires is coated with an insulation coating portion and which is swaged to be fixed to the electrical wire connection portion, a water-stop agent being filled into a gap in the insulation coating portion to thereby perform water stop in the electrical wire. The water-stop agent includes a fluorescent agent.

A process for preparing an electrically conductive, adhesive tape that includes: (a) providing an article comprising a substrate and a network of electrically conductive metal traces defining cells that are transparent to visible light on the substrate; (b) embedding the network of electrically conductive traces in a polymer matrix having a surface on which a pressure sensitive adhesive is deposited; and (c) removing the substrate to form the electrically conductive, adhesive tape.

Aspects relate to patterned nanostructures having a feature size not including film thickness of below 5 microns. The patterned nanostructures are made up of nanoparticles having an average particle size of less than 100 nm. A nanoparticle composition, which, in some cases, includes a binder, is applied to a substrate. A patterned mold used in concert with electromagnetic radiation function to manipulate the nanoparticle composition in forming the patterned nanostructure. In some embodiments, the patterned mold nanoimprints a pattern onto the nanoparticle composition and the composition is cured through UV or thermal energy, Three-dimensional patterned nanostructures may be formed. A number of patterned nanostructure layers may be prepared and joined together. In some cases, a patterned nanostructure may be formed as a layer that is releasable from the substrate upon which it is initially formed. Such releasable layers may be arranged to form a three-dimensional patterned nanostructure for suitable applications.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)
0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2) The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

An electric wire manufacturing method includes: a step of placing a core wire including a plurality of strands inside a tubular jig; and a step of forming a joined portion that integrates the strands by emitting laser light along an axial direction of the core wire toward a tip of the core wire placed inside the jig. In the placing step, the core wire is placed with a gap between an inner wall surface of the jig and an outer circumferential surface of the core wire while the tip of the core wire faces upward relative to a horizontal line. In the step of forming the joined portion, the joined portion is formed by filling the gap with a melted substance of the strands.