H01B13/30

Device and Method for Producing Enameled Wires
20220165455 · 2022-05-26 ·

A device (1) and a method for producing enameled wires, comprises an application device (3) for applying at least one enamel coating, a furnace (4) for solidifying the enamel coating and an exhaust gas purification device (7) for removing at least nitrogen oxides from an exhaust gas (9) of the furnace (4). The exhaust gas purification device (7) has a unit (13) for the selective catalytic reduction of nitrogen oxides in the exhaust gas (9) of the furnace and a feeding apparatus (11) for feeding a reducing agent, preferably an ammonia-containing compound, in particular a urea solution, into the exhaust gas (9) of the furnace (4). The feeding apparatus (11) has at least one outlet opening, which is designed in such a way that the reducing agent exits from the outlet opening substantially in the flow direction of the exhaust gas (9).

WIRE COATING DEVICE AND METHOD
20220157496 · 2022-05-19 ·

A wire coating device and method are provided. The wire coating device includes a wire holder unit fixing both ends of a wire, a fiber forming unit including a first fiber forming module and a second fiber forming module that are applied with a polymer solution, face each other, and form fibers while approaching each other and retreating from each other, and a control unit adjusting a tension of the wire by controlling the wire holder unit and crossing the wire and the fibers by controlling the fiber forming unit. The fiber forming unit spins the wire using a longitudinal direction of the wire as an axis. The fibers are attached and coated on the wire when the wire and the fibers cross each other. The wire coating method can improve an adsorption state of coated fibers by including a post-processing step.

WIRE COATING DEVICE AND METHOD
20220157496 · 2022-05-19 ·

A wire coating device and method are provided. The wire coating device includes a wire holder unit fixing both ends of a wire, a fiber forming unit including a first fiber forming module and a second fiber forming module that are applied with a polymer solution, face each other, and form fibers while approaching each other and retreating from each other, and a control unit adjusting a tension of the wire by controlling the wire holder unit and crossing the wire and the fibers by controlling the fiber forming unit. The fiber forming unit spins the wire using a longitudinal direction of the wire as an axis. The fibers are attached and coated on the wire when the wire and the fibers cross each other. The wire coating method can improve an adsorption state of coated fibers by including a post-processing step.

COPPER-ANF COMPOSITE CONDUCTOR FABRICATION
20230260680 · 2023-08-17 ·

A method of fabricating a conductor includes preparing an aramid nanofiber solution in which a matrix of aramid nanofibers is dispersed, preparing a dispersion of copper nanoparticles, each copper nanoparticle of the dispersion of cooper nanoparticles having an organic capping ligand attached to the copper nanoparticle, and incorporating copper nanoparticles of the dispersion of copper nanoparticles into the matrix of aramid nanofibers such that each incorporated copper nanoparticle is bonded to a respective aramid nanofiber of the matrix of aramid nanofibers via the organic capping ligand to which the copper nanoparticle is attached. The organic capping ligand may include a mercaptocarboxyiic acid.

COPPER-ANF COMPOSITE CONDUCTOR FABRICATION
20230260680 · 2023-08-17 ·

A method of fabricating a conductor includes preparing an aramid nanofiber solution in which a matrix of aramid nanofibers is dispersed, preparing a dispersion of copper nanoparticles, each copper nanoparticle of the dispersion of cooper nanoparticles having an organic capping ligand attached to the copper nanoparticle, and incorporating copper nanoparticles of the dispersion of copper nanoparticles into the matrix of aramid nanofibers such that each incorporated copper nanoparticle is bonded to a respective aramid nanofiber of the matrix of aramid nanofibers via the organic capping ligand to which the copper nanoparticle is attached. The organic capping ligand may include a mercaptocarboxyiic acid.

METHOD OF MANUFACTURING AN ELECTROMAGNETIC WAVE SHIELDING FILM COMPRISING AN ELECTROMAGNETIC WAVE SHIELDING LAYER

Provided is a method for manufacturing an electromagnetic interference shielding film comprising an electromagnetic interference shielding layer, the method comprising the steps of: preparing a metal nanoplate solution comprising a solvent in which metal nanoplates are dispersed; and coating the metal nanoplate solution on a substrate.

METHOD OF MANUFACTURING AN ELECTROMAGNETIC WAVE SHIELDING FILM COMPRISING AN ELECTROMAGNETIC WAVE SHIELDING LAYER

Provided is a method for manufacturing an electromagnetic interference shielding film comprising an electromagnetic interference shielding layer, the method comprising the steps of: preparing a metal nanoplate solution comprising a solvent in which metal nanoplates are dispersed; and coating the metal nanoplate solution on a substrate.

NOBLE METAL COATED SILVER NANOWIRES

Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

NOBLE METAL COATED SILVER NANOWIRES

Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

FILM FORMING DEVICE, MIST FILM FORMING DEVICE, AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE FILM
20230307157 · 2023-09-28 · ·

A deposition apparatus that supplies mist to a front surface of an object and deposits a film made of a material substance containing the mist on the front surface of the object, the deposition apparatus comprising a mist supplying section that includes: a mist generating section that generates the mist; an inlet port that introduces the mist generated by the mist generating section into a space; and a supply port that supplies the mist from the space to the front surface of the object, wherein the supply port is provided at a different position than the inlet port in a first direction, in a first prescribed plane that includes the supply port where the first direction and a second direction intersect and that has the mist pass therethrough.