A magnet wire including a conductor and an insulating coating formed on an outer periphery of the conductor. The insulating coating contains a copolymer containing a tetrafluoroethylene unit and a fluoroalkyl vinyl ether unit. The copolymer has a melt flow rate of 10 to 60 g/10 min, and the copolymer has a fluoroalkyl vinyl ether unit content of 6.2 to 8.0% by mass based on a total content of monomer units.

Aspects relate to patterned nanostructures having a feature size not including film thickness below 5 microns. The patterned nanostructures are made up of nanoparticles having an average particle size less than 100 nm. A nanoparticle composition, which, in some cases, includes a binder material, is applied to a substrate. A patterned mold used in concert with electromagnetic radiation manipulate the nanoparticle composition in forming the patterned nanostructure. In some embodiments, the patterned mold nanoimprints a suitable pattern onto the nanoparticle composition and the composition is cured through UV or thermal energy. Three-dimensional patterned nanostructures may be formed. A number of patterned nanostructure layers may be prepared and joined together. In some cases, a patterned nanostructure may be formed as a layer that is releasable from the substrate upon which it is initially formed. Such releasable layers may be arranged to form a three-dimensional patterned nanostructure in accordance with suitable applications.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)
0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)
The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

Aspects relate to patterned nanostructures having a feature size not including film thickness of below 5 microns. The patterned nanostructures are made up of nanoparticles having an average particle size of less than 100 nm. A nanoparticle composition, which, in some cases, includes a binder material, is applied to a substrate. A patterned mold used in concert with electromagnetic radiation function to manipulate the nanoparticle composition in forming the patterned nanostructure. In some embodiments, the patterned mold nanoimprints a suitable pattern on to the nanoparticle composition and the composition is cured through UV or thermal energy. Three-dimensional patterned nanostructures may be formed. A number of patterned nanostructure layers may be prepared and suitably joined together. In some cases, a patterned nanostructure may be formed as a layer that is releasable from the substrate upon which it is initially formed. Such releasable layers may, in turn, be arranged to form a three-dimensional patterned nanostructure in accordance with suitable applications.

A photoirradiation device includes an insertion path for inserting a wire rod; a first reflector having a circular arc shape centered on a point shifted from a center of the insertion path by a first distance, one side of the first reflector facing the insertion path being a reflective surface; a second reflector disposed adjacent open edges of the first reflector and having a circular arc shape centered on a point shifted from the center of the insertion path by a second distance that is different from the first distance, one side of the second reflector facing the insertion path being a reflective surface; and a light source that is positioned on an opposite side of the insertion path from the first reflector and that projects light toward the wire rod.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).

0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)

0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)

The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

A method for forming an electrically conductive multi-layer coating with anti-corrosion properties and with a thickness comprised between 1 μm and 10 μm onto a metallic substrate, comprising the following subsequent steps of (a) providing a solvent-free suspension consisting of solid electrically conductive fillers dispersed into a liquid matrix forming material that contains vinyl groups; (b) depositing the suspension on at least a surface portion of a metallic substrate; (c) exposing an atmospheric pressure plasma to the surface portion so as to form one electrically conductive layer with anti-corrosion properties; and (d) repeating the steps (a), (b) and (c). The method is remarkable in that the electrically conductive fillers are electrically conductive carbon-based particles.

The invention generally provides a busbar for use in mechanically and electrically connecting components in a device. The busbar includes a plurality of conductors arranged to provide two opposed end portions and an intermediate portion, wherein each of the conductors has a plurality of intermediate extents that traverse the intermediate portion. The intermediate portion including: (A) an unfused segment where no intermediate extents of the conductors are fused together to form a single consolidated conductor, and (B) a fused segment that includes (i) a partial solidification zone where a majority of the intermediate extents of the conductors are fused together to form a partially solidified region that provides a single consolidated conductor, (ii) a full solidification zone where all of intermediate extents of the conductors are fused together to form a fully solidified region that provides a single consolidated conductor, and (iii) an unsolidified region where all of the intermediate extents of the conductors are not fused together.

The present disclosure relates to neuromodulation electrodes, and in particular, to neuromodulation electrodes having a platinum/iridium surface etched with a pattern and methods of laser etching the pattern into the platinum/iridium surface of the neuromodulation electrodes to improve performance of the neuromodulation electrodes. Particularly, aspects are directed to an electrode including a base body having: (i) an interface surface that has an area of less than 50 mm.sup.2, and (ii) an alloy including platinum and iridium. The interface surface has a surface topography including: (i) an artificial pattern, and (ii) a surface roughness having an arithmetical mean height (R.sub.a) of greater than 0.8 m.

A laser processing device for processing shielded conductors includes a processing chamber configured to process an end portion of a shielded conductor disposed therein using laser radiation. The processing chamber has a housing defining an opening. In a processing position of the laser processing device, the end portion of the shielded conductor is inserted along an insertion axis into the opening and extends into the processing chamber. A gripping device is configured to fix the shielded conductor in the opening in the processing position of the laser processing device. In the processing position of the laser processing device, the gripping device is positioned at the housing without contact therebetween. The gripping device includes a first projection portion which extends at least partially into the opening along the insertion axis in the processing position of the laser processing device.